JP2003201324A5 - - Google Patents
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- Publication number
- JP2003201324A5 JP2003201324A5 JP2001400619A JP2001400619A JP2003201324A5 JP 2003201324 A5 JP2003201324 A5 JP 2003201324A5 JP 2001400619 A JP2001400619 A JP 2001400619A JP 2001400619 A JP2001400619 A JP 2001400619A JP 2003201324 A5 JP2003201324 A5 JP 2003201324A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- hydrogen
- hydroxyl
- methylol
- contain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 33
- -1 methylol group Chemical group 0.000 claims 27
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 26
- 229920005989 resin Polymers 0.000 claims 20
- 239000011347 resin Substances 0.000 claims 20
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 19
- 125000000217 alkyl group Chemical group 0.000 claims 19
- 125000004432 carbon atom Chemical group C* 0.000 claims 19
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 claims 19
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 claims 19
- 229910052736 halogen Inorganic materials 0.000 claims 19
- 150000002367 halogens Chemical class 0.000 claims 19
- 229910052739 hydrogen Inorganic materials 0.000 claims 19
- 239000001257 hydrogen Substances 0.000 claims 19
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims 19
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 19
- 229920000642 polymer Polymers 0.000 claims 18
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 15
- 150000002790 naphthalenes Chemical class 0.000 claims 10
- 239000011159 matrix material Substances 0.000 claims 8
- 238000009833 condensation Methods 0.000 claims 7
- 230000005494 condensation Effects 0.000 claims 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 5
- 239000011342 resin composition Substances 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000001459 lithography Methods 0.000 claims 3
- 150000005209 naphthoic acids Chemical class 0.000 claims 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical group C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims 2
- NTCCNERMXRIPTR-UHFFFAOYSA-N 2-hydroxy-1-naphthaldehyde Chemical compound C1=CC=CC2=C(C=O)C(O)=CC=C21 NTCCNERMXRIPTR-UHFFFAOYSA-N 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 2
- 230000032050 esterification Effects 0.000 claims 2
- 238000005886 esterification reaction Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 125000001424 substituent group Chemical group 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229940126062 Compound A Drugs 0.000 claims 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
- 150000001299 aldehydes Chemical class 0.000 claims 1
- 239000003513 alkali Substances 0.000 claims 1
- 238000004581 coalescence Methods 0.000 claims 1
- 125000001624 naphthyl group Chemical group 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000002952 polymeric resin Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001400619A JP3929307B2 (ja) | 2001-12-28 | 2001-12-28 | 水性アルカリ可溶性樹脂および感光性樹脂組成物 |
| TW091124701A TW594392B (en) | 2001-12-28 | 2002-10-24 | Aqueous alkali-soluble resins, radiation sensitive resists, photo mask, and method of manufacturing electronics device |
| CNB021513872A CN1264887C (zh) | 2001-12-28 | 2002-11-20 | 水性碱可溶性树脂、感光性树脂组合物、光掩模和电子装置的制造方法 |
| US10/299,692 US7005216B2 (en) | 2001-12-28 | 2002-11-20 | Photo mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001400619A JP3929307B2 (ja) | 2001-12-28 | 2001-12-28 | 水性アルカリ可溶性樹脂および感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003201324A JP2003201324A (ja) | 2003-07-18 |
| JP2003201324A5 true JP2003201324A5 (enExample) | 2005-06-23 |
| JP3929307B2 JP3929307B2 (ja) | 2007-06-13 |
Family
ID=19189640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001400619A Expired - Fee Related JP3929307B2 (ja) | 2001-12-28 | 2001-12-28 | 水性アルカリ可溶性樹脂および感光性樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7005216B2 (enExample) |
| JP (1) | JP3929307B2 (enExample) |
| CN (1) | CN1264887C (enExample) |
| TW (1) | TW594392B (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308002A (ja) * | 2000-02-15 | 2001-11-02 | Canon Inc | フォトマスクを用いたパターン作製方法、及びパターン作製装置 |
| KR100512171B1 (ko) * | 2003-01-24 | 2005-09-02 | 삼성전자주식회사 | 하층 레지스트용 조성물 |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| US7127830B2 (en) * | 2004-08-02 | 2006-10-31 | Wafertech, Llc | Reticle carrier apparatus and method that tilts reticle for drying |
| CN100409073C (zh) * | 2004-12-30 | 2008-08-06 | 财团法人工业技术研究院 | 碱可溶树脂与包含该树脂的感旋光性组合物 |
| US7460209B2 (en) * | 2005-03-28 | 2008-12-02 | Intel Corporation | Advanced mask patterning with patterning layer |
| KR101069434B1 (ko) * | 2009-03-10 | 2011-09-30 | 주식회사 하이닉스반도체 | 자기조립분자층을 이용한 포토마스크 제조방법 |
| JP5549107B2 (ja) * | 2009-04-20 | 2014-07-16 | Ｄｉｃ株式会社 | ノボラック樹脂の製造方法 |
| JP5742715B2 (ja) * | 2009-09-15 | 2015-07-01 | 三菱瓦斯化学株式会社 | 芳香族炭化水素樹脂及びリソグラフィー用下層膜形成組成物 |
| EP2532710B1 (en) * | 2010-02-03 | 2018-08-22 | DIC Corporation | Phenol resin composition, curable resin composition, cured products thereof, and printed circuit board |
| JP5630181B2 (ja) * | 2010-03-05 | 2014-11-26 | 大日本印刷株式会社 | ネガ型レジスト組成物、当該レジスト組成物を用いたレリーフパターンの製造方法及びフォトマスクの製造方法 |
| EP2660257B1 (en) * | 2010-12-28 | 2018-09-19 | Mitsubishi Gas Chemical Company, Inc. | Aromatic hydrocarbon resin, composition for forming lithographic underlayer film, and method for forming multilayer resist pattern |
| JP5485188B2 (ja) * | 2011-01-14 | 2014-05-07 | 信越化学工業株式会社 | レジスト下層膜材料及びこれを用いたパターン形成方法 |
| JP5953811B2 (ja) * | 2012-02-24 | 2016-07-20 | Dic株式会社 | ポジ型フォトレジスト組成物 |
| WO2015083748A1 (ja) * | 2013-12-04 | 2015-06-11 | 日本化薬株式会社 | フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物 |
| CN106458812B (zh) * | 2014-05-15 | 2019-03-26 | Dic株式会社 | 含改性酚羟基化合物、含改性酚羟基化合物的制法、感光性组合物、保护材料及保护涂膜 |
| WO2015190233A1 (ja) * | 2014-06-12 | 2015-12-17 | Dic株式会社 | 永久膜用感光性組成物、レジスト材料、及び塗膜 |
| JP6028883B1 (ja) * | 2015-01-16 | 2016-11-24 | Dic株式会社 | レジスト永久膜用硬化性組成物及びレジスト永久膜 |
| KR102832675B1 (ko) * | 2016-09-20 | 2025-07-14 | 삼성전자주식회사 | 레티클 패턴들의 임계치수 보정 방법 및 그를 포함하는 레티클 제조 방법 |
| KR102646796B1 (ko) * | 2017-09-13 | 2024-03-13 | 마테리온 코포레이션 | 다중스펙트럼 필터 배열 상의 불투명 애퍼처 마스크로서의 포토레지스트 |
| US11675266B2 (en) * | 2021-04-15 | 2023-06-13 | Industrial Technology Research Institute | Photosensitive compound, photosensitive composition, and patterning method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3105234B2 (ja) | 1990-09-28 | 2000-10-30 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JPH05289307A (ja) | 1992-04-13 | 1993-11-05 | Matsushita Electric Ind Co Ltd | レチクルおよびレチクル製造方法 |
| JP3749083B2 (ja) * | 2000-04-25 | 2006-02-22 | 株式会社ルネサステクノロジ | 電子装置の製造方法 |
-
2001
- 2001-12-28 JP JP2001400619A patent/JP3929307B2/ja not_active Expired - Fee Related
-
2002
- 2002-10-24 TW TW091124701A patent/TW594392B/zh not_active IP Right Cessation
- 2002-11-20 US US10/299,692 patent/US7005216B2/en not_active Expired - Lifetime
- 2002-11-20 CN CNB021513872A patent/CN1264887C/zh not_active Expired - Fee Related
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