AU2285401A - Interconnection device and method - Google Patents

Interconnection device and method

Info

Publication number
AU2285401A
AU2285401A AU22854/01A AU2285401A AU2285401A AU 2285401 A AU2285401 A AU 2285401A AU 22854/01 A AU22854/01 A AU 22854/01A AU 2285401 A AU2285401 A AU 2285401A AU 2285401 A AU2285401 A AU 2285401A
Authority
AU
Australia
Prior art keywords
interconnection device
interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU22854/01A
Other languages
English (en)
Inventor
Parker Chandler
Guanghua Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEI Inc
Original Assignee
HEI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEI Inc filed Critical HEI Inc
Publication of AU2285401A publication Critical patent/AU2285401A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
AU22854/01A 1999-12-31 2000-12-20 Interconnection device and method Abandoned AU2285401A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09477048 1999-12-31
US09/477,048 US6294966B1 (en) 1999-12-31 1999-12-31 Interconnection device
PCT/US2000/034805 WO2001050531A1 (en) 1999-12-31 2000-12-20 Interconnection device and method

Publications (1)

Publication Number Publication Date
AU2285401A true AU2285401A (en) 2001-07-16

Family

ID=23894296

Family Applications (1)

Application Number Title Priority Date Filing Date
AU22854/01A Abandoned AU2285401A (en) 1999-12-31 2000-12-20 Interconnection device and method

Country Status (8)

Country Link
US (3) US6294966B1 (enExample)
EP (1) EP1245046A1 (enExample)
JP (1) JP2003519925A (enExample)
KR (1) KR20020077376A (enExample)
CN (1) CN100390988C (enExample)
AU (1) AU2285401A (enExample)
MY (1) MY125788A (enExample)
WO (1) WO2001050531A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device
US6646521B1 (en) * 2000-09-15 2003-11-11 Hei, Inc. Connection for conducting high frequency signal between a circuit and a discrete electric component
CA2390627C (en) * 2001-06-18 2007-01-30 Research In Motion Limited Ic chip packaging for reducing bond wire length
US6737931B2 (en) * 2002-07-19 2004-05-18 Agilent Technologies, Inc. Device interconnects and methods of making the same
WO2004075336A1 (ja) * 2003-02-21 2004-09-02 Matsushita Electric Industrial Co., Ltd. 高周波回路
US7239207B2 (en) * 2003-08-20 2007-07-03 Intel Corporation Transimpedance amplifier
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
US7187249B2 (en) * 2004-09-24 2007-03-06 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
US20070035019A1 (en) * 2005-08-15 2007-02-15 Semiconductor Components Industries, Llc. Semiconductor component and method of manufacture
CN101272960A (zh) * 2005-09-12 2008-09-24 密封空气公司 柔性阀
US7295084B2 (en) * 2005-09-28 2007-11-13 Agilent Technologies, Inc. Electrical interconnection for coaxial line to slab line structure including a bead ring
CN100411400C (zh) * 2006-04-06 2008-08-13 华为技术有限公司 一种阻抗调节装置和包含该装置的通信系统
US9713258B2 (en) 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US20080218979A1 (en) * 2007-03-08 2008-09-11 Jong-Ho Park Printed circuit (PC) board module with improved heat radiation efficiency
DE102007046728B4 (de) * 2007-09-28 2013-08-22 Epcos Ag Elektrisches Bauelement
KR101463074B1 (ko) * 2008-01-10 2014-11-21 페어차일드코리아반도체 주식회사 리드리스 패키지
US9069418B2 (en) * 2008-06-06 2015-06-30 Apple Inc. High resistivity metal fan out
US8107177B2 (en) * 2008-12-23 2012-01-31 Hitachi Global Storage Technologies Netherlands B.V. Electrical interconnect system with integrated transmission- line compensation components
JP2011077841A (ja) * 2009-09-30 2011-04-14 Renesas Electronics Corp 電子装置
US8791767B2 (en) * 2010-10-29 2014-07-29 Qualcomm Incorporated Package inductance compensating tunable capacitor circuit
CN102623777B (zh) * 2011-01-27 2014-06-18 鸿富锦精密工业（深圳）有限公司 低通滤波器
KR101776364B1 (ko) * 2011-03-03 2017-09-07 스카이워크스 솔루션즈, 인코포레이티드 고rf 손실 도금의 영향을 감소시키는, 와이어 본드 패드에 관련된 장치 및 방법
US20150282299A1 (en) * 2014-04-01 2015-10-01 Xilinx, Inc. Thin profile metal trace to suppress skin effect and extend package interconnect bandwidth
TWI557752B (zh) * 2015-02-25 2016-11-11 緯創資通股份有限公司 排線結構
CN106129029A (zh) * 2016-07-14 2016-11-16 中国电子科技集团公司第五十五研究所 应用于Ku波段的陶瓷四边扁平无引脚型外壳

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793392B2 (ja) 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPS63124102A (ja) 1986-11-14 1988-05-27 Hitachi Ltd 冗長化システムの縮退運転方法
FR2684804B1 (fr) 1991-12-06 1994-01-28 Thomson Csf Dispositif de montage de circuits integres monolithiques hyperfrequences a tres large bande.
JPH07221223A (ja) * 1994-02-03 1995-08-18 Mitsubishi Electric Corp 半導体装置，及び混成集積回路装置
JPH0897611A (ja) * 1994-09-22 1996-04-12 Nippon Telegr & Teleph Corp <Ntt> 高周波伝送線路およびマイクロ波回路
EP0718905A1 (en) * 1994-12-21 1996-06-26 Industrial Technology Research Institute Surface mountable microwave IC package
US5583468A (en) * 1995-04-03 1996-12-10 Motorola, Inc. High frequency transition from a microstrip transmission line to an MMIC coplanar waveguide
US6175287B1 (en) * 1997-05-28 2001-01-16 Raytheon Company Direct backside interconnect for multiple chip assemblies
WO1999027646A1 (fr) 1997-11-21 1999-06-03 Hitachi, Ltd. Dispositif a circuit amplificateur a haute frequence et systeme de transmission a haute frequence comprenant ce dispositif
US5982250A (en) * 1997-11-26 1999-11-09 Twr Inc. Millimeter-wave LTCC package
US6118357A (en) * 1999-02-15 2000-09-12 Trw Inc. Wireless MMIC chip packaging for microwave and millimeterwave frequencies
US6201454B1 (en) 1999-03-30 2001-03-13 The Whitaker Corporation Compensation structure for a bond wire at high frequency operation
US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device

Also Published As

Publication number Publication date
US20020008598A1 (en) 2002-01-24
EP1245046A1 (en) 2002-10-02
US20020190812A1 (en) 2002-12-19
US6838953B2 (en) 2005-01-04
JP2003519925A (ja) 2003-06-24
CN1425199A (zh) 2003-06-18
CN100390988C (zh) 2008-05-28
US6294966B1 (en) 2001-09-25
WO2001050531A1 (en) 2001-07-12
MY125788A (en) 2006-08-30
US6469592B2 (en) 2002-10-22
KR20020077376A (ko) 2002-10-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase