JP2002517894A - コンピュータの冷却システム - Google Patents

コンピュータの冷却システム

Info

Publication number
JP2002517894A
JP2002517894A JP2000537128A JP2000537128A JP2002517894A JP 2002517894 A JP2002517894 A JP 2002517894A JP 2000537128 A JP2000537128 A JP 2000537128A JP 2000537128 A JP2000537128 A JP 2000537128A JP 2002517894 A JP2002517894 A JP 2002517894A
Authority
JP
Japan
Prior art keywords
heat exchange
exchange container
heat
heat transfer
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000537128A
Other languages
English (en)
Japanese (ja)
Inventor
リー，モク−ヒョン
リー，カン−スーン
チョン，キ−オアン
Original Assignee
リー，モク−ヒョン
リー，カン−スーン
チョン，キ−オアン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リー，モク−ヒョン, リー，カン−スーン, チョン，キ−オアン filed Critical リー，モク−ヒョン
Publication of JP2002517894A publication Critical patent/JP2002517894A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2000537128A 1998-03-16 1999-03-15 コンピュータの冷却システム Pending JP2002517894A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1998/8723 1998-03-16
KR1019980008723A KR19980019402A (ko) 1998-03-16 1998-03-16 피.씨의 씨.피.유 냉각장치(cpu cooling device of pc)
PCT/KR1999/000118 WO1999047994A1 (fr) 1998-03-16 1999-03-15 Systeme de refroidissement de dispositifs a l'interieur d'un ordinateur

Publications (1)

Publication Number Publication Date
JP2002517894A true JP2002517894A (ja) 2002-06-18

Family

ID=19534831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000537128A Pending JP2002517894A (ja) 1998-03-16 1999-03-15 コンピュータの冷却システム

Country Status (6)

Country Link
EP (1) EP1062563A1 (fr)
JP (1) JP2002517894A (fr)
KR (2) KR19980019402A (fr)
CN (1) CN1293774A (fr)
AU (1) AU2857799A (fr)
WO (1) WO1999047994A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010107153A (ja) * 2008-10-31 2010-05-13 Toshiba Corp 蒸発器およびこれを用いた循環型冷却装置
US8199503B2 (en) 2009-09-30 2012-06-12 Kabushiki Kaisha Toshiba Electronic device
JPWO2012115214A1 (ja) * 2011-02-22 2014-07-07 日本電気株式会社 冷却装置及びその製造方法
JP2014183110A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 電子機器システム及び電子機器
JP2015207586A (ja) * 2014-04-17 2015-11-19 富士通株式会社 放熱装置、電子機器、基地局装置

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000061442A (ko) * 1999-03-26 2000-10-16 최은광 수냉 공냉 혼합형 컴퓨터 냉각 시스템
KR100468278B1 (ko) * 1999-09-16 2005-01-27 현대중공업 주식회사 전도체 일체형 히트파이프 냉각기
EP1158389A3 (fr) * 2000-05-25 2002-11-13 Kioan Cheon Ordinateur possédant un dispositif de refroidissement et échangeur de chaleur de ce dispositif de refroidissement
WO2002017698A2 (fr) * 2000-08-22 2002-02-28 Hb Innovation Ltd. Systeme de gestion thermique distribue pour composants electroniques
DE10053258A1 (de) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Enthitzungseinrichtung für elektronische Geräte
KR100440733B1 (ko) * 2001-03-02 2004-07-19 주식회사 영동 컴퓨터의 중앙처리장치용 방열장치
KR20010069631A (ko) * 2001-04-24 2001-07-25 김태국 무방향 평판형 히트펌프 장치
KR100438830B1 (ko) * 2001-11-10 2004-07-05 삼성전자주식회사 컴퓨터 냉각 장치
KR20030039206A (ko) * 2001-11-12 2003-05-17 주식회사 다온테크 라디에이터형 냉각 기기의 냉각기능 향상 장치
KR100441777B1 (ko) * 2002-01-22 2004-07-23 성이제 컴퓨터 중앙처리장치의 냉각시스템
KR20020028052A (ko) * 2002-03-25 2002-04-15 (주)씨에스이 피씨 냉각 시스템 및 그 제어방법
KR20020028053A (ko) * 2002-03-25 2002-04-15 (주)씨에스이 피씨 입출력포트의 전원을 이용하는 냉각 시스템
KR100939992B1 (ko) * 2002-11-21 2010-02-03 삼성전자주식회사 전기전자기기의 냉각장치 및 이를 장착한 전기전자기기
DE20309965U1 (de) * 2003-06-27 2003-09-04 Fujitsu Siemens Computers Gmbh Kühlung eines Computerbauteils
DE10360236A1 (de) * 2003-12-20 2005-07-28 Gerd Lukoschus Fremdenergiefreie Kühlung für elektronische Bauteile
DE102004020642A1 (de) * 2004-04-22 2005-11-10 Höhne, Sven, Dipl.-Ing (FH) Schwerkraftkühlung für elektronische Bauteile
DE102004031251B4 (de) * 2004-06-29 2007-03-22 Sebastian Jaksch Vorrichtung zur Flüssigkeitskühlung von Mikroprozessoren in Computersystemen
KR100634997B1 (ko) * 2004-07-14 2006-10-17 한국에너지기술연구원 무동력 ２상유동 방식 이동통신 중계기 냉각장치
DE102005019437A1 (de) * 2005-01-25 2006-08-03 Axel Benner Computer
TWI274985B (en) 2005-07-08 2007-03-01 Asustek Comp Inc Extendable cooling apparatus
CN100361045C (zh) * 2005-07-08 2008-01-09 华硕电脑股份有限公司 伸展式散热装置
KR101151712B1 (ko) * 2005-07-11 2012-06-15 삼성전자주식회사 냉각시스템의 전기부품 냉각장치 및 그 제어방법
DE102006011331A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere von elektronischen Bauelementen, Gaskühler und Verdampfer
KR100851810B1 (ko) * 2006-11-16 2008-08-13 한국생산기술연구원 Ｐｃｍ을 이용한 수냉식 전자기기 냉각장치용 냉각기
KR100934124B1 (ko) * 2008-12-26 2009-12-29 에이스트로닉스 주식회사 분진 방지 및 진동에 강한 산업용 컴퓨터
CN102573397A (zh) * 2010-12-23 2012-07-11 山特电子（深圳）有限公司 热传输装置、其制造和组装方法及设备组件
CN102573396A (zh) * 2010-12-23 2012-07-11 山特电子（深圳）有限公司 用于电子设备的冷却系统及相应冷却方法
CN105324005A (zh) * 2014-07-25 2016-02-10 中兴通讯股份有限公司 一种实现移动终端散热的方法、装置和移动终端
CN111031732A (zh) * 2020-02-03 2020-04-17 重庆电子工程职业学院 一种方便移动的室外通信设备机构
KR102173535B1 (ko) * 2020-06-01 2020-11-03 젝스컴퍼니 주식회사 실시간 성능이 향상된 안드로이드 기반의 임베디드 보드
KR102232902B1 (ko) * 2020-06-24 2021-03-26 주식회사 에이치앤씨트랜스퍼 냉각모듈을 갖는 전자기기 및 전자기기 어셈블리

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144734A (ja) * 1974-10-16 1976-04-16 Hitachi Ltd Kunenhijidoseigyosochi
JPS5255065A (en) * 1975-10-30 1977-05-06 Shinko Electric Co Ltd Device for adjusting inter-electrode distance for use in electric dust collectors
JPS5848127A (ja) * 1981-09-18 1983-03-22 Mitsubishi Electric Corp 計算機の冷却方法
JPS5886622A (ja) * 1981-11-18 1983-05-24 Mitsubishi Electric Corp 計算機
US5027254A (en) * 1989-11-09 1991-06-25 International Business Machines Corporation Apparatus for cooling electronics components
GB2241101A (en) * 1990-02-15 1991-08-21 Ibm Data storage system with device dependent flow of cooling air
JP2910127B2 (ja) * 1990-03-01 1999-06-23 富士通株式会社 冷却装置
JPH04196395A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 冷却装置を備えた電子計算機
US5333460A (en) * 1992-12-21 1994-08-02 Carrier Corporation Compact and serviceable packaging of a self-contained cryocooler system
JPH09293985A (ja) * 1996-04-25 1997-11-11 Canon Inc 電子機器
JP3599490B2 (ja) * 1996-07-19 2004-12-08 古河電気工業株式会社 ノートブック型電子機器の発熱素子の冷却構造
KR19990061830A (ko) * 1997-12-31 1999-07-26 윤종용 휴대용 컴퓨터의 방열구조체

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010107153A (ja) * 2008-10-31 2010-05-13 Toshiba Corp 蒸発器およびこれを用いた循環型冷却装置
US8199503B2 (en) 2009-09-30 2012-06-12 Kabushiki Kaisha Toshiba Electronic device
JPWO2012115214A1 (ja) * 2011-02-22 2014-07-07 日本電気株式会社 冷却装置及びその製造方法
JP2014183110A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 電子機器システム及び電子機器
JP2015207586A (ja) * 2014-04-17 2015-11-19 富士通株式会社 放熱装置、電子機器、基地局装置

Also Published As

Publication number Publication date
EP1062563A1 (fr) 2000-12-27
KR20010041932A (ko) 2001-05-25
CN1293774A (zh) 2001-05-02
WO1999047994A1 (fr) 1999-09-23
AU2857799A (en) 1999-10-11
KR19980019402A (ko) 1998-06-05

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