CN100390988C - 电子电路封装件中的互连 - Google Patents

电子电路封装件中的互连 Download PDF

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Publication number
CN100390988C
CN100390988C CNB008186499A CN00818649A CN100390988C CN 100390988 C CN100390988 C CN 100390988C CN B008186499 A CNB008186499 A CN B008186499A CN 00818649 A CN00818649 A CN 00818649A CN 100390988 C CN100390988 C CN 100390988C
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CN
China
Prior art keywords
electronic circuit
circuit package
interconnection
package part
pad
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Expired - Fee Related
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CNB008186499A
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English (en)
Chinese (zh)
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CN1425199A (zh
Inventor
黄光华
帕克·钱德勒
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HEI Inc
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HEI Inc
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Publication of CN1425199A publication Critical patent/CN1425199A/zh
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Publication of CN100390988C publication Critical patent/CN100390988C/zh
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    • H01L23/00—Details of semiconductor or other solid state devices
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNB008186499A 1999-12-31 2000-12-20 电子电路封装件中的互连 Expired - Fee Related CN100390988C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/477,048 US6294966B1 (en) 1999-12-31 1999-12-31 Interconnection device
US09/477,048 1999-12-31

Publications (2)

Publication Number Publication Date
CN1425199A CN1425199A (zh) 2003-06-18
CN100390988C true CN100390988C (zh) 2008-05-28

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CNB008186499A Expired - Fee Related CN100390988C (zh) 1999-12-31 2000-12-20 电子电路封装件中的互连

Country Status (8)

Country Link
US (3) US6294966B1 (enExample)
EP (1) EP1245046A1 (enExample)
JP (1) JP2003519925A (enExample)
KR (1) KR20020077376A (enExample)
CN (1) CN100390988C (enExample)
AU (1) AU2285401A (enExample)
MY (1) MY125788A (enExample)
WO (1) WO2001050531A1 (enExample)

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US6294966B1 (en) * 1999-12-31 2001-09-25 Hei, Inc. Interconnection device
US6646521B1 (en) * 2000-09-15 2003-11-11 Hei, Inc. Connection for conducting high frequency signal between a circuit and a discrete electric component
CA2390627C (en) * 2001-06-18 2007-01-30 Research In Motion Limited Ic chip packaging for reducing bond wire length
US6737931B2 (en) * 2002-07-19 2004-05-18 Agilent Technologies, Inc. Device interconnects and methods of making the same
CN1751412A (zh) * 2003-02-21 2006-03-22 松下电器产业株式会社 高频电路
US7239207B2 (en) * 2003-08-20 2007-07-03 Intel Corporation Transimpedance amplifier
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
US7187249B2 (en) 2004-09-24 2007-03-06 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
US20070035019A1 (en) * 2005-08-15 2007-02-15 Semiconductor Components Industries, Llc. Semiconductor component and method of manufacture
AU2006291285A1 (en) * 2005-09-12 2007-03-22 Sealed Air Corporation (Us) Flexible valves
US7295084B2 (en) * 2005-09-28 2007-11-13 Agilent Technologies, Inc. Electrical interconnection for coaxial line to slab line structure including a bead ring
CN100411400C (zh) * 2006-04-06 2008-08-13 华为技术有限公司 一种阻抗调节装置和包含该装置的通信系统
US9713258B2 (en) 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US20080218979A1 (en) * 2007-03-08 2008-09-11 Jong-Ho Park Printed circuit (PC) board module with improved heat radiation efficiency
DE102007046728B4 (de) * 2007-09-28 2013-08-22 Epcos Ag Elektrisches Bauelement
KR101463074B1 (ko) * 2008-01-10 2014-11-21 페어차일드코리아반도체 주식회사 리드리스 패키지
US9069418B2 (en) * 2008-06-06 2015-06-30 Apple Inc. High resistivity metal fan out
US8107177B2 (en) * 2008-12-23 2012-01-31 Hitachi Global Storage Technologies Netherlands B.V. Electrical interconnect system with integrated transmission- line compensation components
JP2011077841A (ja) * 2009-09-30 2011-04-14 Renesas Electronics Corp 電子装置
US8791767B2 (en) 2010-10-29 2014-07-29 Qualcomm Incorporated Package inductance compensating tunable capacitor circuit
CN102623777B (zh) * 2011-01-27 2014-06-18 鸿富锦精密工业（深圳）有限公司 低通滤波器
KR101776364B1 (ko) * 2011-03-03 2017-09-07 스카이워크스 솔루션즈, 인코포레이티드 고rf 손실 도금의 영향을 감소시키는, 와이어 본드 패드에 관련된 장치 및 방법
US20150282299A1 (en) * 2014-04-01 2015-10-01 Xilinx, Inc. Thin profile metal trace to suppress skin effect and extend package interconnect bandwidth
TWI557752B (zh) * 2015-02-25 2016-11-11 緯創資通股份有限公司 排線結構
CN106129029A (zh) * 2016-07-14 2016-11-16 中国电子科技集团公司第五十五研究所 应用于Ku波段的陶瓷四边扁平无引脚型外壳

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US6294966B1 (en) 2001-09-25
JP2003519925A (ja) 2003-06-24
US6838953B2 (en) 2005-01-04
WO2001050531A1 (en) 2001-07-12
US6469592B2 (en) 2002-10-22
AU2285401A (en) 2001-07-16
MY125788A (en) 2006-08-30
EP1245046A1 (en) 2002-10-02
KR20020077376A (ko) 2002-10-11
CN1425199A (zh) 2003-06-18
US20020008598A1 (en) 2002-01-24

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