JP2005311353A - リードフレーム及びその製造方法 - Google Patents
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Abstract
【解決手段】 金属材質の基底金属層にニッケルまたはニッケル合金よりなるNiメッキ層を形成する段階と、Niメッキ層上にパラジウムまたはパラジウム合金よりなるPdメッキ層を形成する段階と、Niメッキ層及びPdメッキ層を熱処理する段階と、熱処理されたPdメッキ層上に保護メッキ層を形成する段階と、を含むリードフレームの製造方法。これにより、それぞれのメッキ層間のガルバニック電位差が小さくなって、メッキ層形成中に含まれる水素を外部に放出できる。
【選択図】 図9
Description
熱処理直後にAES(Auger Electron Spectroscopy)装置を使用してリードフレームの表面成分を分析した。この時のリードフレームは、保護メッキ層がその上側に形成される前の状態である。図7に示すように、前記リードフレームの最外郭に形成された金属拡散層の上面223’のパラジウム濃度は20%を占めており、金属拡散層の内部へ行くほど徐々にその濃度が減少する。これによって、熱処理段階(S31)を経ることにより、金属拡散層のパラジウム濃度が下面223”から上面223’へ行くほど徐々に高まる構造を持つことが分かる。
耐食性の評価は塩水噴霧試験により実施した。ここで、チャンバ温度は35℃の状態で、濃度5%の塩化ナトリウムが24時間当り40g/m2で噴霧されるようにした。この時のリードフレームは、基底金属層上にNiメッキ層、金属拡散層、及び保護メッキ層が形成された状態であった。
220 リード
221 基底金属層
222 Niメッキ層
223 金属拡散層
223’ 金属拡散層の上面
223” 金属拡散層の下面
223a Pdメッキ層
223b 酸化膜
224 保護メッキ層
Claims (20)
- 金属材質の基底層を提供する段階と、
前記基底層にニッケルまたはニッケル合金よりなるNiメッキ層を形成する段階と、
前記Niメッキ層上にパラジウムまたはパラジウム合金よりなるPdメッキ層を形成する段階と、
前記Niメッキ層及びPdメッキ層を熱処理する段階であって、少なくとも前記Pdメッキ層に拡散層の金属成分を有する拡散層を提供する、該段階と、
前記熱処理されたPdメッキ層上に保護メッキ層を形成する段階と、を含むリードフレームの製造方法。 - 前記熱処理段階で、熱処理温度は150℃以上であることを特徴とする請求項1に記載のリードフレームの製造方法。
- 前記熱処理段階は、前記パラジウムまたはパラジウム合金の一部が前記Niメッキ層に広がり、前記ニッケルまたはニッケル合金の一部が前記Pdメッキ層に広がって、前記パラジウム及びニッケルが含まれた金属拡散層を形成する段階を含み、
前記金属拡散層は、Niメッキ層と接する下面から上面までパラジウムの濃度が徐々に高くなるように形成されることを特徴とする請求項1に記載のリードフレームの製造方法。 - 前記金属拡散層の上面でのパラジウムの濃度は5%ないし80%であることを特徴とする請求項3に記載のリードフレームの製造方法。
- 前記熱処理段階は、前記金属拡散層の形成後に前記金属拡散層の表面に生成された酸化膜を除去する段階を含むことを特徴とする請求項1に記載のリードフレームの製造方法。
- 前記保護メッキ層はAuまたはAu合金よりなることを特徴とする請求項1に記載のリードフレームの製造方法。
- 前記Niメッキ層形成段階では、Niメッキ層を20μインチないし80μインチの厚さに形成し、前記Pdメッキ層形成段階では、Pdメッキ層を0.5μインチないし0.8μインチの厚さに形成し、前記保護メッキ層形成段階では、保護メッキ層を、Agを含むAu合金とし、その厚さが0.8ないし1.5μインチになるように形成することを特徴とする請求項6に記載のリードフレームの製造方法。
- 前記基底層は42アロイ素材よりなることを特徴とする請求項1に記載のリードフレームの製造方法。
- 金属材質の基底層にニッケル合金よりなる第1メッキ層を形成する段階と、
前記第1メッキ層を熱処理する段階と、
前記熱処理された第1メッキ層上に保護メッキ層を形成する段階と、を含むリードフレームの製造方法。 - 前記第1メッキ層はニッケルとパラジウムの合金よりなることを特徴とする請求項9に記載のリードフレームの製造方法。
- 前記第1メッキ層上にはパラジウムまたはパラジウム合金よりなる第2メッキ層が形成され、前記熱処理段階は、前記第1メッキ層及び第2メッキ層が形成された後に行われることを特徴とする請求項9に記載のリードフレームの製造方法。
- 前記熱処理段階は、前記パラジウムまたはパラジウム合金の一部が前記第1メッキ層に広がり、前記第1メッキ層のニッケルまたはニッケル合金の一部が前記第2メッキ層に広がって、前記パラジウム及びニッケルが含まれた金属拡散層を形成する段階を含み、
前記金属拡散層は、第1メッキ層と接する下面から上面までパラジウムの濃度が徐々に高くなるように形成されることを特徴とする請求項11に記載のリードフレームの製造方法。 - 前記金属拡散層の上面でのパラジウムの濃度は5%ないし80%であることを特徴とする請求項12に記載のリードフレームの製造方法。
- 前記熱処理段階で、熱処理温度は150℃以上であることを特徴とする請求項9に記載のリードフレームの製造方法。
- 前記熱処理段階は、前記金属拡散層の形成後に前記金属拡散層の表面に生成された酸化膜を除去する段階を含むことを特徴とする請求項9に記載のリードフレームの製造方法。
- 前記保護メッキ層はAuまたはAu合金よりなることを特徴とする請求項9に記載のリードフレームの製造方法。
- 前記基底層は42アロイ素材よりなることを特徴とする請求項9に記載のリードフレームの製造方法。
- 金属材質の基底層と、
前記基底層上に積層され、ニッケルまたはニッケル合金よりなるNiメッキ層と、
前記Niメッキ層の上部に形成されたものであり、パラジウム及びニッケルを含んで下面から上面までパラジウムの濃度が高まる金属拡散層と、
前記金属拡散層上に形成される保護メッキ層と、を具備するリードフレーム。 - 前記金属拡散層は、前記Niメッキ層上にパラジウムまたはパラジウム合金よりなるPdメッキ層が形成された後に熱処理されて得られることを特徴とする請求項18に記載のリードフレーム。
- 前記保護メッキ層はAuまたはAu合金よりなることを特徴とする請求項18に記載のリードフレーム。
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