JP2003527738A5 - - Google Patents

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Publication number
JP2003527738A5
JP2003527738A5 JP2000559058A JP2000559058A JP2003527738A5 JP 2003527738 A5 JP2003527738 A5 JP 2003527738A5 JP 2000559058 A JP2000559058 A JP 2000559058A JP 2000559058 A JP2000559058 A JP 2000559058A JP 2003527738 A5 JP2003527738 A5 JP 2003527738A5
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JP
Japan
Prior art keywords
temperature
heating element
heating
susceptor
set temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000559058A
Other languages
English (en)
Japanese (ja)
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JP2003527738A (ja
JP4533984B2 (ja
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Publication date
Priority claimed from US09/115,112 external-priority patent/US6225601B1/en
Application filed filed Critical
Publication of JP2003527738A publication Critical patent/JP2003527738A/ja
Publication of JP2003527738A5 publication Critical patent/JP2003527738A5/ja
Application granted granted Critical
Publication of JP4533984B2 publication Critical patent/JP4533984B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000559058A 1998-07-13 1999-07-13 加熱装置及びサセプタの温度を増加させる方法 Expired - Lifetime JP4533984B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/115,112 US6225601B1 (en) 1998-07-13 1998-07-13 Heating a substrate support in a substrate handling chamber
US09/115,112 1998-07-13
PCT/US1999/015852 WO2000002824A1 (en) 1998-07-13 1999-07-13 Heating a substrate support in a substrate handling chamber

Publications (3)

Publication Number Publication Date
JP2003527738A JP2003527738A (ja) 2003-09-16
JP2003527738A5 true JP2003527738A5 (https=) 2006-01-05
JP4533984B2 JP4533984B2 (ja) 2010-09-01

Family

ID=22359359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000559058A Expired - Lifetime JP4533984B2 (ja) 1998-07-13 1999-07-13 加熱装置及びサセプタの温度を増加させる方法

Country Status (7)

Country Link
US (1) US6225601B1 (https=)
EP (1) EP1097111B1 (https=)
JP (1) JP4533984B2 (https=)
KR (1) KR100638414B1 (https=)
DE (1) DE69906082T2 (https=)
TW (1) TW538010B (https=)
WO (1) WO2000002824A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277237A (ja) * 1999-03-24 2000-10-06 Komatsu Ltd 基板温度制御プレート及びそれを備える基板温度制御装置
US6521046B2 (en) * 2000-02-04 2003-02-18 Kabushiki Kaisha Kobe Seiko Sho Chamber material made of Al alloy and heater block
US6492625B1 (en) * 2000-09-27 2002-12-10 Emcore Corporation Apparatus and method for controlling temperature uniformity of substrates
JP2002158178A (ja) * 2000-11-21 2002-05-31 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US6962732B2 (en) * 2001-08-23 2005-11-08 Applied Materials, Inc. Process for controlling thin film uniformity and products produced thereby
WO2003041140A1 (en) * 2001-11-05 2003-05-15 Eugene Technology Co., Ltd. Apparatus of chemical vapor deposition
JP4059694B2 (ja) * 2002-03-27 2008-03-12 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US20110081137A1 (en) * 2009-10-06 2011-04-07 Advantest Corporation Manufacturing equipment and manufacturing method
JP2010283364A (ja) * 2010-07-15 2010-12-16 Sumitomo Electric Ind Ltd 半導体製造装置用保持体
JP5867255B2 (ja) * 2011-08-30 2016-02-24 株式会社デンソー 熱交換器、熱交換器ユニット、および熱交換器の取り付け方法
DE102013109155A1 (de) * 2013-08-23 2015-02-26 Aixtron Se Substratbehandlungsvorrichtung
WO2015112969A1 (en) 2014-01-27 2015-07-30 Veeco Instruments. Inc. Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
CN108728828A (zh) * 2017-04-20 2018-11-02 中微半导体设备(上海)有限公司 Cvd设备及其温度控制方法与发热体
CN113091315B (zh) * 2021-03-24 2022-07-19 青岛海尔空调器有限总公司 暖风机控制方法、装置、暖风机和存储介质

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115835A (https=) * 1974-07-31 1976-02-07 Kokusai Electric Co Ltd
JPS62295418A (ja) * 1986-06-16 1987-12-22 Ushio Inc レジスト処理方法
US4886954A (en) 1988-04-15 1989-12-12 Thermco Systems, Inc. Hot wall diffusion furnace and method for operating the furnace
US5536918A (en) * 1991-08-16 1996-07-16 Tokyo Electron Sagami Kabushiki Kaisha Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers
JP2786571B2 (ja) * 1992-07-07 1998-08-13 日本碍子株式会社 半導体ウエハー加熱装置
US5352294A (en) 1993-01-28 1994-10-04 White John M Alignment of a shadow frame and large flat substrates on a support
US5650082A (en) * 1993-10-29 1997-07-22 Applied Materials, Inc. Profiled substrate heating
EP0661732B1 (en) * 1993-12-28 2004-06-09 Applied Materials, Inc. A method of forming silicon oxy-nitride films by plasma-enhanced chemical vapor deposition
DE69424759T2 (de) 1993-12-28 2001-02-08 Applied Materials, Inc. Gasphasenabscheidungsverfahren in einer einzigen Kammer für Dünnfilmtransistoren
US5645646A (en) 1994-02-25 1997-07-08 Applied Materials, Inc. Susceptor for deposition apparatus
JPH0845946A (ja) * 1994-08-01 1996-02-16 Hitachi Ltd シリコン半導体単結晶基板の熱処理方法及び熱処理装置、半導体装置
JPH08302474A (ja) * 1995-04-28 1996-11-19 Anelva Corp Ｃｖｄ装置の加熱装置
JPH097963A (ja) * 1995-06-19 1997-01-10 Kokusai Electric Co Ltd 電気炉のデータ処理方法
US5633073A (en) 1995-07-14 1997-05-27 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and eutectic connection
JPH0945624A (ja) * 1995-07-27 1997-02-14 Tokyo Electron Ltd 枚葉式の熱処理装置
JPH09134886A (ja) * 1995-11-08 1997-05-20 Kokusai Electric Co Ltd 半導体製造装置のランピング温度制御方法
JP3563224B2 (ja) * 1996-03-25 2004-09-08 住友電気工業株式会社 半導体ウエハの評価方法、熱処理方法、および熱処理装置
EP0823491B1 (en) * 1996-08-07 2002-02-27 Concept Systems Design Inc. Gas injection system for CVD reactors
US5653808A (en) 1996-08-07 1997-08-05 Macleish; Joseph H. Gas injection system for CVD reactors
EP0823492A3 (en) * 1996-08-07 1999-01-20 Concept Systems Design Inc. Zone heating system with feedback control
JPH10144655A (ja) * 1996-11-06 1998-05-29 Sony Corp ドライエッチング処理方法及びドライエッチング装置
US5812403A (en) * 1996-11-13 1998-09-22 Applied Materials, Inc. Methods and apparatus for cleaning surfaces in a substrate processing system
US5970214A (en) * 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
US5930456A (en) * 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers

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