MX2010003459A - Elemento de contacto electrico y un metodo de produccion del mismo. - Google Patents

Elemento de contacto electrico y un metodo de produccion del mismo.

Info

Publication number
MX2010003459A
MX2010003459A MX2010003459A MX2010003459A MX2010003459A MX 2010003459 A MX2010003459 A MX 2010003459A MX 2010003459 A MX2010003459 A MX 2010003459A MX 2010003459 A MX2010003459 A MX 2010003459A MX 2010003459 A MX2010003459 A MX 2010003459A
Authority
MX
Mexico
Prior art keywords
layer
base material
outer layer
tin
electrical contact
Prior art date
Application number
MX2010003459A
Other languages
English (en)
Inventor
Walter Muller
Helge Schmidt
Hannes Wendling
Jochen Horn
Original Assignee
Tyco Electronics Amp Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh filed Critical Tyco Electronics Amp Gmbh
Publication of MX2010003459A publication Critical patent/MX2010003459A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C23C28/025—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/028—Including graded layers in composition or in physical properties, e.g. density, porosity, grain size
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Contacts (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La presente invención se refiere a un método de producción de un elemento de contacto eléctrico, en el cual se forma una estructura de capas múltiples aplicando una capa de barrera de difusión a un material de base y por lo menos una capa metálica hecha de un metal a la capa de barrera de difusión, por lo menos una capa formada de estaño que se aplica como la capa metálica. La presente invención se refiere además a un elemento de contacto eléctrico con un material de base eléctricamente conductor y un recubrimiento que se forma en por lo menos una porción del material de base eléctricamente conductor, el recubrimiento que tiene una capa de barrera de difusión formada en el material de base y la capa externa que contiene estaño. Para evitar la formación de bigotes cuando se usa el elemento de contacto eléctrico, la presente invención propone, como una solución para el problema relacionado con el método, sujetar la estructura de capas múltiples a un tratamiento con calor de manera que por lo menos un elemento de la capa colocado bajo la capa externa de la estructura de capas múltiples se difunde en dicha capa externa y la capa externa tratada con calor comprende estaño. Para resolver el problema relacionado con el dispositivo de la invención, se propone que la capa externa del recubrimiento sea una capa perfectamente aleada mediante difusión de estaño y por lo menos un elemento metálico adicional.
MX2010003459A 2007-10-01 2008-09-25 Elemento de contacto electrico y un metodo de produccion del mismo. MX2010003459A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007047007A DE102007047007A1 (de) 2007-10-01 2007-10-01 Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
PCT/EP2008/008161 WO2009043536A1 (en) 2007-10-01 2008-09-25 Electrical contact element and a method of producing the same

Publications (1)

Publication Number Publication Date
MX2010003459A true MX2010003459A (es) 2010-08-09

Family

ID=40243917

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010003459A MX2010003459A (es) 2007-10-01 2008-09-25 Elemento de contacto electrico y un metodo de produccion del mismo.

Country Status (11)

Country Link
US (2) US20100311288A1 (es)
EP (1) EP2195885B1 (es)
JP (1) JP2010541139A (es)
CN (2) CN105226481A (es)
AT (1) ATE522955T1 (es)
DE (1) DE102007047007A1 (es)
ES (1) ES2370184T3 (es)
MX (1) MX2010003459A (es)
PL (1) PL2195885T3 (es)
PT (1) PT2195885E (es)
WO (1) WO2009043536A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
DE102010042526A1 (de) 2010-10-15 2012-04-19 Continental Automotive Gmbh Kontaktelement
US8574722B2 (en) 2011-05-09 2013-11-05 Tyco Electronics Corporation Corrosion resistant electrical conductor
JP2012237033A (ja) * 2011-05-11 2012-12-06 Murata Mfg Co Ltd 電子部品
DE102012208681A1 (de) * 2012-05-24 2013-11-28 Robert Bosch Gmbh Zinnbeschichtung, zugehöriges Kontaktelement und Verfahren zum Aufbringen einer Zinnbeschichtung
FR2993579B1 (fr) * 2012-07-20 2015-09-25 Tyco Electronics France Sas Procede de revetement et revetement pour contact a insertion a force
DE102012213505A1 (de) * 2012-07-31 2014-02-06 Tyco Electronics Amp Gmbh Schicht für ein elektrisches Kontaktelement, Schichtsystem und Verfahren zur Herstellung einer Schicht
US9224550B2 (en) 2012-12-26 2015-12-29 Tyco Electronics Corporation Corrosion resistant barrier formed by vapor phase tin reflow
EP2799595A1 (de) * 2013-05-03 2014-11-05 Delphi Technologies, Inc. Elektrisches Kontaktelement
DE102014117410B4 (de) * 2014-11-27 2019-01-03 Heraeus Deutschland GmbH & Co. KG Elektrisches Kontaktelement, Einpressstift, Buchse und Leadframe
JP6750545B2 (ja) * 2016-05-19 2020-09-02 株式会社オートネットワーク技術研究所 プレスフィット端子接続構造
US20180097325A1 (en) * 2016-10-03 2018-04-05 Tyco Electronics Corporation Corrosion Protection System and Method for Use with Electrical Contacts
JP6733491B2 (ja) * 2016-10-20 2020-07-29 株式会社オートネットワーク技術研究所 接続端子および接続端子の製造方法
JP6733493B2 (ja) 2016-10-25 2020-07-29 株式会社オートネットワーク技術研究所 電気接点、コネクタ端子対、およびコネクタ対
US11183779B2 (en) * 2017-07-12 2021-11-23 ept Holding GmbH & Co. KG Press-in pin and method for producing same
DE102018109059B4 (de) 2018-01-15 2020-07-23 Doduco Solutions Gmbh Elektrischer Einpress-Kontaktstift
JP7137764B2 (ja) * 2019-08-09 2022-09-15 株式会社オートネットワーク技術研究所 端子付き電線
CN111403937A (zh) * 2020-03-24 2020-07-10 东莞立德精密工业有限公司 金属端子及其制作方法
US11280014B2 (en) * 2020-06-05 2022-03-22 Macdermid Enthone Inc. Silver/tin electroplating bath and method of using the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756467A (en) * 1986-04-03 1988-07-12 Carlisle Corporation Solderable elements and method for forming same
US6080497A (en) * 1992-03-27 2000-06-27 The Louis Berkman Company Corrosion-resistant coated copper metal and method for making the same
DE4443461C1 (de) * 1994-12-07 1996-07-04 Wieland Werke Ag Band- bzw. drahtförmiges Verbundmaterial und seine Verwendung
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
DE19606116A1 (de) * 1996-02-20 1997-08-21 Berkenhoff Gmbh Elektrische Kontaktelemente
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
DE19752329A1 (de) * 1997-11-26 1999-05-27 Stolberger Metallwerke Gmbh Verfahren zur Herstellung eines metallischen Verbundbands
JP4489232B2 (ja) * 1999-06-14 2010-06-23 日鉱金属株式会社 コネクタ用めっき材料
US6905782B2 (en) * 2000-09-08 2005-06-14 Olin Corporation Tarnish deterring tin coating
EP1352993B1 (en) * 2001-01-19 2011-05-11 The Furukawa Electric Co., Ltd. A method for preparation of metal-plated material
JP3958719B2 (ja) * 2003-06-30 2007-08-15 大同メタル工業株式会社 摺動部材
US7391116B2 (en) * 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
DE10349584B4 (de) 2003-10-24 2005-06-09 Tyco Electronics Amp Gmbh Elektrisch leitende Verbindung zwischen einem Einpressstift und einer Buchse
JP4302545B2 (ja) * 2004-02-10 2009-07-29 株式会社オートネットワーク技術研究所 プレスフィット端子
JP4472751B2 (ja) * 2005-06-17 2010-06-02 富士通株式会社 はんだ処理方法

Also Published As

Publication number Publication date
PT2195885E (pt) 2011-11-02
EP2195885A1 (en) 2010-06-16
WO2009043536A8 (en) 2010-05-27
DE102007047007A1 (de) 2009-04-09
ES2370184T3 (es) 2011-12-13
US20170149191A1 (en) 2017-05-25
JP2010541139A (ja) 2010-12-24
CN101821906A (zh) 2010-09-01
EP2195885B1 (en) 2011-08-31
CN105226481A (zh) 2016-01-06
US20100311288A1 (en) 2010-12-09
WO2009043536A1 (en) 2009-04-09
PL2195885T3 (pl) 2012-01-31
ATE522955T1 (de) 2011-09-15

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