JP2003303880A5 - - Google Patents

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Publication number
JP2003303880A5
JP2003303880A5 JP2002107862A JP2002107862A JP2003303880A5 JP 2003303880 A5 JP2003303880 A5 JP 2003303880A5 JP 2002107862 A JP2002107862 A JP 2002107862A JP 2002107862 A JP2002107862 A JP 2002107862A JP 2003303880 A5 JP2003303880 A5 JP 2003303880A5
Authority
JP
Japan
Prior art keywords
insulating film
film
wiring
wiring structure
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002107862A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003303880A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002107862A priority Critical patent/JP2003303880A/ja
Priority claimed from JP2002107862A external-priority patent/JP2003303880A/ja
Publication of JP2003303880A publication Critical patent/JP2003303880A/ja
Publication of JP2003303880A5 publication Critical patent/JP2003303880A5/ja
Pending legal-status Critical Current

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JP2002107862A 2002-04-10 2002-04-10 積層層間絶縁膜構造を利用した配線構造およびその製造方法 Pending JP2003303880A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002107862A JP2003303880A (ja) 2002-04-10 2002-04-10 積層層間絶縁膜構造を利用した配線構造およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002107862A JP2003303880A (ja) 2002-04-10 2002-04-10 積層層間絶縁膜構造を利用した配線構造およびその製造方法

Publications (2)

Publication Number Publication Date
JP2003303880A JP2003303880A (ja) 2003-10-24
JP2003303880A5 true JP2003303880A5 (enExample) 2005-09-15

Family

ID=29391778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002107862A Pending JP2003303880A (ja) 2002-04-10 2002-04-10 積層層間絶縁膜構造を利用した配線構造およびその製造方法

Country Status (1)

Country Link
JP (1) JP2003303880A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7202177B2 (en) * 2003-10-08 2007-04-10 Lam Research Corporation Nitrous oxide stripping process for organosilicate glass
JP4916653B2 (ja) * 2003-10-28 2012-04-18 株式会社半導体エネルギー研究所 配線基板の作製方法及び半導体装置の作製方法
US8263983B2 (en) 2003-10-28 2012-09-11 Semiconductor Energy Laboratory Co., Ltd. Wiring substrate and semiconductor device
JP2005217371A (ja) * 2004-02-02 2005-08-11 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
TW200609118A (en) * 2004-05-21 2006-03-16 Jsr Corp Laminated body and semiconductor device
JP2006005190A (ja) 2004-06-18 2006-01-05 Renesas Technology Corp 半導体装置
JP4949656B2 (ja) * 2005-08-12 2012-06-13 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5145636B2 (ja) * 2005-12-27 2013-02-20 富士ゼロックス株式会社 液滴吐出ヘッド及び液滴吐出装置
KR101446226B1 (ko) 2006-11-27 2014-10-01 엘지디스플레이 주식회사 플렉서블 표시장치 및 그 제조 방법
JP6360276B2 (ja) * 2012-03-08 2018-07-18 東京エレクトロン株式会社 半導体装置、半導体装置の製造方法、半導体製造装置

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