JP2003519925A - 相互接続装置および方法 - Google Patents

相互接続装置および方法

Info

Publication number
JP2003519925A
JP2003519925A JP2001550811A JP2001550811A JP2003519925A JP 2003519925 A JP2003519925 A JP 2003519925A JP 2001550811 A JP2001550811 A JP 2001550811A JP 2001550811 A JP2001550811 A JP 2001550811A JP 2003519925 A JP2003519925 A JP 2003519925A
Authority
JP
Japan
Prior art keywords
pad
substrate
package
wire
interconnect device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001550811A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003519925A5 (enExample
Inventor
フアング、グアングフア
チャンドラー、パーカー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEI Inc
Original Assignee
HEI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEI Inc filed Critical HEI Inc
Publication of JP2003519925A publication Critical patent/JP2003519925A/ja
Publication of JP2003519925A5 publication Critical patent/JP2003519925A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2001550811A 1999-12-31 2000-12-20 相互接続装置および方法 Pending JP2003519925A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/477,048 US6294966B1 (en) 1999-12-31 1999-12-31 Interconnection device
US09/477,048 1999-12-31
PCT/US2000/034805 WO2001050531A1 (en) 1999-12-31 2000-12-20 Interconnection device and method

Publications (2)

Publication Number Publication Date
JP2003519925A true JP2003519925A (ja) 2003-06-24
JP2003519925A5 JP2003519925A5 (enExample) 2008-02-14

Family

ID=23894296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001550811A Pending JP2003519925A (ja) 1999-12-31 2000-12-20 相互接続装置および方法

Country Status (8)

Country Link
US (3) US6294966B1 (enExample)
EP (1) EP1245046A1 (enExample)
JP (1) JP2003519925A (enExample)
KR (1) KR20020077376A (enExample)
CN (1) CN100390988C (enExample)
AU (1) AU2285401A (enExample)
MY (1) MY125788A (enExample)
WO (1) WO2001050531A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device
US6646521B1 (en) * 2000-09-15 2003-11-11 Hei, Inc. Connection for conducting high frequency signal between a circuit and a discrete electric component
CA2390627C (en) * 2001-06-18 2007-01-30 Research In Motion Limited Ic chip packaging for reducing bond wire length
US6737931B2 (en) * 2002-07-19 2004-05-18 Agilent Technologies, Inc. Device interconnects and methods of making the same
CN1751412A (zh) * 2003-02-21 2006-03-22 松下电器产业株式会社 高频电路
US7239207B2 (en) * 2003-08-20 2007-07-03 Intel Corporation Transimpedance amplifier
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
US7187249B2 (en) 2004-09-24 2007-03-06 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
US20070035019A1 (en) * 2005-08-15 2007-02-15 Semiconductor Components Industries, Llc. Semiconductor component and method of manufacture
AU2006291285A1 (en) * 2005-09-12 2007-03-22 Sealed Air Corporation (Us) Flexible valves
US7295084B2 (en) * 2005-09-28 2007-11-13 Agilent Technologies, Inc. Electrical interconnection for coaxial line to slab line structure including a bead ring
CN100411400C (zh) * 2006-04-06 2008-08-13 华为技术有限公司 一种阻抗调节装置和包含该装置的通信系统
US9713258B2 (en) 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US20080218979A1 (en) * 2007-03-08 2008-09-11 Jong-Ho Park Printed circuit (PC) board module with improved heat radiation efficiency
DE102007046728B4 (de) * 2007-09-28 2013-08-22 Epcos Ag Elektrisches Bauelement
KR101463074B1 (ko) * 2008-01-10 2014-11-21 페어차일드코리아반도체 주식회사 리드리스 패키지
US9069418B2 (en) * 2008-06-06 2015-06-30 Apple Inc. High resistivity metal fan out
US8107177B2 (en) * 2008-12-23 2012-01-31 Hitachi Global Storage Technologies Netherlands B.V. Electrical interconnect system with integrated transmission- line compensation components
JP2011077841A (ja) * 2009-09-30 2011-04-14 Renesas Electronics Corp 電子装置
US8791767B2 (en) 2010-10-29 2014-07-29 Qualcomm Incorporated Package inductance compensating tunable capacitor circuit
CN102623777B (zh) * 2011-01-27 2014-06-18 鸿富锦精密工业（深圳）有限公司 低通滤波器
KR101776364B1 (ko) * 2011-03-03 2017-09-07 스카이워크스 솔루션즈, 인코포레이티드 고rf 손실 도금의 영향을 감소시키는, 와이어 본드 패드에 관련된 장치 및 방법
US20150282299A1 (en) * 2014-04-01 2015-10-01 Xilinx, Inc. Thin profile metal trace to suppress skin effect and extend package interconnect bandwidth
TWI557752B (zh) * 2015-02-25 2016-11-11 緯創資通股份有限公司 排線結構
CN106129029A (zh) * 2016-07-14 2016-11-16 中国电子科技集团公司第五十五研究所 应用于Ku波段的陶瓷四边扁平无引脚型外壳

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897611A (ja) * 1994-09-22 1996-04-12 Nippon Telegr & Teleph Corp <Ntt> 高周波伝送線路およびマイクロ波回路

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793392B2 (ja) 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPS63124102A (ja) 1986-11-14 1988-05-27 Hitachi Ltd 冗長化システムの縮退運転方法
FR2684804B1 (fr) 1991-12-06 1994-01-28 Thomson Csf Dispositif de montage de circuits integres monolithiques hyperfrequences a tres large bande.
JPH07221223A (ja) * 1994-02-03 1995-08-18 Mitsubishi Electric Corp 半導体装置，及び混成集積回路装置
EP0718905A1 (en) * 1994-12-21 1996-06-26 Industrial Technology Research Institute Surface mountable microwave IC package
US5583468A (en) * 1995-04-03 1996-12-10 Motorola, Inc. High frequency transition from a microstrip transmission line to an MMIC coplanar waveguide
US6175287B1 (en) * 1997-05-28 2001-01-16 Raytheon Company Direct backside interconnect for multiple chip assemblies
WO1999027646A1 (fr) 1997-11-21 1999-06-03 Hitachi, Ltd. Dispositif a circuit amplificateur a haute frequence et systeme de transmission a haute frequence comprenant ce dispositif
US5982250A (en) * 1997-11-26 1999-11-09 Twr Inc. Millimeter-wave LTCC package
US6118357A (en) * 1999-02-15 2000-09-12 Trw Inc. Wireless MMIC chip packaging for microwave and millimeterwave frequencies
US6201454B1 (en) 1999-03-30 2001-03-13 The Whitaker Corporation Compensation structure for a bond wire at high frequency operation
US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897611A (ja) * 1994-09-22 1996-04-12 Nippon Telegr & Teleph Corp <Ntt> 高周波伝送線路およびマイクロ波回路

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US6294966B1 (en) 2001-09-25
CN100390988C (zh) 2008-05-28
US6838953B2 (en) 2005-01-04
WO2001050531A1 (en) 2001-07-12
US6469592B2 (en) 2002-10-22
AU2285401A (en) 2001-07-16
MY125788A (en) 2006-08-30
EP1245046A1 (en) 2002-10-02
KR20020077376A (ko) 2002-10-11
CN1425199A (zh) 2003-06-18
US20020008598A1 (en) 2002-01-24

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