WO2001035199A1 - Appareil de transfert de chaleur faisant appel a un fluide frigorigene et ordinateur comprenant cet appareil - Google Patents

Appareil de transfert de chaleur faisant appel a un fluide frigorigene et ordinateur comprenant cet appareil Download PDF

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Publication number
WO2001035199A1
WO2001035199A1 PCT/KR2000/001277 KR0001277W WO0135199A1 WO 2001035199 A1 WO2001035199 A1 WO 2001035199A1 KR 0001277 W KR0001277 W KR 0001277W WO 0135199 A1 WO0135199 A1 WO 0135199A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat transfer
container
refrigerant
hdd
Prior art date
Application number
PCT/KR2000/001277
Other languages
English (en)
Inventor
Mok-Hyoung Lee
Kwang-Soon Lee
Original Assignee
Lee Mok Hyoung
Lee Kwang Soon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019990049284A external-priority patent/KR20010045825A/ko
Priority claimed from KR1020000008211A external-priority patent/KR20010083711A/ko
Application filed by Lee Mok Hyoung, Lee Kwang Soon filed Critical Lee Mok Hyoung
Priority to AU11779/01A priority Critical patent/AU1177901A/en
Publication of WO2001035199A1 publication Critical patent/WO2001035199A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1413—Reducing the influence of the temperature by fluid cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention is directed to a heat transfer apparatus situated between two positions of different temperatures (for instance, CPU or other elements located within a personal computer and the outside of the computer) and a computer equipped with said heat transfer apparatus.
  • this invention is directed to a heat transfer apparatus capable of releasing heat as well as reducing noise associated with mechanical operation, and to a computer equipped with said heat transfer apparatus.
  • heat sink and cooling fan are fixed on a heat emission surface of CPU.
  • the cooling fan When the cooling fan is activated, the air is circulated around each heat sink. Heat generated by the CPU is released with the circulating air.
  • the cooling device comprises a heat absorption container or an evaporator 2 adapted to be attached to elements or devices, such as a heat generating surface of a CPU 1 and a heat radiation container or a condenser 3 adapted to release heat to outside of a computer.
  • a refrigerant is contained within this closed space and circulates to and from the heat absorption container 2 and the heat radiation container 3.
  • a heat radiation fin 6 is fixed on one side of the heat radiation container 3.
  • heat generated by the CPU 1 is absorbed by a liquid refrigerant stored within the heat absorption container 2.
  • the liquid refrigerant which has absorbed heat turns into its gaseous form, and moves to the heat radiation container 3 through the first tube 4.
  • the gaseous refrigerant which has arrived to the heat radiation container 3 releases the heat to outside through heat radiation fin 6 and gets liquefied during this process.
  • the liquefied refrigerant returns to the heat absorption container 2 from the bottom of the heat radiation container 3 through the second tube 5.
  • This kind of refrigerant-circulating-type cooling apparatus can achieve effective cooling only when the circulation of refrigerant is effective.
  • the heat radiation container 3 is installed at a higher position than the heat absorption container 2.
  • the connecting position of the heat absorption container 2 and the first tube 4 is the place where the vaporized refrigerant can be emitted from the heat absorption container 2.
  • this connecting position locates as high as possible to allow the vaporized refrigerant to flow well through the first tube 4 and the liquefied refrigerant to flow well through the second tube 5.
  • the heat absorption container 2 in order for an outlet 7 of the heat absorption container 2 being connected to the first tube 4 to be positioned as high as possible, the heat absorption container 2 may be erected vertically so that the outlet 7 is located at the top.
  • this kind of setup requires the CPU to be positioned in such a way that its heat emission surface always faces horizontally in order to attach the heat absorption container to the CPU.
  • it is difficult to initiate the circulation of the refrigerant unless the difference in vertical positions between the outlet 7 connected to the first tube and the inlet connected to the second tube is large. This is because the pressures of the refrigerant applied at the first tube and the second tube are the same.
  • This kind of refrigerant circulation setup does not use cooling fans. Therefore, mechanical noise caused by cooling fans or wind transferring fans and the need for electricity to operate the fans are eliminated. But, the noise cause by the motor that operates HDD is not yet resolved. Therefore, a method to eliminate the noise generated by the HDD in a computer that uses the said heat transfer apparatus is further needed.
  • a heat transfer apparatus of the present invention comprises an evaporating unit, a condensing unit, and a first and second tubes that connect said two units.
  • the evaporating unit is fixed so as to be able to absorb heat at a heat emitting element or device.
  • the condensing unit is disposed at a higher position than the evaporating unit so as to be able to release the heat to outside.
  • the evaporating unit, condensing unit, and the first and second tubes define a closed inner space in which a refrigerant is contained.
  • the heat transfer apparatus further comprises a one-way flow device, which is installed so as to force the refrigerant to flow only in one direction.
  • a computer equipped with the heat transfer apparatus.
  • the evaporating unit of the heat transfer apparatus is coupled to the heat emitting surface of a heat emitting element or device within a computer.
  • the condensed heat is released to the exterior of the computer via the condensing unit.
  • An HDD case can be provided for the computer.
  • the HDD comprises a housing with an opening for inserting an HDD therethrough and a cover to cover the opening.
  • a closed refrigerant passageway is present on a housing wall in which the refrigerant is contained.
  • Fig. 1 is a perspective view of a prior cooling device
  • Fig. 2 is an enlarged sectional side view taken along line II - II in Fig. 1
  • Fig. 3 is a sectional view of another embodiment of the cooling device
  • Fig. 4 is a schematic perspective view of a cooling device in accordance with an embodiment of the present invention
  • Fig. 5 is a sectional view of the CPU cooling device of Fig. 4;
  • Figs. 6A and 6B are enlarged sectional views of a one-way flow device that explain the one-way flow device's operating modes in the cooling device;
  • Fig. 7 is a perspective view of the tube connecting body within the backward flows prevention means in Figs. 6A and 6B;
  • Fig. 8 is a schematic view of a bridge system for cooling a number of heat emitting elements according to another embodiment of the present invention.
  • Fig. 9 is a schematic view of a system for cooling a number of heat emitting elements according to another embodiment of the present invention
  • Figs. 10 and 11 are schematic views of a heat transfer apparatus wherein multiple heat transfer apparatus units being connected in series according to another embodiment of the present invention
  • Fig. 12 is a schematic view of a heat transfer apparatus wherein plural heat transfer apparatus units being connected in series so that they could transfer heat between two different positions according to another embodiment of the present invention
  • Fig. 13 is a perspective exploded view of an HDD case according to a further embodiment of the present invention
  • Fig. 14 is a perspective exploded view of the interior and exterior housing members consisting of the housing body shown in Fig. 10;
  • Fig. 15 is a sectional view of an HDD case shown in Fig. 10.
  • Fig. 4 shows the application of a heat transfer apparatus as a cooling device for a computer according to an embodiment of present invention.
  • the cooling device comprises a heat absorption container 13, as an evaporating unit, coupled to the heat emitting surface of a CPU 11 for absorbing heat generated by the CPU 11 and a heat radiation container 14 for releasing heat transferred from the CPU 11.
  • the heat absorption container 13 and the heat radiation container 14 are connected with each other via a first tube 15 and a second tube 16 in a closed system.
  • the refrigerant is contained in the heat absorption container in liquefied state. When this liquid refrigerant absorbs heat from elements or devices, it becomes vaporized and transfers to the heat radiation container 14 via first tube 15. When the refrigerant loses heat in the heat radiation container 14, it reverts to its liquid state and circulates back to the heat absorption container 13 via the second tube 16.
  • the heat radiation container 14 is disposed at a higher position than the heat absorption container 13 for a smooth circulation of the refrigerant.
  • the heat radiation container 14 is coupled to a computer case wall 18, and this section of the case wall to which the container 14 is attached is preferably made of metal with high heat conductivity.
  • a number of ventilation holes 18a are preferably present on the computer case wall (18) which is used as a heat radiation wall.
  • Fig. 5 is a detailed sectional view of the cooling device for cooling CPU 11 in Fig. 4. Since the cooling device for CPU 11 can also be applied to other heat emitting parts, only the cooling device for CPU 11 will be described.
  • the metal (which is preferably a material with high heat conductivity such as aluminum) heat absorption container 13 is coupled to a heat emitting surface of the CPU 11.
  • One end of the first tube 15 and one end of the second tube 16 are connected to a side of the heat absorption container 13.
  • the heat absorption container 13 can be coupled to the heat emitting surface of the CPU 11 when the latter faces up.
  • the heat abso ⁇ tion container 13 can be coupled with a heat emitting surface (that is, the heat abso ⁇ tion container is coupled at the bottom of the CPU).
  • the heat abso ⁇ tion container is coupled to a heat emitting surface no matter how the CPU 11 is oriented. As shown in Fig.
  • the passageway 13a that connects the heat abso ⁇ tion container and the first tube is formed at the wall of the heat abso ⁇ tion container.
  • This passageway is in the form of horizontal slit, and the heat abso ⁇ tion container is preferably fixed to the CPU so that this passageway always passes through the inner uppermost section of the heat abso ⁇ tion container whether the heat emitting surface of the CPU faces down or up.
  • Fig. 5 shows that, an end of the first tube
  • both the first and second tubes 15 and 16 may be positioned at the same height.
  • the other end of the first tube 15 is positioned at the upper area of the inside of the heat radiation container 14 by passing through the bottom wall of the heat radiation container 14.
  • the other end of the second tube 16 is leveled at the bottom of the heat radiation container 14 by passing through the bottom wall of the heat radiation container 14.
  • the inside wall of the metallic (preferably with high heat conductivity as in aluminum) heat radiation container 14 preferably is uneven or has a lot of projections such as fins in order to increase the surface area of the inside.
  • a one-way flow device that is, check valve
  • the check valve allows the flow of refrigerant from the heat radiation container 14 into the heat abso ⁇ tion container 13 and to prevent backward flow of refrigerant from the heat abso ⁇ tion container 13 into the heat radiation container 14.
  • the heat abso ⁇ tion container 13 and the heat radiation container 14 are made up of vessels closed up by welding and other methods.
  • a refrigerant supply port (not shown) is present. After connecting the first and second tubes to the containers to define a closed space, the refrigerant is supplied through the port under the vacuum, and then the port covered up to be sealed.
  • Commonly used refrigerant for cooling equipment can be used as the refrigerant for present invention, and specific one may be determined according to the required temperature.
  • the use of refrigerant which does not pose danger to health nor readily react chemically with parts of the cooling device is preferable.
  • the use of HCFC-123 as a refrigerant is preferable for use in computers.
  • the refrigerant is sold by Dupont Chemical Company under the name of Suva 123.
  • the one-way flow device has a socket 21 fixed at the bottom wall of the heat radiation container 14 as shown in Figures 6A and 6B.
  • the socket 21 has a mounting hole 21a of a certain depth from the outer surface of the bottom wall and a bored hole 21b.
  • the bored hole 21b communicates with the interior of the heat radiation container 14 and has a chamfered entrance and a reduced diameter.
  • a tube joint member 22 is fixed within the mounting hole 21a of said socket 21.
  • the tube joint member 22 includes a flange 23 which is secured within the mounting hole 21a of the socket 21, a head 24 above this flange 23, and a body 25 under the flange 23.
  • a central bore 22a extends along the center axis of the tube joint member 22.
  • the body 25 is tapered.
  • a notch or grooves 24a are present at portions of the head 24 so as to allow a radial outside of the head 24 to communicate with the central hole 22a.
  • Sealing packing 26 is installed between the flange 23 of the tube joint member 22 and a shoulder adjacent the pierced hole 21b of the socket 21 so as to maintain a fixed distance between them. And, a spherical body 27 is installed between the bored hole 21b and the head 24, and has a diameter smaller than the distance between the bored hole 21b and the head 24.
  • the movable spherical ball 27 contacts closely to the head section 24 when the refrigerant flows from the heat radiation container 14 to the heat abso ⁇ tion container 13 as shown in Fig. 7. Therefore, the refrigerant can flow into the heat abso ⁇ tion container 13 via the bored hole 21b and the grooves 24a of the head 24.
  • the ball 27 contacts to the chamfered entrance of the bore hole 21b, and thus, blocking the bore hole 21b.
  • the separate socket 21 is provided for preventing the backward flow of the refrigerant, but the separate socket 21 may not be provided.
  • the mounting hole 21a and the bored hole 21b are formed on the bottom wall of the heat radiation container 14.
  • the refrigerant contained in the heat abso ⁇ tion container 13 becomes vaporized by absorbing heat when the heat is generated by the CPU 11 as shown in Fig. 5. Then, a pressure differential is generated between the first and second tubes 15 and 16 caused by the operation of the check valve. Consequently, the vaporized refrigerant starts to flow to the heat radiation container 14 via the first tube 15. The vaporized refrigerant which has flowed into the interior of the heat radiation container 14 via the first tube 15 radiates heat to outside via surrounding uneven interior surface 14a and the heat emission plate 18 fixed on the outside of the heat radiation container 14. Consequently, the refrigerant returns to its liquefied state and settles on the bottom of the heat radiation container 14.
  • the heat radiation plate 18 absorbs heat from the refrigerant and emits it away, and the use of a computer case wall for this pu ⁇ ose is preferable as described above. According to the experiments done by the inventor, the use of about one-third area of the case wall surface of a computer was sufficient to release the heat.
  • the liquefied refrigerant within the heat radiation container 14 circulates back to the heat abso ⁇ tion container 13 via second tube 16.
  • the CPU 11 cools down as a result of the repetition of this process.
  • the refrigerant can circulate smoothly without back flowing in the second tube from the heat abso ⁇ tion container 13 to the heat radiation container 14, even if the first and second tubes 15 and 16 are connected to the side wall of the heat abso ⁇ tion container 13 without any consideration for their relative vertical positions. Consequently, the effectiveness of cooling elements and devices is improved. Furthermore, since the heat abso ⁇ tion container 13 can be made to be thin, it does not take up any large space inside the computer. Furthermore, the application of the heat abso ⁇ tion container is possible without consideration of the installation orientation of elements and devices.
  • the CPU 11 is described as a heat generating element to describe present invention, but the scope of the present invention is not limited. Instead, the present invention can be applied to all heat emitting elements and devices within computer.
  • the smoothness of the refrigerant circulation for the heat transfer apparatus of the present invention is achieved since the vaporized refrigerant only flows via the first tube because of the one-way flow device at the second tube as explained above. Therefore, any height difference between the connecting positions of the first and the second tubes with the heat abso ⁇ tion container is not needed. Therefore, the design of installation orientation of the heat abso ⁇ tion container can be varied.
  • the heat abso ⁇ tion container can be coupled to the heat emitting surface regardless of the orientation of the heat emitting surface of elements or devices. In addition, the heat abso ⁇ tion container can be made to be thin.
  • any mechanical noise generated by cooling or blowing fans does not exist since the fans are not used.
  • Fig. 8 shows the constitution of a cooling device to be used in case where two heat generating elements are in close proximity of each other.
  • a first heat generating element 50 such as a CPU and a second heat generating element 52 such as a chip set can be in close proximity on a main board inside a computer as shown in Fig. 13.
  • the heat abso ⁇ tion container 54 is installed on the heat emission surface of the first heat generating element 50.
  • the constitution of this container 54 is the same as that of the heat abso ⁇ tion container of the cooling device shown in Fig. 4.
  • a heat transfer plate 56 is installed on the heat emitting surface of the proximate second heat generating element 52. This heat transfer plate 56 is made of metallic material with excellent heat conductivity such as aluminum.
  • a heat transfer connector 58 connects the heat abso ⁇ tion container 54 with the heat transfer plate 56.
  • the heat transfer connector 58 includes connecting plates 62 fixed to the heat abso ⁇ tion container 54 and the heat transfer plate 56 respectively, with fastening members such as screws 60. Between connecting plates 62, a connecting string 64 is present.
  • the connecting string 64 is braided, and is fixed to each connecting plate 62 by brazing or soldering. This connecting string 64 preferably is braided using copper wire, however, this invention is not limited to this braided string. Any string that transfers heat well and is flexible can be used.
  • a first cooling device 70 and a second cooling device 80 can be connected as shown in Fig. 9.
  • the cooling device 70 includes a heat abso ⁇ tion container 74 and a heat radiation container 76 that are connected by a pair of tubes.
  • the heat abso ⁇ tion container 74 of the first cooling device 70 is coupled to the heat emission surface of a first heat emission element 78.
  • the second cooling device 80 includes a heat abso ⁇ tion container 84 and a heat radiation container 86 that are connected by a pair of tubes.
  • the heat radiation container 86 of the second cooling device 80 is coupled to a side of the heat abso ⁇ tion container 74 of the first cooling device 70.
  • the structures of the first cooling device and the second cooling device are the same as that of the cooling device shown in Fig. 4.
  • the structure of the heat radiation container 86 of the second cooling device 80 is changed by coupling the heat radiation container 86 to one side of the heat abso ⁇ tion container 74 of the first cooling device 70 so as to transfer the heat effectively.
  • the heat abso ⁇ tion container 84 of the second cooling device 80 is coupled to the heat emission surface of the second heat emission element 88. According to this embodiment, the heat released from the second heat emission element 88 can ultimately be transferred to outside via the heat radiation container 76 of the first cooling device 70.
  • the present invention has been described as a cooling device for heat emitting devices or elements within electronic products such as computers. But, the scope of the heat transfer apparatus of the present invention is not limited as a cooling device for use in computer.
  • the present invention can also be used to cool heat emitting devices or elements within other electronic products.
  • the present invention can also be used to transfer heat from a place of higher temperature to a place of lower temperature as long as there is a temperature difference between any two places or things. It can also transfer heat from an electric or combustion heater to a place that needs heat. This embodiment is especially useful for transferring heat to places where use of electricity or combustion is not allowed.
  • one heat abso ⁇ tion container is connected to plural heat radiation containers.
  • plural heat abso ⁇ tion containers are connected to one heat radiation container.
  • a heat transfer device comprising a plurality of heat transfer units that are connected to each other and comprised of a heat abso ⁇ tion container, heat radiation container, a first tube and a second tube is shown.
  • a first heat transfer unit 90 includes a heat abso ⁇ tion container 92 and a heat radiation container 94 and a first and second tubes 96 and 98 that connect the heat abso ⁇ tion container 92 to the heat radiation container 94.
  • a second heat transfer unit 100 includes a heat abso ⁇ tion container 102 and a heat radiation container 104 and a first and second tubes 106 and 108 that connect the heat abso ⁇ tion container 102 to the heat radiation container 104.
  • a heat emission element 110 is coupled to the heat radiation container 104 of the second heat transfer unit 100. Heat generated by the heat emission element 110 is absorbed by the heat abso ⁇ tion container 102, transferred to the heat radiation container 104, then moved to the heat abso ⁇ tion container 92, and finally released to outside.
  • Fig. 11 shows another embodiment of the present invention where plural heat transfer units are constructed between one heat generating place 150 and one heat radiation place 170.
  • Each heat transfer unit includes heat abso ⁇ tion containers 160a and 160b, heat radiation containers 162a and 162b, the first tubes 164a and 164b, and the second tubes 166a and 166b. This constitution is useful when the size of the heat transfer device 150 or 170 that is coupled to the heat generating place or the heat radiation place is large.
  • an HDD (Hard Disk Drive) case which will allow the heat from the heat emitting parts of the HDD to be released via an exterior wall of the case. This embodiment is explained below referring to Figs. 13 to 15.
  • vaporizing units are not limited to the type.
  • a portion of a pipe through which a refrigerant flows, which is constructed to absorb heat from surrounds (for example, when a fin is provided outside the pipe), and which absorbs heat from surrounds and allows the refrigerant inside to vaporize can be an evaporating unit of the present invention. The same applies to a condensing unit.
  • the HDD case 210 comprises a housing body 212 which includes a rectangular exterior housing member 220 and a rectangular interior housing member 230, a first cover 250, and a second cover 260 as shown in Figs. 13 to 15.
  • the exterior housing member 220 is made of aluminum and shaped, for example, by the extrusion as a hollow rectangular pipe with four wings 223.
  • the pu ⁇ ose of said wings is to provide guidance when inserting the HDD case 210 within a computer.
  • the refrigerant supply port 225 is disposed at a proper position on a wing 223a to introduce the refrigerant.
  • the refrigerant supply port 225 is connected to the refrigerant passageway 233 within walls of the case.
  • the refrigerant is introduced under the vacuumed condition, and subsequently the port 225 is sealed.
  • the preferable volume of the introduced liquid refrigerant is about half the volume of the space of the refrigerant passageway.
  • the interior housing member 230 gets inserted into the interior of said exterior housing member 220.
  • the dimensions of the exterior housing 220 and the interior housing member 230 is determined such that there is no spacing between the housings 220 and 230, and they are welded together to form the integral body 212.
  • the interior housing member 230 is shaped as a hollow rectangular pipe with grooves 231 to be used as the refrigerant passageways 233.
  • the interior housing member 230 is preferably manufactured by extrusion of good heat conducting metal materials, such as aluminum.
  • Interior housing member 230 is provided with grooves 231 and a projected portion 234 to provide the refrigerant passageways 233, and locking slots 235.
  • rectangular ring-shaped grooves 231a are formed around the exterior surface of the interior housing 230.
  • the ring-shaped grooves 231a are parallel to each other with constant distances between them.
  • a connecting channel 231b that provides connection between the ring-shaped grooves 231a is also provided.
  • the grooves define the refrigerant passageways 233 that are a pipe-type as shown in Fig. 3.
  • the refrigerant is introduced into the refrigerant passageways 233. When the heat transferred to one point on the housing body 212 is transferred to the refrigerant, the liquid refrigerant becomes vaporized, travels through the refrigerant passageway 233, and transfers the heat to a cooler region of the body.
  • the refrigerant used in said heat transfer apparatus may be used in this embodiment.
  • a projected portion 234 extends in a longitudinal direction.
  • An HDD sits on the top of the projected portion 234.
  • a disk rotation motor in an HDD, and a stator of the motor is exposed at the bottom to release heat. This stator contacts with the upper surface of the projection 234 within the case, and thus the heat is transferred to the housing body.
  • there are locking slots 234 for cooperation with two engaging bars of the first cover 250 to be mentioned later.
  • a plate spring 270 with high heat conductivity is placed between the interior wall of the interior housing member 230 and the HDD.
  • the plate spring is preferably made of phosphor bronze, and includes a base plate 270a and upper and lower waved plates 270b that are fixed on the base plate 270a as shown in Figs. 13 to 15.
  • the waved plates 270b become deformed. Consequently, said plate spring 270 fixes the HDD at one position and absorbs shocks and vibrations, thus protecting the HDD.
  • the first cover 250 is detachably assembled at an opened end of the housing body 212 as shown in Fig. 13.
  • the first cover 250 includes the engaging bars 254, and these bars 254 get detachably engaged with the locking slot 234.
  • the configuration that hooks are provided on the exterior wall of the housing and clips to be engaged with the hooks are provided on both sides of the first cover 250 may be used. That is, any constitution that allows the assembly and disassembly of the cover onto the housing can be used.
  • the first cover 250 includes a power cable port 252 and a signal cable port 253 to which connectors are coupled. The connection ports of the housing is connected with the connecting wire members 255, 256 having wires and connectors which will be engaged with ports of the HDD.
  • the second cover 260 is fixed, for instance, by way of welding as shown in Fig. 15.
  • the second cover 260 includes a handle 261.
  • the second cover 260 is positioned at the front panel of a computer when the HDD case is assembled in the computer.
  • the handle 261 can be folded into a groove within the second cover 260 and is unfolded when the HDD case is being assembled or disassembled.
  • the noise generated by other drive motors such as an HDD and the like can be significantly reduced.
  • the use of the present invention results in the overall reduction of noise when being used in a computer.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif pour éléments de refroidissement et dispositifs incorporés dans un ordinateur comprenant un conteneur d'absorption thermique (13) couplé à la surface d'émission de chaleur d'un dispositif émetteur de chaleur, un conteneur de rayonnement thermique (14) libérant de la chaleur et surplombant le conteneur d'absorption thermique (13), un premier tube (15) reliant le conteneur d'absorption thermique (13) et le conteneur de rayonnement thermique (14) et assurant un passage pour le fluide frigorigène vaporisé dans le conteneur (13) qui s'écoule dans le conteneur (14) et un second tube (16) reliant le conteneur (13) et le conteneur (14) et assurant un passage au fluide frigorigène liquéfié dans le conteneur (14) qui s'écoule ainsi dans le conteneur (13). Un clapet de non retour est installé au niveau du second tube (16) et permet l'écoulement du fluide frigorigène depuis le conteneur (14) vers le conteneur (13) tout en l'empêchant de parcourir le chemin inverse.
PCT/KR2000/001277 1999-11-08 2000-11-08 Appareil de transfert de chaleur faisant appel a un fluide frigorigene et ordinateur comprenant cet appareil WO2001035199A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU11779/01A AU1177901A (en) 1999-11-08 2000-11-08 Heat transfer apparatus using refrigerant and computer having the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1999/49284 1999-11-08
KR1019990049284A KR20010045825A (ko) 1999-11-08 1999-11-08 냉매를 이용한 열전달 장치
KR1020000008211A KR20010083711A (ko) 2000-02-21 2000-02-21 하드디스크 드라이브 케이스
KR2000/8211 2000-02-21

Publications (1)

Publication Number Publication Date
WO2001035199A1 true WO2001035199A1 (fr) 2001-05-17

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Country Status (3)

Country Link
KR (1) KR20020053838A (fr)
AU (1) AU1177901A (fr)
WO (1) WO2001035199A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1455261A1 (fr) * 2003-02-11 2004-09-08 Microsoft Corporation Système informatique avec refroidissement silencieux
EP1517603A1 (fr) * 2003-09-16 2005-03-23 Sgl Carbon Ag Dispositif de réfroidissement pour composants électroniques ou électriques
DE102004031251B4 (de) * 2004-06-29 2007-03-22 Sebastian Jaksch Vorrichtung zur Flüssigkeitskühlung von Mikroprozessoren in Computersystemen
CN117293104A (zh) * 2023-11-27 2023-12-26 贵州芯际探索科技有限公司 一种SiC元件散热封装结构及封装方法

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KR100492706B1 (ko) * 2002-10-10 2005-06-07 주식회사 에이팩 서버의 냉각구조
KR102154102B1 (ko) * 2020-08-06 2020-09-09 지스타기어(주) 컴퓨터 중앙처리장치의 수냉식 냉각용 냉각수 저장장치
WO2023239064A1 (fr) * 2022-06-10 2023-12-14 삼성전자주식회사 Structure de cadre et dispositif électronique la comprenant

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EP1455261A1 (fr) * 2003-02-11 2004-09-08 Microsoft Corporation Système informatique avec refroidissement silencieux
US6867985B2 (en) 2003-02-11 2005-03-15 Microsoft Corporation Computer system with noiseless cooling
EP1517603A1 (fr) * 2003-09-16 2005-03-23 Sgl Carbon Ag Dispositif de réfroidissement pour composants électroniques ou électriques
DE102004031251B4 (de) * 2004-06-29 2007-03-22 Sebastian Jaksch Vorrichtung zur Flüssigkeitskühlung von Mikroprozessoren in Computersystemen
CN117293104A (zh) * 2023-11-27 2023-12-26 贵州芯际探索科技有限公司 一种SiC元件散热封装结构及封装方法
CN117293104B (zh) * 2023-11-27 2024-03-22 贵州芯际探索科技有限公司 一种sic器件散热封装结构及封装方法

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