JP2003077869A5 - - Google Patents

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Publication number
JP2003077869A5
JP2003077869A5 JP2001368158A JP2001368158A JP2003077869A5 JP 2003077869 A5 JP2003077869 A5 JP 2003077869A5 JP 2001368158 A JP2001368158 A JP 2001368158A JP 2001368158 A JP2001368158 A JP 2001368158A JP 2003077869 A5 JP2003077869 A5 JP 2003077869A5
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JP
Japan
Prior art keywords
semiconductor wafer
support substrate
grinding
cutting
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001368158A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003077869A (ja
JP4074758B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2001368158A external-priority patent/JP4074758B2/ja
Priority to JP2001368158A priority Critical patent/JP4074758B2/ja
Priority to US10/252,359 priority patent/US6869830B2/en
Priority to SG200205769A priority patent/SG120887A1/en
Priority to TW91122042A priority patent/TW579540B/zh
Priority to KR1020020059055A priority patent/KR100816641B1/ko
Priority to EP02025405A priority patent/EP1316992B1/de
Priority to DE60210910T priority patent/DE60210910T2/de
Priority to CNB021548978A priority patent/CN1263088C/zh
Publication of JP2003077869A publication Critical patent/JP2003077869A/ja
Publication of JP2003077869A5 publication Critical patent/JP2003077869A5/ja
Publication of JP4074758B2 publication Critical patent/JP4074758B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001368158A 2001-06-18 2001-12-03 半導体ウエーハの加工方法 Expired - Lifetime JP4074758B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2001368158A JP4074758B2 (ja) 2001-06-18 2001-12-03 半導体ウエーハの加工方法
US10/252,359 US6869830B2 (en) 2001-12-03 2002-09-24 Method of processing a semiconductor wafer
SG200205769A SG120887A1 (en) 2001-12-03 2002-09-24 Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same
TW91122042A TW579540B (en) 2001-06-18 2002-09-25 Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same
KR1020020059055A KR100816641B1 (ko) 2001-12-03 2002-09-28 반도체 웨이퍼 가공방법 및 이것에 사용되는 지지기판
DE60210910T DE60210910T2 (de) 2001-12-03 2002-11-14 Verfahren zur Bearbeitung einer Halbleiterscheibe, in dem ein laminiertes Substrat als Stütze für diese Scheibe verwendet wird
EP02025405A EP1316992B1 (de) 2001-12-03 2002-11-14 Verfahren zur Bearbeitung einer Halbleiterscheibe, in dem ein laminiertes Substrat als Stütze für diese Scheibe verwendet wird
CNB021548978A CN1263088C (zh) 2001-12-03 2002-12-03 一种处理半导体晶片的方法和所用的半导体晶片的衬底

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001182766 2001-06-18
JP2001-182766 2001-06-18
JP2001368158A JP4074758B2 (ja) 2001-06-18 2001-12-03 半導体ウエーハの加工方法

Publications (3)

Publication Number Publication Date
JP2003077869A JP2003077869A (ja) 2003-03-14
JP2003077869A5 true JP2003077869A5 (de) 2005-06-09
JP4074758B2 JP4074758B2 (ja) 2008-04-09

Family

ID=26617074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001368158A Expired - Lifetime JP4074758B2 (ja) 2001-06-18 2001-12-03 半導体ウエーハの加工方法

Country Status (2)

Country Link
JP (1) JP4074758B2 (de)
TW (1) TW579540B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039114A (ja) * 2003-07-17 2005-02-10 Disco Abrasive Syst Ltd 半導体ウェーハ移し替え装置
JP2005086074A (ja) * 2003-09-10 2005-03-31 Disco Abrasive Syst Ltd 半導体ウェーハの移し替え方法
JP5595790B2 (ja) * 2010-05-27 2014-09-24 株式会社ディスコ ウエーハの加工方法
TW201351492A (zh) * 2012-06-04 2013-12-16 Prec Machinery Res Dev Ct 利用加熱刀具切割晶圓貼合膜的裝置及方法
JP6746211B2 (ja) * 2016-09-21 2020-08-26 株式会社ディスコ ウェーハの加工方法
JP7075268B2 (ja) * 2018-04-12 2022-05-25 株式会社ディスコ 研削装置
JP7201342B2 (ja) * 2018-06-06 2023-01-10 株式会社ディスコ ウエーハの加工方法
JP7181020B2 (ja) * 2018-07-26 2022-11-30 株式会社ディスコ ウエーハの加工方法
JP7376322B2 (ja) 2019-11-06 2023-11-08 株式会社ディスコ 樹脂シート固定装置

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