JP2003532306A - リソグラフィ・プロセス制御のための方法およびシステム - Google Patents

リソグラフィ・プロセス制御のための方法およびシステム

Info

Publication number
JP2003532306A
JP2003532306A JP2001580732A JP2001580732A JP2003532306A JP 2003532306 A JP2003532306 A JP 2003532306A JP 2001580732 A JP2001580732 A JP 2001580732A JP 2001580732 A JP2001580732 A JP 2001580732A JP 2003532306 A JP2003532306 A JP 2003532306A
Authority
JP
Japan
Prior art keywords
wafer
resist
module
property
parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001580732A
Other languages
English (en)
Japanese (ja)
Inventor
ラッカプラガダ，サレッシュ
ブラウン，カイル・エイ
ハンキンソン，マット
レビイ，アディ
Original Assignee
ケーエルエー・テンコール・テクノロジーズ・コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ケーエルエー・テンコール・テクノロジーズ・コーポレーション filed Critical ケーエルエー・テンコール・テクノロジーズ・コーポレーション
Publication of JP2003532306A publication Critical patent/JP2003532306A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2001580732A 2000-05-04 2001-05-04 リソグラフィ・プロセス制御のための方法およびシステム Pending JP2003532306A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20237200P 2000-05-04 2000-05-04
US60/202,372 2000-05-04
PCT/US2001/014367 WO2001084382A1 (en) 2000-05-04 2001-05-04 Methods and systems for lithography process control

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011189697A Division JP6032875B2 (ja) 2000-05-04 2011-08-31 リソグラフィ・プロセス制御のための方法およびシステム

Publications (1)

Publication Number Publication Date
JP2003532306A true JP2003532306A (ja) 2003-10-28

Family

ID=22749596

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2001580732A Pending JP2003532306A (ja) 2000-05-04 2001-05-04 リソグラフィ・プロセス制御のための方法およびシステム
JP2011189697A Expired - Lifetime JP6032875B2 (ja) 2000-05-04 2011-08-31 リソグラフィ・プロセス制御のための方法およびシステム
JP2012075834A Expired - Lifetime JP6032913B2 (ja) 2000-05-04 2012-03-29 リソグラフィ・プロセス制御のための方法およびシステム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2011189697A Expired - Lifetime JP6032875B2 (ja) 2000-05-04 2011-08-31 リソグラフィ・プロセス制御のための方法およびシステム
JP2012075834A Expired - Lifetime JP6032913B2 (ja) 2000-05-04 2012-03-29 リソグラフィ・プロセス制御のための方法およびシステム

Country Status (3)

Country Link
US (5) US6689519B2 (enExample)
JP (3) JP2003532306A (enExample)
WO (1) WO2001084382A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
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JP2004006895A (ja) * 2002-05-30 2004-01-08 Agere Systems Inc スキャタロメトリ識別法を利用したオーバーレイ測定
JP2007517400A (ja) * 2003-12-24 2007-06-28 ラム　リサーチ　コーポレーション 統合又は独立計測を用いる改善されたウェーハ均一性のための処理制御方法及び装置
JP2009141352A (ja) * 2007-12-05 2009-06-25 Brion Technologies Inc リソグラフィプロセスウィンドウをシミュレートするための方法及びシステム
JP2010278204A (ja) * 2009-05-28 2010-12-09 Oki Semiconductor Co Ltd レジストパターンの形成方法
JP2012253336A (ja) * 2011-05-25 2012-12-20 Asml Netherlands Bv 計算プロセス制御
JP2014515885A (ja) * 2011-04-22 2014-07-03 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィ機のクラスタのためのネットワークアーキテクチャおよびプロトコル
KR101433391B1 (ko) 2008-02-25 2014-08-26 도쿄엘렉트론가부시키가이샤 기판의 처리방법, 컴퓨터 기억매체 및 기판처리 시스템

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