JP2003224128A5 - - Google Patents
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- Publication number
- JP2003224128A5 JP2003224128A5 JP2002022190A JP2002022190A JP2003224128A5 JP 2003224128 A5 JP2003224128 A5 JP 2003224128A5 JP 2002022190 A JP2002022190 A JP 2002022190A JP 2002022190 A JP2002022190 A JP 2002022190A JP 2003224128 A5 JP2003224128 A5 JP 2003224128A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- catalyst
- electroless plating
- wiring
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 32
- 239000002184 metal Substances 0.000 claims 32
- 239000003054 catalyst Substances 0.000 claims 17
- 238000007772 electroless plating Methods 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 17
- 230000004888 barrier function Effects 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 238000000137 annealing Methods 0.000 claims 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 5
- 238000007747 plating Methods 0.000 claims 5
- 229910052709 silver Inorganic materials 0.000 claims 5
- 239000004332 silver Substances 0.000 claims 5
- 238000009713 electroplating Methods 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002022190A JP3812891B2 (ja) | 2002-01-30 | 2002-01-30 | 配線形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002022190A JP3812891B2 (ja) | 2002-01-30 | 2002-01-30 | 配線形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003224128A JP2003224128A (ja) | 2003-08-08 |
| JP2003224128A5 true JP2003224128A5 (enExample) | 2005-07-14 |
| JP3812891B2 JP3812891B2 (ja) | 2006-08-23 |
Family
ID=27745241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002022190A Expired - Fee Related JP3812891B2 (ja) | 2002-01-30 | 2002-01-30 | 配線形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3812891B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005174961A (ja) * | 2003-12-05 | 2005-06-30 | Ebara Corp | 基板処理方法及び装置 |
| JP2006009131A (ja) * | 2004-06-29 | 2006-01-12 | Ebara Corp | 基板処理方法及び装置 |
| EP1717344A4 (en) * | 2004-01-23 | 2008-08-20 | Ebara Corp | PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE |
| JP2006009130A (ja) * | 2004-06-29 | 2006-01-12 | Ebara Corp | 基板処理方法及び装置 |
| US7335588B2 (en) * | 2005-04-15 | 2008-02-26 | International Business Machines Corporation | Interconnect structure and method of fabrication of same |
| JP5022828B2 (ja) * | 2006-09-14 | 2012-09-12 | 富士フイルム株式会社 | 基板用水切り剤、これを使用する水切り方法及び乾燥方法 |
| JP4936878B2 (ja) * | 2006-12-25 | 2012-05-23 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP2013052361A (ja) * | 2011-09-05 | 2013-03-21 | Fujifilm Corp | 化学浴析出装置 |
| JP7011388B2 (ja) * | 2016-12-28 | 2022-01-26 | エスアイアイ・プリンテック株式会社 | 溝構造のめっき方法 |
-
2002
- 2002-01-30 JP JP2002022190A patent/JP3812891B2/ja not_active Expired - Fee Related
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