JP2003504609A - 非弾性電子散乱による膜厚測定 - Google Patents

非弾性電子散乱による膜厚測定

Info

Publication number
JP2003504609A
JP2003504609A JP2001509941A JP2001509941A JP2003504609A JP 2003504609 A JP2003504609 A JP 2003504609A JP 2001509941 A JP2001509941 A JP 2001509941A JP 2001509941 A JP2001509941 A JP 2001509941A JP 2003504609 A JP2003504609 A JP 2003504609A
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JP
Japan
Prior art keywords
film thickness
energy
film
spectrum
electrons
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001509941A
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English (en)
Japanese (ja)
Other versions
JP2003504609A5 (https=
Inventor
ワシリーエフ・レオニード・エー
Iii ブライソン・チャールズ・イー
リンダー・ロバート
ボロジャンスキー・セルゲイ
ヤチコ・ドミトリー キ
Original Assignee
エフ・イ−・アイ・カンパニー
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Application filed by エフ・イ−・アイ・カンパニー filed Critical エフ・イ−・アイ・カンパニー
Publication of JP2003504609A publication Critical patent/JP2003504609A/ja
Publication of JP2003504609A5 publication Critical patent/JP2003504609A5/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
JP2001509941A 1999-07-09 2000-06-22 非弾性電子散乱による膜厚測定 Pending JP2003504609A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/350,701 1999-07-09
US09/350,701 US6399944B1 (en) 1999-07-09 1999-07-09 Measurement of film thickness by inelastic electron scattering
PCT/US2000/017234 WO2001004574A1 (en) 1999-07-09 2000-06-22 Measurement of film thickness by inelastic electron scattering

Publications (2)

Publication Number Publication Date
JP2003504609A true JP2003504609A (ja) 2003-02-04
JP2003504609A5 JP2003504609A5 (https=) 2008-02-28

Family

ID=23377837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001509941A Pending JP2003504609A (ja) 1999-07-09 2000-06-22 非弾性電子散乱による膜厚測定

Country Status (8)

Country Link
US (1) US6399944B1 (https=)
EP (1) EP1192416B1 (https=)
JP (1) JP2003504609A (https=)
AT (1) ATE291731T1 (https=)
AU (1) AU5759400A (https=)
DE (1) DE60018932T2 (https=)
TW (1) TW457362B (https=)
WO (1) WO2001004574A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
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JP2005539210A (ja) * 2002-02-04 2005-12-22 アプライド マテリアルズ インコーポレイテッド オーガに基づく薄膜測定法
JPWO2006073063A1 (ja) * 2005-01-07 2008-06-12 エスアイアイ・ナノテクノロジー株式会社 薄膜試料測定方法および装置ならびに薄膜試料作製方法および装置
JP2008539432A (ja) * 2005-04-29 2008-11-13 リヴェラ インコーポレイテッド 計器によって生成されたデータを分析するための技術
WO2011162411A1 (ja) * 2010-06-25 2011-12-29 日本電気株式会社 2次元薄膜原子構造の層数決定方法および2次元薄膜原子構造の層数決定装置

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US6635869B2 (en) * 2001-02-26 2003-10-21 Fei Company Step function determination of Auger peak intensity
US6891158B2 (en) * 2002-12-27 2005-05-10 Revera Incorporated Nondestructive characterization of thin films based on acquired spectrum
AU2003299965A1 (en) * 2002-12-27 2004-07-29 Physical Electronics, Inc. Nondestructive characterization of thin films using measured basis spectra and/or based on acquired spectrum
JP4344197B2 (ja) * 2003-08-26 2009-10-14 パナソニック株式会社 絶縁膜測定装置、絶縁膜測定方法及び絶縁膜評価装置
WO2006069469A1 (en) * 2004-12-27 2006-07-06 Sae Magnetics (H.K.) Ltd. Method of nano thin film thickness measurement by auger electron spectrscopy
US7420163B2 (en) * 2005-04-29 2008-09-02 Revera Incorporated Determining layer thickness using photoelectron spectroscopy
US7411188B2 (en) 2005-07-11 2008-08-12 Revera Incorporated Method and system for non-destructive distribution profiling of an element in a film
US7985188B2 (en) 2009-05-13 2011-07-26 Cv Holdings Llc Vessel, coating, inspection and processing apparatus
PT2251454E (pt) 2009-05-13 2014-10-01 Sio2 Medical Products Inc Revestimento e inspeção de vaso
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
US8581602B2 (en) * 2009-09-02 2013-11-12 Systems And Materials Research Corporation Method and apparatus for nondestructive measuring of a coating thickness on a curved surface
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US8853078B2 (en) 2011-01-30 2014-10-07 Fei Company Method of depositing material
US9090973B2 (en) 2011-01-31 2015-07-28 Fei Company Beam-induced deposition of low-resistivity material
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
CA2855353C (en) 2011-11-11 2021-01-19 Sio2 Medical Products, Inc. Passivation, ph protective or lubricity coating for pharmaceutical package, coating process and apparatus
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
US8658973B2 (en) * 2012-06-12 2014-02-25 Kla-Tencor Corporation Auger elemental identification algorithm
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
KR101241007B1 (ko) * 2012-10-26 2013-03-11 나노씨엠에스(주) 엑스선을 이용한 박막층의 두께 측정 방법 및 장치
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
AU2013352436B2 (en) 2012-11-30 2018-10-25 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
CN103713002B (zh) * 2013-12-27 2016-04-27 昆明贵研催化剂有限责任公司 一种测定汽车尾气催化剂涂层厚度的方法
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
EP3104155A1 (en) 2015-06-09 2016-12-14 FEI Company Method of analyzing surface modification of a specimen in a charged-particle microscope
KR102786617B1 (ko) 2015-08-18 2025-03-26 에스아이오2 메디컬 프로덕츠, 엘엘씨 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기
US9837246B1 (en) 2016-07-22 2017-12-05 Fei Company Reinforced sample for transmission electron microscope
DE112017007508T5 (de) * 2017-06-13 2020-03-19 Hitachi High-Technologies Corporation Ladungsteilchenstrahlvorrichtung und Verfahren zur Messung der Probendicke
US10895541B2 (en) * 2018-01-06 2021-01-19 Kla-Tencor Corporation Systems and methods for combined x-ray reflectometry and photoelectron spectroscopy
DE102018202985A1 (de) 2018-02-28 2018-04-12 Carl Zeiss Smt Gmbh Verfahren zum Bestimmen einer Ablösewahrscheinlichkeit einer Schicht
CN114046736B (zh) * 2021-11-09 2023-02-28 北京理工大学 一种基于泵浦探测分析确定金属电子弹道深度的方法
CN114923938B (zh) * 2022-05-24 2025-04-29 长江存储科技有限责任公司 样品的表征方法

Citations (6)

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Publication number Priority date Publication date Assignee Title
JPS52127292A (en) * 1976-04-16 1977-10-25 Hitachi Ltd Analyzer
JPS60128306A (ja) * 1983-12-16 1985-07-09 Nippon Telegr & Teleph Corp <Ntt> 磁気デイスク媒体の潤滑剤膜厚測定方法
JPS61176044A (ja) * 1985-01-29 1986-08-07 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 電界放出走査型オ−ジエ電子顕微鏡
JPS639807A (ja) * 1986-06-30 1988-01-16 Nec Corp 膜厚測定方法およびその装置
JPH07318334A (ja) * 1994-05-25 1995-12-08 Rigaku Ind Co X線分析方法およびこれに用いる装置
JPH0914947A (ja) * 1995-06-29 1997-01-17 Sony Corp カーボン膜の膜厚測定方法

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DE2611411C3 (de) 1976-03-18 1980-07-17 Helmut Fischer Gmbh & Co Institut Fuer Elektronik Und Messtechnik, 7032 Sindelfingen Vorrichtung zum Messen der Dicke von Schichten mit einem die Schicht bestrahlenden Radionuklid
GB2054136B (en) 1979-07-19 1983-06-29 Fischer H Apparatus for measuring the thickness of thin layers
JPH0766507B2 (ja) * 1984-02-16 1995-07-19 コニカ株式会社 磁気記録媒体
US5594245A (en) * 1990-10-12 1997-01-14 Hitachi, Ltd. Scanning electron microscope and method for dimension measuring by using the same
US5280176A (en) 1992-11-06 1994-01-18 The United States Of America As Represented By The Secretary Of Commerce X-ray photoelectron emission spectrometry system
US5924058A (en) * 1997-02-14 1999-07-13 Applied Materials, Inc. Permanently mounted reference sample for a substrate measurement tool
US6067154A (en) * 1998-10-23 2000-05-23 Advanced Micro Devices, Inc. Method and apparatus for the molecular identification of defects in semiconductor manufacturing using a radiation scattering technique such as raman spectroscopy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127292A (en) * 1976-04-16 1977-10-25 Hitachi Ltd Analyzer
JPS60128306A (ja) * 1983-12-16 1985-07-09 Nippon Telegr & Teleph Corp <Ntt> 磁気デイスク媒体の潤滑剤膜厚測定方法
JPS61176044A (ja) * 1985-01-29 1986-08-07 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 電界放出走査型オ−ジエ電子顕微鏡
JPS639807A (ja) * 1986-06-30 1988-01-16 Nec Corp 膜厚測定方法およびその装置
JPH07318334A (ja) * 1994-05-25 1995-12-08 Rigaku Ind Co X線分析方法およびこれに用いる装置
JPH0914947A (ja) * 1995-06-29 1997-01-17 Sony Corp カーボン膜の膜厚測定方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005539210A (ja) * 2002-02-04 2005-12-22 アプライド マテリアルズ インコーポレイテッド オーガに基づく薄膜測定法
JPWO2006073063A1 (ja) * 2005-01-07 2008-06-12 エスアイアイ・ナノテクノロジー株式会社 薄膜試料測定方法および装置ならびに薄膜試料作製方法および装置
JP4987486B2 (ja) * 2005-01-07 2012-07-25 エスアイアイ・ナノテクノロジー株式会社 薄膜試料測定方法および装置ならびに薄膜試料作製方法および装置
JP2008539432A (ja) * 2005-04-29 2008-11-13 リヴェラ インコーポレイテッド 計器によって生成されたデータを分析するための技術
WO2011162411A1 (ja) * 2010-06-25 2011-12-29 日本電気株式会社 2次元薄膜原子構造の層数決定方法および2次元薄膜原子構造の層数決定装置
US8698077B2 (en) 2010-06-25 2014-04-15 Nec Corporation Method for determining number of layers of two-dimensional thin film atomic structure and device for determining number of layers of two-dimensional thin film atomic structure
JP5874981B2 (ja) * 2010-06-25 2016-03-02 日本電気株式会社 2次元薄膜原子構造の層数決定方法および2次元薄膜原子構造の層数決定装置

Also Published As

Publication number Publication date
DE60018932D1 (de) 2005-04-28
EP1192416A1 (en) 2002-04-03
AU5759400A (en) 2001-01-30
US6399944B1 (en) 2002-06-04
WO2001004574A1 (en) 2001-01-18
DE60018932T2 (de) 2006-03-30
TW457362B (en) 2001-10-01
EP1192416B1 (en) 2005-03-23
ATE291731T1 (de) 2005-04-15

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