JP3812891B2 - 配線形成方法 - Google Patents

配線形成方法 Download PDF

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Publication number
JP3812891B2
JP3812891B2 JP2002022190A JP2002022190A JP3812891B2 JP 3812891 B2 JP3812891 B2 JP 3812891B2 JP 2002022190 A JP2002022190 A JP 2002022190A JP 2002022190 A JP2002022190 A JP 2002022190A JP 3812891 B2 JP3812891 B2 JP 3812891B2
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JP
Japan
Prior art keywords
substrate
plating
metal
plating solution
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002022190A
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English (en)
Japanese (ja)
Other versions
JP2003224128A5 (enExample
JP2003224128A (ja
Inventor
裕章 井上
憲二 中村
守治 松本
真 金山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
JCU Corp
Original Assignee
Ebara Corp
Ebara Udylite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Ebara Udylite Co Ltd filed Critical Ebara Corp
Priority to JP2002022190A priority Critical patent/JP3812891B2/ja
Publication of JP2003224128A publication Critical patent/JP2003224128A/ja
Publication of JP2003224128A5 publication Critical patent/JP2003224128A5/ja
Application granted granted Critical
Publication of JP3812891B2 publication Critical patent/JP3812891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemically Coating (AREA)
JP2002022190A 2002-01-30 2002-01-30 配線形成方法 Expired - Fee Related JP3812891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002022190A JP3812891B2 (ja) 2002-01-30 2002-01-30 配線形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002022190A JP3812891B2 (ja) 2002-01-30 2002-01-30 配線形成方法

Publications (3)

Publication Number Publication Date
JP2003224128A JP2003224128A (ja) 2003-08-08
JP2003224128A5 JP2003224128A5 (enExample) 2005-07-14
JP3812891B2 true JP3812891B2 (ja) 2006-08-23

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ID=27745241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002022190A Expired - Fee Related JP3812891B2 (ja) 2002-01-30 2002-01-30 配線形成方法

Country Status (1)

Country Link
JP (1) JP3812891B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005174961A (ja) * 2003-12-05 2005-06-30 Ebara Corp 基板処理方法及び装置
JP2006009130A (ja) * 2004-06-29 2006-01-12 Ebara Corp 基板処理方法及び装置
EP1717344A4 (en) * 2004-01-23 2008-08-20 Ebara Corp PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE
JP2006009131A (ja) * 2004-06-29 2006-01-12 Ebara Corp 基板処理方法及び装置
US7335588B2 (en) * 2005-04-15 2008-02-26 International Business Machines Corporation Interconnect structure and method of fabrication of same
JP5022828B2 (ja) * 2006-09-14 2012-09-12 富士フイルム株式会社 基板用水切り剤、これを使用する水切り方法及び乾燥方法
JP4936878B2 (ja) * 2006-12-25 2012-05-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2013052361A (ja) * 2011-09-05 2013-03-21 Fujifilm Corp 化学浴析出装置
JP7011388B2 (ja) * 2016-12-28 2022-01-26 エスアイアイ・プリンテック株式会社 溝構造のめっき方法

Also Published As

Publication number Publication date
JP2003224128A (ja) 2003-08-08

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