CN100390988C - 电子电路封装件中的互连 - Google Patents

电子电路封装件中的互连 Download PDF

Info

Publication number
CN100390988C
CN100390988C CNB008186499A CN00818649A CN100390988C CN 100390988 C CN100390988 C CN 100390988C CN B008186499 A CNB008186499 A CN B008186499A CN 00818649 A CN00818649 A CN 00818649A CN 100390988 C CN100390988 C CN 100390988C
Authority
CN
China
Prior art keywords
electronic circuit
circuit package
interconnection
package part
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008186499A
Other languages
English (en)
Chinese (zh)
Other versions
CN1425199A (zh
Inventor
黄光华
帕克·钱德勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEI Inc
Original Assignee
HEI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEI Inc filed Critical HEI Inc
Publication of CN1425199A publication Critical patent/CN1425199A/zh
Application granted granted Critical
Publication of CN100390988C publication Critical patent/CN100390988C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)
CNB008186499A 1999-12-31 2000-12-20 电子电路封装件中的互连 Expired - Fee Related CN100390988C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/477,048 1999-12-31
US09/477,048 US6294966B1 (en) 1999-12-31 1999-12-31 Interconnection device

Publications (2)

Publication Number Publication Date
CN1425199A CN1425199A (zh) 2003-06-18
CN100390988C true CN100390988C (zh) 2008-05-28

Family

ID=23894296

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008186499A Expired - Fee Related CN100390988C (zh) 1999-12-31 2000-12-20 电子电路封装件中的互连

Country Status (8)

Country Link
US (3) US6294966B1 (enExample)
EP (1) EP1245046A1 (enExample)
JP (1) JP2003519925A (enExample)
KR (1) KR20020077376A (enExample)
CN (1) CN100390988C (enExample)
AU (1) AU2285401A (enExample)
MY (1) MY125788A (enExample)
WO (1) WO2001050531A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device
US6646521B1 (en) * 2000-09-15 2003-11-11 Hei, Inc. Connection for conducting high frequency signal between a circuit and a discrete electric component
CA2390627C (en) * 2001-06-18 2007-01-30 Research In Motion Limited Ic chip packaging for reducing bond wire length
US6737931B2 (en) * 2002-07-19 2004-05-18 Agilent Technologies, Inc. Device interconnects and methods of making the same
WO2004075336A1 (ja) * 2003-02-21 2004-09-02 Matsushita Electric Industrial Co., Ltd. 高周波回路
US7239207B2 (en) * 2003-08-20 2007-07-03 Intel Corporation Transimpedance amplifier
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
US7187249B2 (en) * 2004-09-24 2007-03-06 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
US20070035019A1 (en) * 2005-08-15 2007-02-15 Semiconductor Components Industries, Llc. Semiconductor component and method of manufacture
CN101272960A (zh) * 2005-09-12 2008-09-24 密封空气公司 柔性阀
US7295084B2 (en) * 2005-09-28 2007-11-13 Agilent Technologies, Inc. Electrical interconnection for coaxial line to slab line structure including a bead ring
CN100411400C (zh) * 2006-04-06 2008-08-13 华为技术有限公司 一种阻抗调节装置和包含该装置的通信系统
US9713258B2 (en) 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US20080218979A1 (en) * 2007-03-08 2008-09-11 Jong-Ho Park Printed circuit (PC) board module with improved heat radiation efficiency
DE102007046728B4 (de) * 2007-09-28 2013-08-22 Epcos Ag Elektrisches Bauelement
KR101463074B1 (ko) * 2008-01-10 2014-11-21 페어차일드코리아반도체 주식회사 리드리스 패키지
US9069418B2 (en) * 2008-06-06 2015-06-30 Apple Inc. High resistivity metal fan out
US8107177B2 (en) * 2008-12-23 2012-01-31 Hitachi Global Storage Technologies Netherlands B.V. Electrical interconnect system with integrated transmission- line compensation components
JP2011077841A (ja) * 2009-09-30 2011-04-14 Renesas Electronics Corp 電子装置
US8791767B2 (en) * 2010-10-29 2014-07-29 Qualcomm Incorporated Package inductance compensating tunable capacitor circuit
CN102623777B (zh) * 2011-01-27 2014-06-18 鸿富锦精密工业（深圳）有限公司 低通滤波器
KR101776364B1 (ko) * 2011-03-03 2017-09-07 스카이워크스 솔루션즈, 인코포레이티드 고rf 손실 도금의 영향을 감소시키는, 와이어 본드 패드에 관련된 장치 및 방법
US20150282299A1 (en) * 2014-04-01 2015-10-01 Xilinx, Inc. Thin profile metal trace to suppress skin effect and extend package interconnect bandwidth
TWI557752B (zh) * 2015-02-25 2016-11-11 緯創資通股份有限公司 排線結構
CN106129029A (zh) * 2016-07-14 2016-11-16 中国电子科技集团公司第五十五研究所 应用于Ku波段的陶瓷四边扁平无引脚型外壳

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0718905A1 (en) * 1994-12-21 1996-06-26 Industrial Technology Research Institute Surface mountable microwave IC package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793392B2 (ja) 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPS63124102A (ja) 1986-11-14 1988-05-27 Hitachi Ltd 冗長化システムの縮退運転方法
FR2684804B1 (fr) 1991-12-06 1994-01-28 Thomson Csf Dispositif de montage de circuits integres monolithiques hyperfrequences a tres large bande.
JPH07221223A (ja) * 1994-02-03 1995-08-18 Mitsubishi Electric Corp 半導体装置，及び混成集積回路装置
JPH0897611A (ja) * 1994-09-22 1996-04-12 Nippon Telegr & Teleph Corp <Ntt> 高周波伝送線路およびマイクロ波回路
US5583468A (en) * 1995-04-03 1996-12-10 Motorola, Inc. High frequency transition from a microstrip transmission line to an MMIC coplanar waveguide
US6175287B1 (en) * 1997-05-28 2001-01-16 Raytheon Company Direct backside interconnect for multiple chip assemblies
WO1999027646A1 (fr) 1997-11-21 1999-06-03 Hitachi, Ltd. Dispositif a circuit amplificateur a haute frequence et systeme de transmission a haute frequence comprenant ce dispositif
US5982250A (en) * 1997-11-26 1999-11-09 Twr Inc. Millimeter-wave LTCC package
US6118357A (en) * 1999-02-15 2000-09-12 Trw Inc. Wireless MMIC chip packaging for microwave and millimeterwave frequencies
US6201454B1 (en) 1999-03-30 2001-03-13 The Whitaker Corporation Compensation structure for a bond wire at high frequency operation
US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0718905A1 (en) * 1994-12-21 1996-06-26 Industrial Technology Research Institute Surface mountable microwave IC package

Also Published As

Publication number Publication date
US20020008598A1 (en) 2002-01-24
EP1245046A1 (en) 2002-10-02
US20020190812A1 (en) 2002-12-19
US6838953B2 (en) 2005-01-04
JP2003519925A (ja) 2003-06-24
CN1425199A (zh) 2003-06-18
US6294966B1 (en) 2001-09-25
WO2001050531A1 (en) 2001-07-12
AU2285401A (en) 2001-07-16
MY125788A (en) 2006-08-30
US6469592B2 (en) 2002-10-22
KR20020077376A (ko) 2002-10-11

Similar Documents

Publication Publication Date Title
US6294966B1 (en) Interconnection device
US7187256B2 (en) RF package
US5698469A (en) Method of making a hybrid circuit with a chip having active devices with extra-chip interconnections
US5623231A (en) Push-pull power amplifier
US5832376A (en) Coplanar mixer assembly
US9048232B2 (en) Package with integrated pre-match circuit and harmonic suppression
US20010015490A1 (en) High speed digital and microwave device package
US4739289A (en) Microstrip balun having improved bandwidth
JPS62247610A (ja) フインライン構造体
JPH0774285A (ja) 半導体装置
US6535090B1 (en) Compact high-frequency circuit device
US4435848A (en) Stripline microwave balanced mixer circuit
US6924714B2 (en) High power termination for radio frequency (RF) circuits
US6417744B1 (en) Transition between asymmetric stripline and microstrip in cavity
EP2387295A1 (en) IC-Package with integrated impedance matching and harmonic suppression
US9160052B2 (en) Lange coupler and fabrication method
EP1058380A2 (en) Push-pull amplifier with dual coplanar transmission line
US6657522B2 (en) Wide bandwidth bias tee
US7202673B1 (en) Tuned MMIC probe pads
KR100329910B1 (ko) 분포 상수 선로의 결합방법 및 마이크로파 회로
JP2004529484A (ja) 回路と個別の電気部品との間で高周波信号を伝達するための接続
JPH0936617A (ja) 高周波モジュール
JP4344574B2 (ja) ミリ波ミキサー
JP3992862B2 (ja) 高周波マルチチップモジュール
Kangasvieri et al. High performance vertical interconnections for millimeter-wave multichip modules

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080528

Termination date: 20101220