BR0109307A - Método de fabricação de uma junta eletrocondutora - Google Patents

Método de fabricação de uma junta eletrocondutora

Info

Publication number
BR0109307A
BR0109307A BR0109307-0A BR0109307A BR0109307A BR 0109307 A BR0109307 A BR 0109307A BR 0109307 A BR0109307 A BR 0109307A BR 0109307 A BR0109307 A BR 0109307A
Authority
BR
Brazil
Prior art keywords
joint
welding
electroconductive
manufacturing
agent
Prior art date
Application number
BR0109307-0A
Other languages
English (en)
Inventor
Veikko Polvi
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Publication of BR0109307A publication Critical patent/BR0109307A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/26—Railway- or like rails
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Abstract

"MéTODO DE FABRICAçãO DE UMA JUNTA ELETROCONDUTORA". A presente invenção se refere a um método para produção de uma junta eletrocondutora, em conexão com trilhos condutores feitos de cobre ou liga de cobre, em cujo método, entre os elementos de trilhos condutores a serem unidos, é aplicado um agente de soldagem/solda forte, onde após, pelo menos uma área de junção é aquecida, de modo a se produzir uma junta. De acordo com o método, o agente de soldagem/solda forte empregado é uma lâmina metálica de agente de soldagem/solda forte (3) em camadas, compreendendo camadas superficiais (4, 6) e uma camada intermediária (5) entre as mesmas, em que a área de junção é termicamente tratada, de modo que é produzida uma junta de difusão.
BR0109307-0A 2000-03-21 2001-03-21 Método de fabricação de uma junta eletrocondutora BR0109307A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20000657A FI108376B (fi) 2000-03-21 2000-03-21 Menetelmõ sõhk÷õjohtavan liitoksen muodostamiseksi
PCT/FI2001/000281 WO2001071852A1 (en) 2000-03-21 2001-03-21 Method for making an electroconductive joint

Publications (1)

Publication Number Publication Date
BR0109307A true BR0109307A (pt) 2002-12-17

Family

ID=8557990

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0109307-0A BR0109307A (pt) 2000-03-21 2001-03-21 Método de fabricação de uma junta eletrocondutora

Country Status (17)

Country Link
US (1) US6772936B2 (pt)
EP (1) EP1266430B1 (pt)
JP (1) JP2003527971A (pt)
KR (1) KR100734189B1 (pt)
CN (1) CN1196232C (pt)
AT (1) ATE349781T1 (pt)
AU (2) AU2001248398B2 (pt)
BG (1) BG65249B1 (pt)
BR (1) BR0109307A (pt)
CA (1) CA2403864C (pt)
DE (1) DE60125521T2 (pt)
EA (1) EA004489B1 (pt)
FI (1) FI108376B (pt)
MX (1) MXPA02009127A (pt)
PL (1) PL202272B1 (pt)
WO (1) WO2001071852A1 (pt)
ZA (1) ZA200207286B (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080217042A1 (en) * 2007-03-05 2008-09-11 Judson Ward M Method for making rail bonds
US20090004500A1 (en) * 2007-06-26 2009-01-01 Daewoong Suh Multilayer preform for fast transient liquid phase bonding
DE102008054415A1 (de) * 2008-12-09 2010-06-10 Robert Bosch Gmbh Anordnung zweier Substrate mit einer SLID-Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung
US8348139B2 (en) * 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform
JP5643029B2 (ja) 2010-08-30 2014-12-17 矢崎総業株式会社 電線端部の接合方法
CN102489807A (zh) * 2011-11-28 2012-06-13 苏州工业园区隆盛电器成套设备制造有限公司 一种轨道车辆用变压器的铜铜焊接工艺
CN102489871A (zh) * 2011-12-05 2012-06-13 贵研铂业股份有限公司 一种铜及铜合金的焊接方法
JP6075465B2 (ja) * 2014-01-07 2017-02-08 株式会社村田製作所 補修方法および補修材
US9937575B2 (en) * 2015-02-05 2018-04-10 United Technologies Corporation Brazed joints and methods of forming brazed joints
CN105834541A (zh) * 2016-06-04 2016-08-10 北京工业大学 一种低温连接高温使用Cu/Sn/Cu钎焊界面的制备方法及结构
CN108247238A (zh) * 2017-12-11 2018-07-06 安徽宝辰机电设备科技有限公司 一种延长使用寿命紫铜用焊接剂及其使用方法
DE102018217612A1 (de) * 2018-10-15 2020-04-16 Siemens Aktiengesellschaft Verfahren zur elektrischen Kontaktierung eines supraleitenden Bandleiters
DE102020105154A1 (de) 2020-02-27 2021-09-02 Bayerische Motoren Werke Aktiengesellschaft Verbindungsanordnung sowie Verfahren zum Herstellen einer Verbindungsanordnung
CN115041913B (zh) * 2022-06-01 2024-04-30 中国社会科学院考古研究所 一种基于热分解还原的出土银器保护修复方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
US4497430A (en) * 1982-09-20 1985-02-05 Allied Corporation Brazing method using homogeneous low melting point copper based alloys
US4678720A (en) 1985-01-04 1987-07-07 Gte Laboratories Incorporated Silver-copper-titanium brazing alloy
DE3930859C2 (de) * 1988-09-20 1997-04-30 Schulz Harder Juergen Verfahren zum Verlöten wenigstens zweier Elemente
EP0380200A1 (en) * 1989-01-11 1990-08-01 Sumitomo Special Metals Co., Ltd. Composite foil brazing material
DE19638209A1 (de) * 1996-09-19 1998-03-26 Bosch Gmbh Robert Hochschmelzende elektrisch leitende Verbindung und Verfahren zu deren Herstellung
JP3688429B2 (ja) * 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
US6047876A (en) * 1997-09-12 2000-04-11 Materials Resources International Process of using an active solder alloy
JP3335896B2 (ja) * 1997-12-26 2002-10-21 株式会社東芝 ハンダ材及びハンダ材の製造方法
EP1081770B1 (en) * 1999-09-01 2009-02-18 Kaneka Corporation Thin-film solar cell module and method of manufacturing the same
FI109233B (fi) * 2000-02-23 2002-06-14 Outokumpu Oy Jäähdytyselementti ja menetelmä jäähdytyselementin valmistamiseksi
FI114691B (fi) * 2000-02-23 2004-12-15 Outokumpu Oy Menetelmä kuparin ja ruostumattoman teräksen välisen liitoksen muodostamiseksi

Also Published As

Publication number Publication date
BG65249B1 (bg) 2007-09-28
EA004489B1 (ru) 2004-04-29
CA2403864C (en) 2010-06-08
CN1196232C (zh) 2005-04-06
FI20000657A0 (fi) 2000-03-21
US20030038165A1 (en) 2003-02-27
KR100734189B1 (ko) 2007-07-02
JP2003527971A (ja) 2003-09-24
PL202272B1 (pl) 2009-06-30
EP1266430B1 (en) 2006-12-27
EA200200994A1 (ru) 2003-04-24
EP1266430A1 (en) 2002-12-18
US6772936B2 (en) 2004-08-10
DE60125521D1 (de) 2007-02-08
ZA200207286B (en) 2003-05-06
PL357723A1 (en) 2004-07-26
KR20020084231A (ko) 2002-11-04
FI20000657A (fi) 2001-09-22
ATE349781T1 (de) 2007-01-15
AU4839801A (en) 2001-10-03
BG107123A (en) 2003-05-30
CN1423848A (zh) 2003-06-11
CA2403864A1 (en) 2001-09-27
AU2001248398B2 (en) 2004-07-01
WO2001071852A1 (en) 2001-09-27
DE60125521T2 (de) 2007-07-05
MXPA02009127A (es) 2004-08-12
FI108376B (fi) 2002-01-15

Similar Documents

Publication Publication Date Title
BR0109307A (pt) Método de fabricação de uma junta eletrocondutora
BR0108538B1 (pt) método para a fabricação de uma junção entre cobre e aço inoxidável.
WO2003075322A3 (en) Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
SE7708518L (sv) Sett att framstella pleterade stalror
ATE66094T1 (de) Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen.
NO20070438L (no) Fremgangsmate for lodding av komposittmaterialdeler
BRPI0511207A (pt) processo de realização de uma estrutura multicamadas
EP0887859A3 (en) Integrated circuits with metallic fuses and method
MY124816A (en) Method of joining metal oilfield tubulars and well provided therewith
ES2176150T3 (es) Procedimiento para la fabricacion de un elemento compuesto altamente resistente a esfuerzos termicos.
JP2003504209A5 (pt)
SE9602438D0 (sv) A drill rod and method for its manufacturing
JP2003527971A5 (pt)
DE50008194D1 (de) Schichtverbund mit geschweisster Metalleinlage
BR0107803A (pt) Processo para a união de tubos de aço a nervuras de alumìnio
KR910016400A (ko) 금속제 다층튜브 및 그 제조방법
BR0109309A (pt) Método de fabricação de um elemento de resfriamento e elemento de resfriamento
DE60110117D1 (de) Hartlötvorformlinge und ihre verwendung bei der herstellung von wärmetauschern
LV11599A (lv) Materialu savienosanas panemiens ar difuzijas procesa palidzibu izmantojot sudraba-germanija sakausejumu un sudraba-germanija sakausejums izmantosanai saja panemiena
ES2150266T3 (es) Procedimiento de reduccion y de fusion de un metal.
DE60323314D1 (de) Metall-Keramik-Hochtemperatursupraleiterverbund und Verfahren zur Verbindung eines Keramikhochtemperatursupraleiters mit einem Metall
BR9607291A (pt) Processo de fabricar um mancal liso em multicamadas e respectivo mancal liso em multicamadas
ATE183428T1 (de) Verbundelement und verfahren zu dessen herstellung
ES2039673T3 (es) Procedimiento de lubrificacion de la superficie de piezas metalicas, de cobre o de aleaciones a base de hierro o de cobre, que deben ser deformadas en frio o en caliente y medios de lubrificacion utilizados.
BR9912601A (pt) Componente elétrico formado de metal laminado, adaptado para ser soldado em áreas de contato de um substrato de circuito e tendo um aspecto de parada de solda

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 11A ANUIDADE(S).

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2144 DE 07/02/2012.