JP2002531702A - 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置 - Google Patents

半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置

Info

Publication number
JP2002531702A
JP2002531702A JP2000585913A JP2000585913A JP2002531702A JP 2002531702 A JP2002531702 A JP 2002531702A JP 2000585913 A JP2000585913 A JP 2000585913A JP 2000585913 A JP2000585913 A JP 2000585913A JP 2002531702 A JP2002531702 A JP 2002531702A
Authority
JP
Japan
Prior art keywords
wafer chuck
assembly
wafer
electroplating
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000585913A
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English (en)
Japanese (ja)
Other versions
JP2002531702A5 (show.php
Inventor
ワン，フイ
ガットマン，フェリックス
ヌッチ，ボハ
Original Assignee
エーシーエム リサーチ，インコーポレイティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by エーシーエム リサーチ，インコーポレイティド filed Critical エーシーエム リサーチ，インコーポレイティド
Publication of JP2002531702A publication Critical patent/JP2002531702A/ja
Publication of JP2002531702A5 publication Critical patent/JP2002531702A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P72/7606—
    • H10P72/50—
    • H10P14/47—
    • H10P72/7624—
    • H10P72/7626—
    • H10P95/04—

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP2000585913A 1998-11-28 1999-11-24 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置 Pending JP2002531702A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11013698P 1998-11-28 1998-11-28
US60/110,136 1998-11-28
PCT/US1999/028106 WO2000033356A2 (en) 1998-11-28 1999-11-24 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006315540A Division JP2007119923A (ja) 1998-11-28 2006-11-22 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置

Publications (2)

Publication Number Publication Date
JP2002531702A true JP2002531702A (ja) 2002-09-24
JP2002531702A5 JP2002531702A5 (show.php) 2007-01-18

Family

ID=22331393

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000585913A Pending JP2002531702A (ja) 1998-11-28 1999-11-24 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置
JP2006315540A Pending JP2007119923A (ja) 1998-11-28 2006-11-22 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006315540A Pending JP2007119923A (ja) 1998-11-28 2006-11-22 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置

Country Status (9)

Country Link
EP (1) EP1133786A2 (show.php)
JP (2) JP2002531702A (show.php)
KR (3) KR100516776B1 (show.php)
CN (2) CN100382235C (show.php)
AU (1) AU3105400A (show.php)
CA (1) CA2352160A1 (show.php)
IL (1) IL143316A (show.php)
TW (1) TW430919B (show.php)
WO (1) WO2000033356A2 (show.php)

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JP2002121698A (ja) * 2000-10-13 2002-04-26 Sony Corp 半導体製造装置および半導体装置の製造方法
KR101211826B1 (ko) * 2010-06-14 2012-12-18 연세대학교 산학협력단 자기유변유체를 이용한 피가공물의 연마장치 및 그 연마방법
KR20160050017A (ko) 2012-03-27 2016-05-10 가부시키가이샤 에바라 세이사꾸쇼 도금 방법 및 도금 장치

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US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
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JP2003027280A (ja) * 2001-07-18 2003-01-29 Ebara Corp めっき装置
US7147765B2 (en) * 2001-08-31 2006-12-12 Semitool, Inc. Apparatus and method for deposition of an electrophoretic emulsion
US6837983B2 (en) 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
TWI275436B (en) 2002-01-31 2007-03-11 Ebara Corp Electrochemical machining device, and substrate processing apparatus and method
TWI274393B (en) * 2002-04-08 2007-02-21 Acm Res Inc Electropolishing and/or electroplating apparatus and methods
AU2003256673A1 (en) * 2002-07-22 2004-02-09 Acm Research, Inc. Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
US7112270B2 (en) 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US7422982B2 (en) 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
US8804535B2 (en) * 2009-03-25 2014-08-12 Avaya Inc. System and method for sending packets using another device's network address
TWI410531B (zh) * 2010-05-07 2013-10-01 Taiwan Semiconductor Mfg 直立式電鍍設備及其電鍍方法
US9399827B2 (en) * 2013-04-29 2016-07-26 Applied Materials, Inc. Microelectronic substrate electro processing system
SG11201508466QA (en) 2013-05-09 2015-11-27 Acm Research Shanghai Inc Apparatus and method for plating and/or polishing wafer
KR101353378B1 (ko) * 2013-08-19 2014-01-22 주식회사 케이엠 주사기용 믹싱 조인트
CN104465481A (zh) * 2013-09-22 2015-03-25 盛美半导体设备（上海）有限公司 晶圆夹盘
CN105297127B (zh) * 2014-05-30 2019-04-05 盛美半导体设备（上海）有限公司 带有电极的喷头装置
JP6449091B2 (ja) * 2015-04-20 2019-01-09 東京エレクトロン株式会社 スリップリング、支持機構及びプラズマ処理装置
US10053793B2 (en) * 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
GB201701166D0 (en) 2017-01-24 2017-03-08 Picofluidics Ltd An apparatus for electrochemically processing semiconductor substrates
KR102156430B1 (ko) * 2020-04-28 2020-09-15 주식회사 스마트코리아피씨비 회전식 기판 도금장치
CN114262920A (zh) * 2020-09-16 2022-04-01 长鑫存储技术有限公司 晶圆电镀设备、漏气检测装置和方法、晶圆电镀方法
EP3998374A4 (en) 2020-09-16 2022-08-03 Changxin Memory Technologies, Inc. DEVICE AND METHOD FOR AIR LEAK DETECTION AND METHOD FOR ELECTROPLATING WAFER
CN112144096B (zh) * 2020-09-25 2022-05-10 深圳市生利科技有限公司 一种锌镍合金电镀设备
CN113013078A (zh) * 2021-03-04 2021-06-22 苏州竣合信半导体科技有限公司 一种用于芯片定位的兼容芯片定位槽及其使用方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002121698A (ja) * 2000-10-13 2002-04-26 Sony Corp 半導体製造装置および半導体装置の製造方法
KR101211826B1 (ko) * 2010-06-14 2012-12-18 연세대학교 산학협력단 자기유변유체를 이용한 피가공물의 연마장치 및 그 연마방법
KR20160050017A (ko) 2012-03-27 2016-05-10 가부시키가이샤 에바라 세이사꾸쇼 도금 방법 및 도금 장치
KR20160148492A (ko) 2012-03-27 2016-12-26 가부시키가이샤 에바라 세이사꾸쇼 도금 장치

Also Published As

Publication number Publication date
JP2007119923A (ja) 2007-05-17
CN1191605C (zh) 2005-03-02
WO2000033356A9 (en) 2001-08-02
CN1346510A (zh) 2002-04-24
AU3105400A (en) 2000-06-19
IL143316A (en) 2005-03-20
TW430919B (en) 2001-04-21
WO2000033356A2 (en) 2000-06-08
CN100382235C (zh) 2008-04-16
KR20040070317A (ko) 2004-08-06
KR100562011B1 (ko) 2006-03-22
KR100503553B1 (ko) 2005-07-26
CN1632914A (zh) 2005-06-29
KR20050013179A (ko) 2005-02-02
IL143316A0 (en) 2002-04-21
EP1133786A2 (en) 2001-09-19
WO2000033356A3 (en) 2001-07-12
KR20010086051A (ko) 2001-09-07
CA2352160A1 (en) 2000-06-08
KR100516776B1 (ko) 2005-09-26

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