JP2003264159A5 - - Google Patents

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Publication number
JP2003264159A5
JP2003264159A5 JP2002065969A JP2002065969A JP2003264159A5 JP 2003264159 A5 JP2003264159 A5 JP 2003264159A5 JP 2002065969 A JP2002065969 A JP 2002065969A JP 2002065969 A JP2002065969 A JP 2002065969A JP 2003264159 A5 JP2003264159 A5 JP 2003264159A5
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JP
Japan
Prior art keywords
catalyst
wiring material
wiring
electroless plating
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002065969A
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English (en)
Japanese (ja)
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JP2003264159A (ja
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Publication date
Application filed filed Critical
Priority to JP2002065969A priority Critical patent/JP2003264159A/ja
Priority claimed from JP2002065969A external-priority patent/JP2003264159A/ja
Publication of JP2003264159A publication Critical patent/JP2003264159A/ja
Publication of JP2003264159A5 publication Critical patent/JP2003264159A5/ja
Pending legal-status Critical Current

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JP2002065969A 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液 Pending JP2003264159A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002065969A JP2003264159A (ja) 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002065969A JP2003264159A (ja) 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液

Publications (2)

Publication Number Publication Date
JP2003264159A JP2003264159A (ja) 2003-09-19
JP2003264159A5 true JP2003264159A5 (enExample) 2005-07-14

Family

ID=29198018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002065969A Pending JP2003264159A (ja) 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液

Country Status (1)

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JP (1) JP2003264159A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206905A (ja) * 2004-01-23 2005-08-04 Ebara Corp 基板処理方法及び装置、並びに処理液
KR100578976B1 (ko) 2004-10-15 2006-05-12 삼성에스디아이 주식회사 접착력이 우수한 다층 박막 및 이의 제조방법
JP2006302972A (ja) * 2005-04-15 2006-11-02 Alps Electric Co Ltd 配線基板およびその製造方法
CN101466869A (zh) * 2006-06-16 2009-06-24 乔治洛德方法研究和开发液化空气有限公司 用于铜互连层的无电镀NiP附着和/或覆盖层
KR20080039412A (ko) 2006-06-26 2008-05-07 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
FR2982877B1 (fr) * 2011-11-18 2014-10-03 Alchimer Machine adaptee pour metalliser une cavite d'un substrat semi-conducteur ou conducteur telle qu'une structure du type via traversant
JP2013213263A (ja) * 2012-04-03 2013-10-17 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体
JP2013249495A (ja) * 2012-05-30 2013-12-12 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体
JP7011388B2 (ja) * 2016-12-28 2022-01-26 エスアイアイ・プリンテック株式会社 溝構造のめっき方法

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