JP2003264159A - 触媒処理方法及び触媒処理液 - Google Patents

触媒処理方法及び触媒処理液

Info

Publication number
JP2003264159A
JP2003264159A JP2002065969A JP2002065969A JP2003264159A JP 2003264159 A JP2003264159 A JP 2003264159A JP 2002065969 A JP2002065969 A JP 2002065969A JP 2002065969 A JP2002065969 A JP 2002065969A JP 2003264159 A JP2003264159 A JP 2003264159A
Authority
JP
Japan
Prior art keywords
catalyst
plating
substrate
wiring
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002065969A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003264159A5 (enExample
Inventor
Hiroaki Inoue
裕章 井上
Kenji Nakamura
憲二 中村
Moriharu Matsumoto
守治 松本
Makoto Kanayama
真 金山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
JCU Corp
Original Assignee
Ebara Corp
Ebara Udylite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Ebara Udylite Co Ltd filed Critical Ebara Corp
Priority to JP2002065969A priority Critical patent/JP2003264159A/ja
Publication of JP2003264159A publication Critical patent/JP2003264159A/ja
Publication of JP2003264159A5 publication Critical patent/JP2003264159A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2002065969A 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液 Pending JP2003264159A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002065969A JP2003264159A (ja) 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002065969A JP2003264159A (ja) 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液

Publications (2)

Publication Number Publication Date
JP2003264159A true JP2003264159A (ja) 2003-09-19
JP2003264159A5 JP2003264159A5 (enExample) 2005-07-14

Family

ID=29198018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002065969A Pending JP2003264159A (ja) 2002-03-11 2002-03-11 触媒処理方法及び触媒処理液

Country Status (1)

Country Link
JP (1) JP2003264159A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206905A (ja) * 2004-01-23 2005-08-04 Ebara Corp 基板処理方法及び装置、並びに処理液
WO2006112298A1 (ja) * 2005-04-15 2006-10-26 Alps Electric Co., Ltd. 配線基板およびその製造方法
WO2008001697A1 (fr) * 2006-06-26 2008-01-03 Tokyo Electron Limited Procédé et appareil de traitement de substrats
US7545043B2 (en) 2004-10-15 2009-06-09 Samsung Sdi Co., Ltd. Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
JP2009540585A (ja) * 2006-06-16 2009-11-19 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 銅相互接続層用の無電解ＮｉＰ接着及び／又はキャップ層
WO2013150828A1 (ja) * 2012-04-03 2013-10-10 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
JP2013249495A (ja) * 2012-05-30 2013-12-12 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体
KR20140105766A (ko) * 2011-11-18 2014-09-02 알쉬메 관통 비아 구조와 같은 반-도전성 또는 도전성 기판의 캐비티를 도금하기에 적합한 기계
JP2018103559A (ja) * 2016-12-28 2018-07-05 エスアイアイ・プリンテック株式会社 溝構造のめっき方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206905A (ja) * 2004-01-23 2005-08-04 Ebara Corp 基板処理方法及び装置、並びに処理液
US7799677B2 (en) 2004-10-15 2010-09-21 Samsung Sdi Co., Ltd. Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
US7545043B2 (en) 2004-10-15 2009-06-09 Samsung Sdi Co., Ltd. Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
WO2006112298A1 (ja) * 2005-04-15 2006-10-26 Alps Electric Co., Ltd. 配線基板およびその製造方法
JP2009540585A (ja) * 2006-06-16 2009-11-19 レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード 銅相互接続層用の無電解ＮｉＰ接着及び／又はキャップ層
JP4740330B2 (ja) * 2006-06-26 2011-08-03 東京エレクトロン株式会社 基板処理方法および基板処理装置
JPWO2008001698A1 (ja) * 2006-06-26 2009-11-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
JPWO2008001697A1 (ja) * 2006-06-26 2009-11-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
KR100958557B1 (ko) * 2006-06-26 2010-05-18 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
WO2008001698A1 (fr) * 2006-06-26 2008-01-03 Tokyo Electron Limited Procédé et appareil de traitement de substrats
WO2008001697A1 (fr) * 2006-06-26 2008-01-03 Tokyo Electron Limited Procédé et appareil de traitement de substrats
US8062955B2 (en) 2006-06-26 2011-11-22 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
KR20140105766A (ko) * 2011-11-18 2014-09-02 알쉬메 관통 비아 구조와 같은 반-도전성 또는 도전성 기판의 캐비티를 도금하기에 적합한 기계
JP2014533887A (ja) * 2011-11-18 2014-12-15 アルキメール 貫通ビア構造等の半導電性又は導電性基板の空洞を金属化する機械
KR102031817B1 (ko) * 2011-11-18 2019-10-14 아베니 관통 비아 구조와 같은 반-도전성 또는 도전성 기판의 캐비티를 도금하기에 적합한 기계
US10460945B2 (en) 2011-11-18 2019-10-29 Alchimer Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
JP2013213263A (ja) * 2012-04-03 2013-10-17 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体
WO2013150828A1 (ja) * 2012-04-03 2013-10-10 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
JP2013249495A (ja) * 2012-05-30 2013-12-12 Tokyo Electron Ltd めっき処理装置、めっき処理方法および記憶媒体
JP2018103559A (ja) * 2016-12-28 2018-07-05 エスアイアイ・プリンテック株式会社 溝構造のめっき方法

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