JP2002540294A5 - - Google Patents

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Publication number
JP2002540294A5
JP2002540294A5 JP2000607783A JP2000607783A JP2002540294A5 JP 2002540294 A5 JP2002540294 A5 JP 2002540294A5 JP 2000607783 A JP2000607783 A JP 2000607783A JP 2000607783 A JP2000607783 A JP 2000607783A JP 2002540294 A5 JP2002540294 A5 JP 2002540294A5
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Japan
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alloy
oxide
metal
atomic percent
forming metal
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JP2000607783A
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Japanese (ja)
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JP2002540294A (ja
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Priority claimed from US09/283,777 external-priority patent/US6458223B1/en
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Publication of JP2002540294A publication Critical patent/JP2002540294A/ja
Publication of JP2002540294A5 publication Critical patent/JP2002540294A5/ja
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JP2000607783A 1999-03-31 2000-01-31 合金材料 Pending JP2002540294A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/283,777 US6458223B1 (en) 1997-10-01 1999-03-31 Alloy materials
US09/283,777 1999-03-31
PCT/US2000/002435 WO2000058044A1 (en) 1999-03-31 2000-01-31 Alloy materials

Publications (2)

Publication Number Publication Date
JP2002540294A JP2002540294A (ja) 2002-11-26
JP2002540294A5 true JP2002540294A5 (enExample) 2006-02-09

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JP2000607783A Pending JP2002540294A (ja) 1999-03-31 2000-01-31 合金材料

Country Status (6)

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US (1) US6458223B1 (enExample)
EP (1) EP1181122A4 (enExample)
JP (1) JP2002540294A (enExample)
AU (1) AU764082B2 (enExample)
CA (1) CA2365740A1 (enExample)
WO (1) WO2000058044A1 (enExample)

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CN104404306B (zh) * 2014-09-03 2017-02-15 上海大学 涂层导体用高强度立方织构镍基合金基带及其制备方法
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CN109355519B (zh) * 2018-12-17 2020-06-12 河南师范大学 一种提高无铁磁性立方织构铜基合金基带强度的制备方法
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RU2759146C1 (ru) * 2020-11-16 2021-11-09 Федеральное государственное бюджетное учреждение науки Институт физики металлов имени М.Н. Михеева Уральского отделения Российской академии наук (ИФМ УрО РАН) Способ изготовления биаксиально текстурированной подложки в виде ленты из тройного сплава на медно-никелевой основе для эпитаксиального нанесения на нее буферных и высокотемпературного сверхпроводящего слоев
CN117403096B (zh) * 2023-12-13 2024-03-12 宁波兴业盛泰集团有限公司 高强高导耐高温铜锆系合金材料及其制备方法

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