TW579540B - Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same - Google Patents

Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same Download PDF

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Publication number
TW579540B
TW579540B TW91122042A TW91122042A TW579540B TW 579540 B TW579540 B TW 579540B TW 91122042 A TW91122042 A TW 91122042A TW 91122042 A TW91122042 A TW 91122042A TW 579540 B TW579540 B TW 579540B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
substrate
scope
processing
patent application
Prior art date
Application number
TW91122042A
Other languages
English (en)
Chinese (zh)
Inventor
Masatoshi Nanjo
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Application granted granted Critical
Publication of TW579540B publication Critical patent/TW579540B/zh

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW91122042A 2001-06-18 2002-09-25 Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same TW579540B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001182766 2001-06-18
JP2001368158A JP4074758B2 (ja) 2001-06-18 2001-12-03 半導体ウエーハの加工方法

Publications (1)

Publication Number Publication Date
TW579540B true TW579540B (en) 2004-03-11

Family

ID=26617074

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91122042A TW579540B (en) 2001-06-18 2002-09-25 Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same

Country Status (2)

Country Link
JP (1) JP4074758B2 (de)
TW (1) TW579540B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475608B (de) * 2012-06-04 2015-03-01
TWI787535B (zh) * 2018-07-26 2022-12-21 日商迪思科股份有限公司 晶圓加工方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039114A (ja) * 2003-07-17 2005-02-10 Disco Abrasive Syst Ltd 半導体ウェーハ移し替え装置
JP2005086074A (ja) * 2003-09-10 2005-03-31 Disco Abrasive Syst Ltd 半導体ウェーハの移し替え方法
JP5595790B2 (ja) * 2010-05-27 2014-09-24 株式会社ディスコ ウエーハの加工方法
JP6746211B2 (ja) * 2016-09-21 2020-08-26 株式会社ディスコ ウェーハの加工方法
JP7075268B2 (ja) * 2018-04-12 2022-05-25 株式会社ディスコ 研削装置
JP7201342B2 (ja) * 2018-06-06 2023-01-10 株式会社ディスコ ウエーハの加工方法
JP7376322B2 (ja) 2019-11-06 2023-11-08 株式会社ディスコ 樹脂シート固定装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475608B (de) * 2012-06-04 2015-03-01
TWI787535B (zh) * 2018-07-26 2022-12-21 日商迪思科股份有限公司 晶圓加工方法

Also Published As

Publication number Publication date
JP2003077869A (ja) 2003-03-14
JP4074758B2 (ja) 2008-04-09

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