JP2002540294A - 合金材料 - Google Patents

合金材料

Info

Publication number
JP2002540294A
JP2002540294A JP2000607783A JP2000607783A JP2002540294A JP 2002540294 A JP2002540294 A JP 2002540294A JP 2000607783 A JP2000607783 A JP 2000607783A JP 2000607783 A JP2000607783 A JP 2000607783A JP 2002540294 A JP2002540294 A JP 2002540294A
Authority
JP
Japan
Prior art keywords
alloy
metal
oxide
atomic percent
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000607783A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002540294A5 (enExample
Inventor
レオ ハンス シーム、コーネリス
ディ. トンプソン、エリオット
ジー. フリッツマイヤー、レスリー
ディ. キャメロン、ロバート
ジェイ. シーガル、エドワード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Superconductor Corp
Original Assignee
American Superconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Superconductor Corp filed Critical American Superconductor Corp
Publication of JP2002540294A publication Critical patent/JP2002540294A/ja
Publication of JP2002540294A5 publication Critical patent/JP2002540294A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/05Mixtures of metal powder with non-metallic powder
    • C22C1/059Making alloys comprising less than 5% by weight of dispersed reinforcing phases
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C32/00Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C22C32/0015Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
    • C22C32/0021Matrix based on noble metals, Cu or alloys thereof
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/01Alloys based on copper with aluminium as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C2204/00End product comprising different layers, coatings or parts of cermet

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Composite Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
JP2000607783A 1999-03-31 2000-01-31 合金材料 Pending JP2002540294A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/283,777 1999-03-31
US09/283,777 US6458223B1 (en) 1997-10-01 1999-03-31 Alloy materials
PCT/US2000/002435 WO2000058044A1 (en) 1999-03-31 2000-01-31 Alloy materials

Publications (2)

Publication Number Publication Date
JP2002540294A true JP2002540294A (ja) 2002-11-26
JP2002540294A5 JP2002540294A5 (enExample) 2006-02-09

Family

ID=23087507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000607783A Pending JP2002540294A (ja) 1999-03-31 2000-01-31 合金材料

Country Status (6)

Country Link
US (1) US6458223B1 (enExample)
EP (1) EP1181122A4 (enExample)
JP (1) JP2002540294A (enExample)
AU (1) AU764082B2 (enExample)
CA (1) CA2365740A1 (enExample)
WO (1) WO2000058044A1 (enExample)

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JP2006015149A (ja) * 2004-06-30 2006-01-19 Cordis Corp 移植可能な医療用具のための改善された磁気共鳴画像装置適合性合金
WO2007026979A1 (en) * 2005-08-30 2007-03-08 Ls Cable Ltd. Substrate for superconducting wire and fabrication method thereof and superconducting wire

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ATE353375T1 (de) * 2000-12-07 2007-02-15 Leibniz Inst Fuer Festkoerper Metallband für epitaktische beschichtungen und verfahren zu dessen herstellung
US6821338B2 (en) 2000-12-15 2004-11-23 The Regents Of The University Of California Particle beam biaxial orientation of a substrate for epitaxial crystal growth
US6617283B2 (en) * 2001-06-22 2003-09-09 Ut-Battelle, Llc Method of depositing an electrically conductive oxide buffer layer on a textured substrate and articles formed therefrom
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US6809066B2 (en) 2001-07-30 2004-10-26 The Regents Of The University Of California Ion texturing methods and articles
US6610414B2 (en) * 2001-08-16 2003-08-26 Ut-Battelle, Llc Biaxially textured articles formed by power metallurgy
US6745059B2 (en) 2001-11-28 2004-06-01 American Superconductor Corporation Superconductor cables and magnetic devices
DE10200445B4 (de) * 2002-01-02 2005-12-08 Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. Metallband für epitaktische Beschichtungen und Verfahren zu dessen Herstellung
EP1472745A1 (en) * 2002-01-29 2004-11-03 Jochen Dieter Prof. Dr. Mannhart Superconductor with optimized microstructure and method for making such a superconductor
US6645313B2 (en) * 2002-02-22 2003-11-11 Ut-Battelle, Llc Powder-in-tube and thick-film methods of fabricating high temperature superconductors having enhanced biaxial texture
JP2005056754A (ja) * 2003-08-06 2005-03-03 Sumitomo Electric Ind Ltd 超電導線材およびその製造方法
DE10339867B4 (de) * 2003-08-25 2007-12-27 Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. Verfahren zur Herstellung von metallischen Flachdrähten oder Bändern mit Würfeltextur
US7226894B2 (en) * 2003-10-22 2007-06-05 General Electric Company Superconducting wire, method of manufacture thereof and the articles derived therefrom
US20050092253A1 (en) * 2003-11-04 2005-05-05 Venkat Selvamanickam Tape-manufacturing system having extended operational capabilites
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US7261776B2 (en) * 2004-03-30 2007-08-28 American Superconductor Corporation Deposition of buffer layers on textured metal surfaces
US20050223984A1 (en) * 2004-04-08 2005-10-13 Hee-Gyoun Lee Chemical vapor deposition (CVD) apparatus usable in the manufacture of superconducting conductors
US20050223983A1 (en) 2004-04-08 2005-10-13 Venkat Selvamanickam Chemical vapor deposition (CVD) apparatus usable in the manufacture of superconducting conductors
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US7582328B2 (en) 2004-08-20 2009-09-01 American Superconductor Corporation Dropwise deposition of a patterned oxide superconductor
US7463915B2 (en) 2004-08-20 2008-12-09 American Superconductor Corporation Stacked filamentary coated superconductors
US7387811B2 (en) * 2004-09-21 2008-06-17 Superpower, Inc. Method for manufacturing high temperature superconducting conductors using chemical vapor deposition (CVD)
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DE102005013368B3 (de) * 2005-03-16 2006-04-13 Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. Verfahren zur Herstellung und Verwendung von Halbzeug auf Nickelbasis mit Rekristallisationswürfeltextur
US7763343B2 (en) 2005-03-31 2010-07-27 American Superconductor Corporation Mesh-type stabilizer for filamentary coated superconductors
CN100453257C (zh) * 2005-05-13 2009-01-21 北京工业大学 强化双轴织构Ag基复合基带的制备方法
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JP2007200870A (ja) * 2006-01-26 2007-08-09 Ls Cable Ltd 超伝導ケーブル用基板の製造方法
US8030246B2 (en) 2006-07-21 2011-10-04 American Superconductor Corporation Low resistance splice for high temperature superconductor wires
WO2008100281A2 (en) 2006-07-24 2008-08-21 American Superconductor Corporation High temperature superconductors having planar magnetic flux pinning centers and methods for making the same
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US8114526B2 (en) * 2007-04-06 2012-02-14 American Superconductor Corporation Composite substrates for high temperature superconductors having improved properties
DE102007024166B4 (de) * 2007-05-24 2011-01-05 Zenergy Power Gmbh Verfahren zum Bearbeiten eines Metallsubstrats und Verwendung dessen für einen Hochtemperatur-Supraleiter
US8195260B2 (en) 2008-07-23 2012-06-05 American Superconductor Corporation Two-sided splice for high temperature superconductor laminated wires
KR101677310B1 (ko) 2009-09-14 2016-11-17 엔지케이 인슐레이터 엘티디 구리 합금 선재 및 그 제조 방법
KR101677311B1 (ko) 2009-09-14 2016-11-17 엔지케이 인슐레이터 엘티디 구리 합금박, 그것을 이용한 플렉시블 프린트 기판 및 구리 합금박의 제조 방법
CN104404306B (zh) * 2014-09-03 2017-02-15 上海大学 涂层导体用高强度立方织构镍基合金基带及其制备方法
DE102018220222A1 (de) * 2018-11-26 2020-05-28 Thyssenkrupp Ag Verfahren zur Herstellung eines Werkstoffverbundes, Werkstoffverbund und seine Verwendung
CN109355519B (zh) * 2018-12-17 2020-06-12 河南师范大学 一种提高无铁磁性立方织构铜基合金基带强度的制备方法
EP4193006A1 (en) * 2020-08-06 2023-06-14 American Superconductor Corporation Electro-formed metal foils
RU2759146C1 (ru) * 2020-11-16 2021-11-09 Федеральное государственное бюджетное учреждение науки Институт физики металлов имени М.Н. Михеева Уральского отделения Российской академии наук (ИФМ УрО РАН) Способ изготовления биаксиально текстурированной подложки в виде ленты из тройного сплава на медно-никелевой основе для эпитаксиального нанесения на нее буферных и высокотемпературного сверхпроводящего слоев
CN117403096B (zh) * 2023-12-13 2024-03-12 宁波兴业盛泰集团有限公司 高强高导耐高温铜锆系合金材料及其制备方法

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