JP2003303881A5 - - Google Patents
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- Publication number
- JP2003303881A5 JP2003303881A5 JP2002108551A JP2002108551A JP2003303881A5 JP 2003303881 A5 JP2003303881 A5 JP 2003303881A5 JP 2002108551 A JP2002108551 A JP 2002108551A JP 2002108551 A JP2002108551 A JP 2002108551A JP 2003303881 A5 JP2003303881 A5 JP 2003303881A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- wiring
- insulating film
- hole
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000004767 nitrides Chemical class 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 5
- 229910052721 tungsten Inorganic materials 0.000 claims 5
- 239000010937 tungsten Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005121 nitriding Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002108551A JP2003303881A (ja) | 2002-04-10 | 2002-04-10 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002108551A JP2003303881A (ja) | 2002-04-10 | 2002-04-10 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003303881A JP2003303881A (ja) | 2003-10-24 |
| JP2003303881A5 true JP2003303881A5 (enExample) | 2005-09-15 |
Family
ID=29392302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002108551A Pending JP2003303881A (ja) | 2002-04-10 | 2002-04-10 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003303881A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100432285C (zh) * | 2003-10-30 | 2008-11-12 | 上海集成电路研发中心有限公司 | 一种减少金属线a1空洞的金属线溅射膜工艺 |
| JP2007194468A (ja) * | 2006-01-20 | 2007-08-02 | Renesas Technology Corp | 半導体装置およびその製造方法 |
| JP6025190B2 (ja) * | 2012-06-12 | 2016-11-16 | シナプティクス・ジャパン合同会社 | Ｓｒａｍ |
-
2002
- 2002-04-10 JP JP2002108551A patent/JP2003303881A/ja active Pending
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