JP2001110896A5 - - Google Patents
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- Publication number
- JP2001110896A5 JP2001110896A5 JP1999288445A JP28844599A JP2001110896A5 JP 2001110896 A5 JP2001110896 A5 JP 2001110896A5 JP 1999288445 A JP1999288445 A JP 1999288445A JP 28844599 A JP28844599 A JP 28844599A JP 2001110896 A5 JP2001110896 A5 JP 2001110896A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- insulating film
- connection hole
- metal layer
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28844599A JP2001110896A (ja) | 1999-10-08 | 1999-10-08 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28844599A JP2001110896A (ja) | 1999-10-08 | 1999-10-08 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001110896A JP2001110896A (ja) | 2001-04-20 |
| JP2001110896A5 true JP2001110896A5 (enExample) | 2004-10-28 |
Family
ID=17730312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28844599A Withdrawn JP2001110896A (ja) | 1999-10-08 | 1999-10-08 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001110896A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002208633A (ja) * | 2001-01-10 | 2002-07-26 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| JP3718458B2 (ja) | 2001-06-21 | 2005-11-24 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP4571785B2 (ja) | 2003-05-30 | 2010-10-27 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
1999
- 1999-10-08 JP JP28844599A patent/JP2001110896A/ja not_active Withdrawn
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