JP2003502644A - 集積回路センサ用の楔形マウント - Google Patents

集積回路センサ用の楔形マウント

Info

Publication number
JP2003502644A
JP2003502644A JP2001503532A JP2001503532A JP2003502644A JP 2003502644 A JP2003502644 A JP 2003502644A JP 2001503532 A JP2001503532 A JP 2001503532A JP 2001503532 A JP2001503532 A JP 2001503532A JP 2003502644 A JP2003502644 A JP 2003502644A
Authority
JP
Japan
Prior art keywords
sensor
substrate
mount
support member
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001503532A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003502644A5 (enExample
Inventor
プラット，ウィリアム・ピー
ハゲンソン，デイル・ジェイ
モーテンソン，ダグラス・ピー
Original Assignee
ハネウェル・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ハネウェル・インコーポレーテッド filed Critical ハネウェル・インコーポレーテッド
Publication of JP2003502644A publication Critical patent/JP2003502644A/ja
Publication of JP2003502644A5 publication Critical patent/JP2003502644A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gyroscopes (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2001503532A 1999-06-14 2000-06-14 集積回路センサ用の楔形マウント Pending JP2003502644A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/332,616 1999-06-14
US09/332,616 US6115261A (en) 1999-06-14 1999-06-14 Wedge mount for integrated circuit sensors
PCT/US2000/016216 WO2000077526A1 (en) 1999-06-14 2000-06-14 Wedge mount for integrated circuit sensors

Publications (2)

Publication Number Publication Date
JP2003502644A true JP2003502644A (ja) 2003-01-21
JP2003502644A5 JP2003502644A5 (enExample) 2007-04-19

Family

ID=23299037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001503532A Pending JP2003502644A (ja) 1999-06-14 2000-06-14 集積回路センサ用の楔形マウント

Country Status (4)

Country Link
US (1) US6115261A (enExample)
EP (1) EP1192472A1 (enExample)
JP (1) JP2003502644A (enExample)
WO (1) WO2000077526A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020197428A (ja) * 2019-05-31 2020-12-10 株式会社東芝 振動検出装置
WO2022097440A1 (ja) * 2020-11-06 2022-05-12 株式会社デンソー 多軸慣性力センサの製造方法
WO2022097439A1 (ja) * 2020-11-06 2022-05-12 株式会社デンソー 多軸慣性力センサ

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DE10066293B4 (de) 2000-09-29 2007-11-29 Balluff Gmbh Induktiver Sensor
JP4174979B2 (ja) * 2001-07-13 2008-11-05 松下電工株式会社 加速度センサ
JP4855603B2 (ja) * 2001-08-01 2012-01-18 富士通コンポーネント株式会社 加速度検出装置
US7253079B2 (en) * 2002-05-09 2007-08-07 The Charles Stark Draper Laboratory, Inc. Coplanar mounting member for a MEM sensor
EP1892537B1 (en) 2002-07-29 2011-05-25 Yamaha Corporation Three-axis magnetic sensor
JP2004264053A (ja) * 2003-02-10 2004-09-24 Tokyo Electron Ltd 加速度センサ及び傾斜検出方法
JP4487696B2 (ja) * 2004-09-10 2010-06-23 ヤマハ株式会社 物理量センサ及び物理量センサの製造方法
US7290448B2 (en) * 2004-09-10 2007-11-06 Yamaha Corporation Physical quantity sensor, lead frame, and manufacturing method therefor
DE102004060977B3 (de) * 2004-12-17 2006-07-13 Siemens Ag Navigationscomputer mit einem Gyro-Sensor
US20060211176A1 (en) * 2005-03-09 2006-09-21 Shiga International Manufacturing method for physical quantity sensor using lead frame and bonding device therefor
JP4977378B2 (ja) * 2006-02-23 2012-07-18 山梨日本電気株式会社 磁気センサ、回転検出装置及び位置検出装置
DE102006015676A1 (de) * 2006-04-04 2007-06-14 Siemens Ag Elektronisches Bauteil und elektronisches Steuergerät, insbesondere zur Verwendung in Kraftfahrzeugen
DE502007000781D1 (de) * 2007-03-08 2009-07-09 Delphi Tech Inc Leiterplatte mit einem winkelförmigen Stanzgitter bestückt
ATE443430T1 (de) * 2007-07-12 2009-10-15 Delphi Tech Inc Schalteinheit umfassend ein trägerelement
DE102007053808B4 (de) 2007-11-12 2023-07-06 Robert Bosch Gmbh Sockelelement, Sockelanordnung und Verfahren zur Herstellung einer weiteren Sockelanordnung
US8100010B2 (en) * 2008-04-14 2012-01-24 Honeywell International Inc. Method and system for forming an electronic assembly having inertial sensors mounted thereto
US8037754B2 (en) * 2008-06-12 2011-10-18 Rosemount Aerospace Inc. Integrated inertial measurement system and methods of constructing the same
US8056412B2 (en) * 2008-09-10 2011-11-15 Rosemount Aerospace Inc. Inertial measurement unit and method of constructing the same using two orthogonal surfaces
US8797279B2 (en) 2010-05-25 2014-08-05 MCube Inc. Analog touchscreen methods and apparatus
US8928602B1 (en) 2009-03-03 2015-01-06 MCube Inc. Methods and apparatus for object tracking on a hand-held device
US8823007B2 (en) 2009-10-28 2014-09-02 MCube Inc. Integrated system on chip using multiple MEMS and CMOS devices
US8476129B1 (en) 2010-05-24 2013-07-02 MCube Inc. Method and structure of sensors and MEMS devices using vertical mounting with interconnections
US8421082B1 (en) 2010-01-19 2013-04-16 Mcube, Inc. Integrated CMOS and MEMS with air dielectric method and system
US8553389B1 (en) 2010-08-19 2013-10-08 MCube Inc. Anchor design and method for MEMS transducer apparatuses
US8710597B1 (en) 2010-04-21 2014-04-29 MCube Inc. Method and structure for adding mass with stress isolation to MEMS structures
US8477473B1 (en) 2010-08-19 2013-07-02 MCube Inc. Transducer structure and method for MEMS devices
US9709509B1 (en) 2009-11-13 2017-07-18 MCube Inc. System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
US8794065B1 (en) * 2010-02-27 2014-08-05 MCube Inc. Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes
US8936959B1 (en) 2010-02-27 2015-01-20 MCube Inc. Integrated rf MEMS, control systems and methods
US8367522B1 (en) 2010-04-08 2013-02-05 MCube Inc. Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
US9706948B2 (en) * 2010-05-06 2017-07-18 Sachin Bhandari Inertial sensor based surgical navigation system for knee replacement surgery
US8928696B1 (en) 2010-05-25 2015-01-06 MCube Inc. Methods and apparatus for operating hysteresis on a hand held device
US8869616B1 (en) 2010-06-18 2014-10-28 MCube Inc. Method and structure of an inertial sensor using tilt conversion
US8652961B1 (en) 2010-06-18 2014-02-18 MCube Inc. Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits
US8993362B1 (en) 2010-07-23 2015-03-31 MCube Inc. Oxide retainer method for MEMS devices
US8723986B1 (en) 2010-11-04 2014-05-13 MCube Inc. Methods and apparatus for initiating image capture on a hand-held device
US8969101B1 (en) 2011-08-17 2015-03-03 MCube Inc. Three axis magnetic sensor device and method using flex cables
DE102013212053A1 (de) * 2013-06-25 2015-01-08 Robert Bosch Gmbh Leiterplatte mit einem schwingungsentkoppelten elektronischen Bauelement
DE102013113009A1 (de) 2013-11-25 2015-05-28 Osram Opto Semiconductors Gmbh Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
US9612251B2 (en) * 2014-09-30 2017-04-04 Meng Liang Chen G-force measurement system with a horizontally deviated accelerometer
US11187761B1 (en) * 2017-11-01 2021-11-30 SeeScan, Inc. Three-axis measurement modules and sensing methods
DE102020102983A1 (de) 2020-02-05 2021-08-05 Harting Ag Bauteilträger zur Anordnung elektrischer Bauteile auf einer Leiterkarte
EP4332587B1 (en) * 2022-08-30 2024-07-24 Aptiv Technologies AG Sensor mounting device for radar testing

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EP0481806A1 (en) * 1990-10-19 1992-04-22 Lucas Industries Public Limited Company Component mounting arrangements
US5412986A (en) * 1990-12-21 1995-05-09 Texas Instruments Incorporated Accelerometer with improved strain gauge sensing means
US5233873A (en) * 1991-07-03 1993-08-10 Texas Instruments Incorporated Accelerometer
JPH05275612A (ja) * 1992-03-25 1993-10-22 Rohm Co Ltd 電子部品組立構体
DE4322034A1 (de) * 1992-08-06 1994-02-10 Deutsche Aerospace Kontaktierung und Verkapselung von integrierten Schaltungsmodulen
US5325784A (en) * 1993-02-01 1994-07-05 Motorola, Inc. Electronic fuze package and method
US5359493A (en) * 1993-07-09 1994-10-25 Texas Instruments Incorporated Three dimensional multi-chip module with integral heat sink
US5503016A (en) * 1994-02-01 1996-04-02 Ic Sensors, Inc. Vertically mounted accelerometer chip
DE4431478B4 (de) * 1994-09-03 2006-04-13 Robert Bosch Gmbh Aufhängung für mikromechanische Struktur und mikromechanischer Beschleunigungssensor
US5491612A (en) * 1995-02-21 1996-02-13 Fairchild Space And Defense Corporation Three-dimensional modular assembly of integrated circuits
US5866818A (en) * 1995-11-30 1999-02-02 Matsushita Electric Works, Ltd. Acceleration sensor device
US5806365A (en) * 1996-04-30 1998-09-15 Motorola, Inc. Acceleration sensing device on a support substrate and method of operation
JP3147786B2 (ja) * 1996-09-02 2001-03-19 株式会社村田製作所 加速度センサ
DE19637079C2 (de) * 1996-09-12 2000-05-25 Telefunken Microelectron Anordnung zur Beschleunigungsmessung
JPH11108948A (ja) * 1997-10-06 1999-04-23 Toyota Autom Loom Works Ltd 車両におけるセンサの取付構造

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020197428A (ja) * 2019-05-31 2020-12-10 株式会社東芝 振動検出装置
JP7179682B2 (ja) 2019-05-31 2022-11-29 株式会社東芝 振動検出装置
WO2022097440A1 (ja) * 2020-11-06 2022-05-12 株式会社デンソー 多軸慣性力センサの製造方法
WO2022097439A1 (ja) * 2020-11-06 2022-05-12 株式会社デンソー 多軸慣性力センサ
JP2022075075A (ja) * 2020-11-06 2022-05-18 株式会社デンソー 多軸慣性力センサ
JP2022075076A (ja) * 2020-11-06 2022-05-18 株式会社デンソー 多軸慣性力センサの製造方法
JP7452382B2 (ja) 2020-11-06 2024-03-19 株式会社デンソー 多軸慣性力センサ
JP7452383B2 (ja) 2020-11-06 2024-03-19 株式会社デンソー 多軸慣性力センサの製造方法

Also Published As

Publication number Publication date
EP1192472A1 (en) 2002-04-03
US6115261A (en) 2000-09-05
WO2000077526A1 (en) 2000-12-21

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