JP2003527971A5 - - Google Patents
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- Publication number
- JP2003527971A5 JP2003527971A5 JP2001569928A JP2001569928A JP2003527971A5 JP 2003527971 A5 JP2003527971 A5 JP 2003527971A5 JP 2001569928 A JP2001569928 A JP 2001569928A JP 2001569928 A JP2001569928 A JP 2001569928A JP 2003527971 A5 JP2003527971 A5 JP 2003527971A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- joint
- intermediate layer
- agent
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20000657A FI108376B (fi) | 2000-03-21 | 2000-03-21 | Menetelmõ sõhk÷õjohtavan liitoksen muodostamiseksi |
| FI20000657 | 2000-03-21 | ||
| PCT/FI2001/000281 WO2001071852A1 (en) | 2000-03-21 | 2001-03-21 | Method for making an electroconductive joint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003527971A JP2003527971A (ja) | 2003-09-24 |
| JP2003527971A5 true JP2003527971A5 (enExample) | 2008-02-07 |
Family
ID=8557990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001569928A Abandoned JP2003527971A (ja) | 2000-03-21 | 2001-03-21 | 導電性接合部作成方法 |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US6772936B2 (enExample) |
| EP (1) | EP1266430B1 (enExample) |
| JP (1) | JP2003527971A (enExample) |
| KR (1) | KR100734189B1 (enExample) |
| CN (1) | CN1196232C (enExample) |
| AT (1) | ATE349781T1 (enExample) |
| AU (2) | AU4839801A (enExample) |
| BG (1) | BG65249B1 (enExample) |
| BR (1) | BR0109307A (enExample) |
| CA (1) | CA2403864C (enExample) |
| DE (1) | DE60125521T2 (enExample) |
| EA (1) | EA004489B1 (enExample) |
| FI (1) | FI108376B (enExample) |
| MX (1) | MXPA02009127A (enExample) |
| PL (1) | PL202272B1 (enExample) |
| WO (1) | WO2001071852A1 (enExample) |
| ZA (1) | ZA200207286B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080217042A1 (en) * | 2007-03-05 | 2008-09-11 | Judson Ward M | Method for making rail bonds |
| US20090004500A1 (en) * | 2007-06-26 | 2009-01-01 | Daewoong Suh | Multilayer preform for fast transient liquid phase bonding |
| DE102008054415A1 (de) * | 2008-12-09 | 2010-06-10 | Robert Bosch Gmbh | Anordnung zweier Substrate mit einer SLID-Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung |
| US8348139B2 (en) * | 2010-03-09 | 2013-01-08 | Indium Corporation | Composite solder alloy preform |
| JP5643029B2 (ja) | 2010-08-30 | 2014-12-17 | 矢崎総業株式会社 | 電線端部の接合方法 |
| CN102489807A (zh) * | 2011-11-28 | 2012-06-13 | 苏州工业园区隆盛电器成套设备制造有限公司 | 一种轨道车辆用变压器的铜铜焊接工艺 |
| CN102489871A (zh) * | 2011-12-05 | 2012-06-13 | 贵研铂业股份有限公司 | 一种铜及铜合金的焊接方法 |
| JP6075465B2 (ja) * | 2014-01-07 | 2017-02-08 | 株式会社村田製作所 | 補修方法および補修材 |
| US9937575B2 (en) * | 2015-02-05 | 2018-04-10 | United Technologies Corporation | Brazed joints and methods of forming brazed joints |
| CN105834541A (zh) * | 2016-06-04 | 2016-08-10 | 北京工业大学 | 一种低温连接高温使用Cu/Sn/Cu钎焊界面的制备方法及结构 |
| CN108247238A (zh) * | 2017-12-11 | 2018-07-06 | 安徽宝辰机电设备科技有限公司 | 一种延长使用寿命紫铜用焊接剂及其使用方法 |
| DE102018217612A1 (de) * | 2018-10-15 | 2020-04-16 | Siemens Aktiengesellschaft | Verfahren zur elektrischen Kontaktierung eines supraleitenden Bandleiters |
| DE102020105154A1 (de) | 2020-02-27 | 2021-09-02 | Bayerische Motoren Werke Aktiengesellschaft | Verbindungsanordnung sowie Verfahren zum Herstellen einer Verbindungsanordnung |
| CN115041913B (zh) * | 2022-06-01 | 2024-04-30 | 中国社会科学院考古研究所 | 一种基于热分解还原的出土银器保护修复方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1389542A (en) * | 1971-06-17 | 1975-04-03 | Mullard Ltd | Methods of securing a semiconductor body to a support |
| US4497430A (en) * | 1982-09-20 | 1985-02-05 | Allied Corporation | Brazing method using homogeneous low melting point copper based alloys |
| US4678720A (en) | 1985-01-04 | 1987-07-07 | Gte Laboratories Incorporated | Silver-copper-titanium brazing alloy |
| DE3930859C2 (de) * | 1988-09-20 | 1997-04-30 | Schulz Harder Juergen | Verfahren zum Verlöten wenigstens zweier Elemente |
| EP0380200A1 (en) * | 1989-01-11 | 1990-08-01 | Sumitomo Special Metals Co., Ltd. | Composite foil brazing material |
| DE19638209A1 (de) * | 1996-09-19 | 1998-03-26 | Bosch Gmbh Robert | Hochschmelzende elektrisch leitende Verbindung und Verfahren zu deren Herstellung |
| JP3688429B2 (ja) * | 1997-04-25 | 2005-08-31 | 株式会社東芝 | 電子部品実装用基板および電子部品実装基板 |
| US6047876A (en) * | 1997-09-12 | 2000-04-11 | Materials Resources International | Process of using an active solder alloy |
| JP3335896B2 (ja) * | 1997-12-26 | 2002-10-21 | 株式会社東芝 | ハンダ材及びハンダ材の製造方法 |
| EP1081770B1 (en) * | 1999-09-01 | 2009-02-18 | Kaneka Corporation | Thin-film solar cell module and method of manufacturing the same |
| FI114691B (fi) * | 2000-02-23 | 2004-12-15 | Outokumpu Oy | Menetelmä kuparin ja ruostumattoman teräksen välisen liitoksen muodostamiseksi |
| FI109233B (fi) * | 2000-02-23 | 2002-06-14 | Outokumpu Oy | Jäähdytyselementti ja menetelmä jäähdytyselementin valmistamiseksi |
-
2000
- 2000-03-21 FI FI20000657A patent/FI108376B/fi not_active IP Right Cessation
-
2001
- 2001-03-21 US US10/239,322 patent/US6772936B2/en not_active Expired - Fee Related
- 2001-03-21 PL PL357723A patent/PL202272B1/pl not_active IP Right Cessation
- 2001-03-21 WO PCT/FI2001/000281 patent/WO2001071852A1/en not_active Ceased
- 2001-03-21 BR BR0109307-0A patent/BR0109307A/pt not_active IP Right Cessation
- 2001-03-21 EP EP01921402A patent/EP1266430B1/en not_active Expired - Lifetime
- 2001-03-21 DE DE60125521T patent/DE60125521T2/de not_active Expired - Lifetime
- 2001-03-21 AT AT01921402T patent/ATE349781T1/de not_active IP Right Cessation
- 2001-03-21 CN CNB018069002A patent/CN1196232C/zh not_active Expired - Fee Related
- 2001-03-21 AU AU4839801A patent/AU4839801A/xx active Pending
- 2001-03-21 MX MXPA02009127A patent/MXPA02009127A/es active IP Right Grant
- 2001-03-21 JP JP2001569928A patent/JP2003527971A/ja not_active Abandoned
- 2001-03-21 AU AU2001248398A patent/AU2001248398B2/en not_active Ceased
- 2001-03-21 KR KR1020027012423A patent/KR100734189B1/ko not_active Expired - Fee Related
- 2001-03-21 EA EA200200994A patent/EA004489B1/ru not_active IP Right Cessation
- 2001-03-21 CA CA2403864A patent/CA2403864C/en not_active Expired - Fee Related
-
2002
- 2002-09-11 ZA ZA200207286A patent/ZA200207286B/en unknown
- 2002-09-18 BG BG107123A patent/BG65249B1/bg unknown
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