JP2003303881A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JP2003303881A
JP2003303881A JP2002108551A JP2002108551A JP2003303881A JP 2003303881 A JP2003303881 A JP 2003303881A JP 2002108551 A JP2002108551 A JP 2002108551A JP 2002108551 A JP2002108551 A JP 2002108551A JP 2003303881 A JP2003303881 A JP 2003303881A
Authority
JP
Japan
Prior art keywords
wiring
film
hole
insulating film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002108551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003303881A5 (enExample
Inventor
Yukihiro Suzuki
征洋 鈴木
Ken Okuya
謙 奥谷
Hideaki Tsugane
秀明 津金
Kazuhito Ichinose
一仁 一之瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Solutions Technology Ltd
Original Assignee
Hitachi Ltd
Hitachi ULSI Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi ULSI Systems Co Ltd filed Critical Hitachi Ltd
Priority to JP2002108551A priority Critical patent/JP2003303881A/ja
Publication of JP2003303881A publication Critical patent/JP2003303881A/ja
Publication of JP2003303881A5 publication Critical patent/JP2003303881A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2002108551A 2002-04-10 2002-04-10 半導体装置及びその製造方法 Pending JP2003303881A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002108551A JP2003303881A (ja) 2002-04-10 2002-04-10 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002108551A JP2003303881A (ja) 2002-04-10 2002-04-10 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003303881A true JP2003303881A (ja) 2003-10-24
JP2003303881A5 JP2003303881A5 (enExample) 2005-09-15

Family

ID=29392302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002108551A Pending JP2003303881A (ja) 2002-04-10 2002-04-10 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2003303881A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194468A (ja) * 2006-01-20 2007-08-02 Renesas Technology Corp 半導体装置およびその製造方法
CN100432285C (zh) * 2003-10-30 2008-11-12 上海集成电路研发中心有限公司 一种减少金属线a1空洞的金属线溅射膜工艺
JP2013258245A (ja) * 2012-06-12 2013-12-26 Renesas Sp Drivers Inc Ｓｒａｍ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100432285C (zh) * 2003-10-30 2008-11-12 上海集成电路研发中心有限公司 一种减少金属线a1空洞的金属线溅射膜工艺
JP2007194468A (ja) * 2006-01-20 2007-08-02 Renesas Technology Corp 半導体装置およびその製造方法
JP2013258245A (ja) * 2012-06-12 2013-12-26 Renesas Sp Drivers Inc Ｓｒａｍ
CN103489867A (zh) * 2012-06-12 2014-01-01 瑞萨Sp驱动器公司 Sram
US9390765B2 (en) 2012-06-12 2016-07-12 Synaptics Display Devices Gk SRAM with via displacement
CN103489867B (zh) * 2012-06-12 2017-12-05 辛纳普蒂克斯日本合同会社 Sram

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