Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
  • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
  • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
  • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C1/00—Making non-ferrous alloys
  • C22C1/04—Making non-ferrous alloys by powder metallurgy
  • C22C1/05—Mixtures of metal powder with non-metallic powder
  • C22C1/059—Making alloys comprising less than 5% by weight of dispersed reinforcing phases
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
  • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
  • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
  • C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/01—Alloys based on copper with aluminium as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/01—Manufacture or treatment
  • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
  • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
  • H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C2204/00—End product comprising different layers, coatings or parts of cermet

Definitions

• the substrate should have a low Curie temperature so that the substrate is not ferromagnetic below the superconductor's critical temperature. Furthermore, chemical species within the substrate should not be able to diffuse into the layer of superconductor material, and the coefficient of thermal expansion of the substrate should be about the same as the superconductor material . Moreover, if the substrate is used for an oxide superconductor, the substrate material should be relatively resistant to oxidation.
• the invention features an article including an alloy and an oxide layer disposed on a surface of the alloy.
• the alloy undergoes substantially no oxidation when the article is exposed to an atmosphere containing 1% oxygen at 900 °C for at least two hours .
• the invention features an alloy with a biaxially textured surface.
• the alloy includes copper and from about 25 atomic percent nickel to about 55 atomic percent nickel. At least about 65 volume percent of the alloy is formed of grains having a biaxial texture.
• the alloy can be made by a process that includes rolling the alloy, and then annealing the alloy.
• Fig. 2C illustrates a rolled foil as a core for a can.
• Fig. 3 is a block diagram illustrating a powder metallurgy variant of the sheath and core approach for forming a biaxially textured alloy.
• Examples of metals from which the first and second metals can be selected include copper (Cu) , nickel (Ni) , chromium (Cr) , vanadium (V) , aluminum (Al) , silver (Ag) , iron (Fe) , palladium (Pd) , molybdenum (Mo) , gold (Au) and zinc (Zn) .
• the superconductor material can be applied by any of a variety of methods, including electroplating, non-vacuum solution deposition, chemical vapor deposition, physical vapor deposition techniques such as sputtering, laser ablation, thermal evaporation, electron beam evaporation, metallorganic and/or sol-gel solution precursor methods.
• a preferred precursor approach uses a metallorganic triflouroacetate precursor solution. With this approach, high temperature superconductor films are spun or dip coated onto substrates and then reacted to form the superconducting YBCO phase.
• the as-coated precursor includes an oxy-fluoride film containing BaF 2 . Heat treatment in a controlled atmosphere, such as that disclosed in U.S. Patent No.
• the superconductor material can be deposited directly onto a surface of the alloy substrate, or onto a buffer layer that is disposed on a surface of the alloy substrate.
• One or more buffer layers can be disposed between the alloy substrate and the superconductor material.
• the buffer layer can be formed using any of the standard techniques, including epitaxial deposition (e.g., chemical vapor deposition or physical vapor deposition) , or by growing a native oxide (such as the native oxide discussed above) via exposure of the alloy to an environment containing sufficient oxygen. This native oxide can be grown epitaxially.
• the native oxide can have a biaxially textured surface (e.g., a
• the alloy article is deformed in an axially symmetric manner, such as, by extruding, swaging, drawing or rod rolling to a smaller size, which can be round, square, or rectangular (Step 106) .
• the melt can be cast and rolled directly into a plate shape.
• the plate can be further homogenized with a suitable heat treatment, rolled to a thinner size, and recrystallized to induce a desired fine grain size.
• a recrystallization anneal in a protective atmosphere (e.g., high vacuum, low oxygen or reducing atmosphere) at elevated temperature (e.g., at temperatures from about 250°C to about less than about 95% of the melting temperature of the alloy, or from about 400°C to about 1200°C) produces the desired texture.
• a protective atmosphere e.g., high vacuum, low oxygen or reducing atmosphere
• elevated temperature e.g., at temperatures from about 250°C to about less than about 95% of the melting temperature of the alloy, or from about 400°C to about 1200°C
• the article is positioned to provide oxidation resistance during subsequent uses, such as during deposition of superconductor or buffer layers.
• the article may be annealed (Step 109) to form a protective epitaxial oxide layer.
• the tapes can be rolled with various size rolls, including large diameter rolls (e.g., about 3.5" to about 8" or larger in diameter) or with small diameter rolls (e.g., about 0.75" to about 2" in diameter) which are preferably backed up by larger rolls, in a so-called four-high arrangement.
• large diameter rolls e.g., about 3.5" to about 8" or larger in diameter
• small diameter rolls e.g., about 0.75" to about 2" in diameter
• An alternative to the four-high arrangement is the cluster rolling mill.
• a planetary rolling mill can be used as well.
• a core is made to fit inside the can using a melt process or one of the variations described below. (Step 202) .
• the core contains the alloy.
• individual foils 220a-220b of the first metal, the second metal and an oxide former or alloys thereof 220c can be stacked together and rolled into a bar 222, a so called “jelly roll", which can be used as a core material or a wrapping for a central core.
• Aluminum is a particularly useful oxide former in making rolled foils, due to its deformability.
• the rolled foil bar 222 is illustrated inside an outer layer of can 226 and is a wrap material for a core 228.
• the rolled foil 222 is illustrated inside a can 226 process and is the core for the can.
• a block diagram illustrates a process 400 for forming an alloy article with a biaxially textured surface or cube textured surface and improved oxidation resistance, and which uses a variation on the powder metallurgy embodiment or the rolled foil embodiment of the sheath and core process .
• a powder or foil of the first metal, the second metal, or an alloy of the first and second metals is chosen that contains from about 0.2 weight percent to about 1 weight percent oxygen. The presence of oxygen can be used to assist in the internal oxidation of some of the oxide formers.
• a block diagram illustrates a process 500 for forming an alloy with a biaxially textured surface or cube textured surface and an improved CTE (i.e., coefficient of thermal expansion) matches among the substrate, the buffer layer, and the superconductor layer.
• the mismatch between the CTE of the primary substrate material and either the superconducting layer or the buffer layer can be reduced by incorporating into the alloy substrate another element with a much lower CTE, such as Nb, Mo, Ta, V, Cr, Zr, Pd, Sb, NbTi, an intermetallic such as NiAl or Ni 3 Al , or mixtures thereof .
• the CTE-reducing material is preferably included as a rod embedded in the alloy.
• the bar is drawn through round and rectangular drawing dies to a final dimension of 2.4 mm x 3.6 mm.
• This rectangular product is subsequently rolled to a tape of 65 microns thick (97.3 % reduction) .
• This tape is two-step annealed at

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Dispersion Chemistry (AREA)
• Composite Materials (AREA)
• Superconductors And Manufacturing Methods Therefor (AREA)

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Cited By (19)

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• 1999
  • 1999-03-31 US US09/283,777 patent/US6458223B1/en not_active Expired - Fee Related
• 2000
  • 2000-01-31 AU AU41659/00A patent/AU764082B2/en not_active Ceased
  • 2000-01-31 EP EP00921315A patent/EP1181122A4/en not_active Ceased
  • 2000-01-31 CA CA002365740A patent/CA2365740A1/en not_active Abandoned
  • 2000-01-31 WO PCT/US2000/002435 patent/WO2000058044A1/en not_active Ceased
  • 2000-01-31 JP JP2000607783A patent/JP2002540294A/ja active Pending

Patent Citations (2)

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