CN105226481A - 电接触元件及其产生方法 - Google Patents

电接触元件及其产生方法 Download PDF

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CN105226481A
CN105226481A CN201510552520.8A CN201510552520A CN105226481A CN 105226481 A CN105226481 A CN 105226481A CN 201510552520 A CN201510552520 A CN 201510552520A CN 105226481 A CN105226481 A CN 105226481A
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tin
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diffusion barrier
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约切恩.霍恩
沃尔特.米勒
赫尔格.施米特
汉尼斯.温德林
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TE Connectivity Germany GmbH
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Tyco Electronics AMP GmbH
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Abstract

本发明涉及产生电接触元件的方法，其中多层结构通过将扩散阻隔层施加到基材并将由金属形成的至少一个金属层施加到扩散层而形成，由锡形成的至少一个层施加作为金属层。本发明还涉及具有导电基材和形成在导电基材的至少一部分上的涂层的电接触元件，该涂层具有形成在基材上的扩散阻隔层，该外层包含锡。为了防止当利用电连接器元件时形成须线，作为与方法相关问题的解决方案，本发明提出将多层结构进行热处理以使得位于多层结构的外层下面的层的至少一种元素扩散到所述外层中并且所述热处理过的外层包括锡。为了解决本发明的与装置相关的问题，提出涂层的外层为通过将锡和至少一个其它金属元素进行扩散而彻底合金化的层。

Description

电接触元件及其产生方法
本申请是申请日为2008年9月25日、申请号为200880109844.2、发明名称为“电接触元件及其产生方法”的中国发明专利申请的分案申请。
技术领域
本发明涉及产生电接触元件的方法。本发明还涉及所述的电接触元件。
背景技术
电接触元件的要求是很多的并且是不同的。这样，接触元件可以例如用作插入式触头。在这种情形下，电接触元件要求能够通过尽可能小的插入力来重复地插入和拔出，而没有明显的接触电阻改变。首先，用于产生电气系统的电接触元件，例如防抱死制动系统(ABS)需要可靠地保证电接触并防止误连接。
从DE10349584A1知晓一种接触元件。在其中公开的接触元件包括挤压配合触头，并且该文献提出通过提供具有层厚在0.1和0.8μm之间的外层的电接触元件来防止将挤压配合的管脚压入凹槽中时形成破损(chip)。
已知一种电接触元件，其具有由例如纯锡形成的接触表面，该电接触元件具有形成锡须的倾向。锡须会在电气组件中引起故障。
但是，减小层厚并不总是能防止须线的形成。仅仅是轻微的磨损和磨损的锡的累积都会引起产生须线。
发明内容
基于上述的已知的问题，本发明的一个目的是提供一种方法，通过该方法锡须的形成得以避免。本发明的另一目的是提供一种接触元件，该接触元件没有形成锡须的任何风险。
本发明的方法方面是通过权利要求1所述的方法实现的，其特征在于多层结构的热处理，该热处理使得位于多层结构的外层下面的层的至少一种元素扩散到所述外层中，并且所述热处理外层包括锡。根据本发明，扩散阻隔层施加到基材上，从而防止基材扩散到外层中。根据本发明的扩散阻隔层相应地用作扩散阻隔并防止外层与基材的元素形成合金。至少一个金属层施加到扩散阻隔层，由锡形成的至少一个层施加作为金属层。相应地，例如，要么仅纯锡层施加到扩散阻隔层，要么纯锡层和另一金属层被施加到扩散阻隔层。
根据本发明，多层结构包括扩散阻隔层，并且至少一个金属层被热处理，也就是优选地通过回火方法进行处理。多层结构的这种热处理使得至少一种元素扩散到外层中。作为根据本发明的热处理的结果，多层结构的外层实际完全被其下的层的至少一种元素渗透并因此形成至少两种金属元素。外层优选地进行热处理以使得其单独形成或者实际上仅形成至少两种金属元素，也就是，作为扩散的结果，位于外层下面的层中的元素完全或者基本完全渗透外层直达该层的表面。作为至少两种金属元素的相关的混合的结果，可靠地防止形成锡须。在外层上形成合金通过适当的合金组分额外地提供增大连接器元件的表面的耐磨性的可能性。热处理的温度和持续时间依赖于用于形成金属层的金属和待实现的层厚。
扩散到外层中的元素可以例如来自扩散阻隔层。
优选地，获得在整个多层结构中的热促进扩散。这样，热处理外层得以形成，其包括具有锡和至少一种其它金属元素的混合物。热处理外层相应地不是纯锡层，从而有效地防止形成锡须的危险。
根据本发明的方法的优选的示例性实施例，外层完全与至少一种元素形成合金直达表面。热处理优选地进行为使得存在于下层中的元素扩散直达外层的表面，也就是在外层的整个厚度之上。生成的锡合金层可以由混杂晶体、混晶或者金属间化合物组成。
根据该本发明的方法的一个进一步优选的改进方式具有至少两个金属层，其由施加到扩散阻隔层的不同金属形成，并且层的元素通过扩散混合在一起。除了锡层之外，根据该优选的实施例，另一金属层相应地施加到扩散阻隔层。锡层不必被施加作为外层。关键的因素仅仅在于，热处理外层包括锡和至少一种其它的金属元素。各金属层分别施加到扩散阻隔层。这可以是作为物理气相淀积(PVD)、化学汽相淀积(CVD)、周期性反向电镀等的结果发生。各个层优选地形成为具有相互平行的平层的夹心结构。交替施加的不同金属层的数量由期望的意在的应用或者期望的层厚确定。通过随后的热处理，金属层优选地被完全合金化，以便通过混合锡和至少一个其它的金属元素而提供形成在扩散阻隔层上的外层。取决于所用的元素，中间层可以例如形成在获得的外层和扩散阻隔层之间，该中间层由金属层的元素和扩散阻隔层的元素的混合物形成。
根据一个优选实施例，外层由锡形成。施加的锡外层特别地纯锡外层通过热处理的影响而通过扩散与至少一种其它元素混合。作为热处理的结果，锡层完全与至少一种其它元素合金化，由此不是由纯锡构成的外层得以获得，其没有形成须线的倾向。
根据另一优选的改进方式，形成在外层之下的至少一个金属层是由银、金、铋、铁、铟、锌、镉、钯和/或锡组成。例如，锡/银层的组合被施加到扩散阻隔层，其中多个锡层和多个银层可以彼此交替地施加彼此之上，以便在合理处理时间的热处理后获得相对大厚度的均一外层。这样，可以产生具有大于2μm的相对大的层厚的外层。这特别地带来如下优点：接触表面可以被提供用于连接器触头，其具有有利的摩擦学特征。
取决于需要符合的要求，磷层也可以与例如锡或银层组合施加，以使得通过热处理磷扩散到邻接层中。
本发明所基于的与装置相关的问题通过根据权利要求9所述的电接触元件解决，其特征在于，涂层的外层是通过将锡和至少一种其它金属元素扩散而混合的层。外层特别地优选为至少两种不同元素的基本完全的混合物。用于描述本发明的目的，接触元件可以是例如挤压配合的管脚端子或者连接器触头。根据本发明的完全合金化的外层被至少提供在一接触元件与另一接触元件接触的区域中。例如，完全合金化的外层形成挤压配合管脚等的连接器接触的基础表面。
根据一特定实施例，外层是完全合金化的层，也就是被锡和至少一种其它元素完全渗透的层。这些元素被特定混合在一起直达外层的表面。
附图说明
本发明的进一步的细节、优点和特征将从下面对示例性实施例以及附图的描述而变得明显，其中：
图1a和1b是根据本发明的电连接器元件的多层结构的一个示例性实施例在热处理前后的第一示意性截面图；
图2示出对比例，其示出不是根据本发明的连接器元件的多层结构；
图3a-3d示出根据本发明的连接器元件的另一示例性实施例；以及
图4示出多层结构2d。
具体实施方式
图1a示出挤压配合管脚的多层结构2，其中由镍形成的扩散阻隔层4已经被施加到基材6。由锡形成的2μm厚的外层8形成在镍扩散阻隔层4上。
在施加镍扩散阻隔层4和作为纯锡层的外层8之后，多层结构2在90℃下热处理4小时。
热处理的持续时间和温度取决于所用材料和期望的层厚。但是，因为外层8是由锡形成，所以热处理温度不应超过锡的熔点，即232℃。
一旦热处理完成，生成的热处理多层结构2a包括热处理过的再结晶外层8a(参照图1b)。该层8a由锡和镍元素的混合物组成。由于执行了热处理，镍元素已经从扩散阻隔层4扩散出来进入位于其上的外层8中。如从图1b清楚看出的，执行的热处理已经使得外层8完全彻底地混合。热处理过的外层8a包括锡和镍两种元素。特别地，热处理已经具有一定效果，即镍元素扩散直达外层8的表面10，从而保证热处理过的外层8a在靠近表面10处不包含任何纯锡。这样，可以提供具有接触表面的挤压配合的管脚，其没有形成锡须的任何风险。
与根据本发明的上述示例性实施例相反，图2示出对比例，其中热处理过的外层8b是纯锡层。
由于不完全的热处理，根据图2所示的对比例的外层8b不是包括锡和镍元素的混合物的彻底合金化层。特别地，由于不完全的热处理，镍元素没有扩散直达外层8b的表面10。尽管已经实现锡和镍元素的混合(如中间层12所示例的)，但是该对比例存在形成锡须的风险，因为外层8b是纯锡层。
图3a-3d示出根据本发明的另一示例性实施例，其中多个层已经施加到镍扩散阻隔层4。
图3a示出由银形成的层14a，其已经形成在扩散阻隔层4上。取决于期望的层厚，还可以施加多个银层14a，如图3b所示。在那里，银层14a已经与锡层14b交替地施加到扩散阻隔层4。银层和锡层14a、14b的交替施加形成夹心结构，其中外层8是锡层14b。
生成的多层结构2b然后根据本发明的方法进行热处理，由此各层14a、14b完全合金化以形成由锡和银元素组成的热处理过的外层8a。这样，避免纯锡层作为外层8a的成分(参照图3c)。
取决于形成的层的冶金特征，如图3d所示，可能在热处理过的外层8a和扩散阻隔层4a之间形成中间层12a。不同于图2所示的对比例，根据图3d的多层结构2c没有形成须线的任何风险，因为外层8a是彻底合金化的外层8a。
如图4所示，多层结构2d可以得以形成，其由三种不同的元素形成。图4示出多层结构2d，其中银层16a、磷层16b和锡层16c交替地形成在扩散阻隔层4上以使得外层8由锡层16c形成。
该多层结构2d根据本发明进行热处理以使得多层16a、16b、16c被彻底合金化，如上面参照图3c所述。

Claims (12)

1.一种产生电接触元件的方法，其中多层结构(2)通过将扩散阻隔层(4)施加到基材(6)以及将由金属形成的至少一个金属层(14)施加到所述扩散阻隔层(4)而形成，由锡形成的至少一个层被作为所述金属层施加，其特征在于，热处理所述多层结构(2)以使得位于所述多层结构(2)的外层(8)下面的所述金属层(14)的至少一种元素扩散到所述外层(8)中并且所述热处理过的外层(8a)包括锡，磷层(16b)形成在所述外层(8)下面，所述磷层(16b)扩散到所述外层(8)中。
2.如权利要求1所述的方法，其特征在于，执行完全遍及所述多层结构(2)的热促进扩散。
3.如权利要求1或2所述的方法，其特征在于，所述外层(8)与至少一种元素彻底合金化直达其表面(10)。
4.如权利要求1所述的方法，其特征在于，由不同金属形成的至少两个金属层(14)被施加到所述扩散阻隔层(4)并且所述至少两个金属层(14)的元素通过扩散混合在一起。
5.根据权利要求1所述的方法，其特征在于，所述外层(8)是由锡形成。
6.如权利要求1所述的方法，其特征在于，至少一个金属层(14)选自以下的组：银、金、铋、铁、铟、锌、镉、锡和钯，其形成在所述外层(8)的下面。
7.如权利要求1所述的方法，其特征在于，所述扩散阻隔层(4)是由镍形成。
8.一种电接触元件，具有：
导电基材(6)；和
涂层(2)，其形成在所述导电基材(6)的至少一部分上，所述涂层(2)包括形成在所述基材(6)上的扩散阻隔层(4)和包含锡的外层(8a)，
其特征在于，所述涂层的所述外层(8a)是通过回火方法将锡和至少一种其它金属元素进行扩散而混合的层(8a)。
9.如权利要求8所述的接触元件，其特征在于，所述外层(8a)是彻底合金化的层。
10.如权利要求8或9所述的接触元件，其特征在于，所述外层(8a)包括包含锡和至少一种元素的合金，该元素选自以下的组：银、金、铋、铁、铟、锌、镉和钯。
11.如权利要求10所述的接触元件，其特征在于，所述合金额外地包括磷。
12.根据权利要求8所述的接触元件，其特征在于，所述扩散阻隔层(4)由镍形成。
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