WO1999047994A1 - Systeme de refroidissement de dispositifs a l'interieur d'un ordinateur - Google Patents

Systeme de refroidissement de dispositifs a l'interieur d'un ordinateur Download PDF

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Publication number
WO1999047994A1
WO1999047994A1 PCT/KR1999/000118 KR9900118W WO9947994A1 WO 1999047994 A1 WO1999047994 A1 WO 1999047994A1 KR 9900118 W KR9900118 W KR 9900118W WO 9947994 A1 WO9947994 A1 WO 9947994A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchange
heat
exchange container
cooling system
computer
Prior art date
Application number
PCT/KR1999/000118
Other languages
English (en)
Inventor
Mok-Hyoung Lee
Kwang-Soon Lee
Ki-Oan Cheon
Original Assignee
Lee Mok Hyoung
Lee Kwang Soon
Cheon Ki Oan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Mok Hyoung, Lee Kwang Soon, Cheon Ki Oan filed Critical Lee Mok Hyoung
Priority to EP99909361A priority Critical patent/EP1062563A1/fr
Priority to JP2000537128A priority patent/JP2002517894A/ja
Priority to AU28577/99A priority patent/AU2857799A/en
Publication of WO1999047994A1 publication Critical patent/WO1999047994A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention is directed to a system for cooling electronic elements or devices, for example a central processing unit (“CPU") within a computer, more particularly to a cooling system having a configuration capable of reducing undesirable noise and introduction of dusts into the computer.
  • CPU central processing unit
  • elements and devices within a PC such as a CPU, graphic board and the like, have a higher processing speed.
  • the heat generated makes the temperature of the elements or devices to rise. Such temperature rising may cause the device to stop the operation or to erroneously operate.
  • a typical cooling device For cooling these elements or devices, a typical cooling device is used.
  • the heat radiation fin structure is mounted on the CPU.
  • a cooling fan is installed on an end of the fin structure. The operation of the cooling fan results in airflow to passes around fins. Thus, the heat is transferred to the air within the computer.
  • the computer also has a cooling fan secured to the back of a housing. The operation of this fan pulls out the air within the housing to outside of the housing. The air of the surrounding is introduced into the housing. Thus, the heat within the computer is transferred to the surrounding along with the air. Then, the temperature rising is prevented.
  • an object of the present invention is to provide a cooling system having a low noise level, low possibility of mechanical trouble and no need of electric power. It is another object of the present invention to provide a cooling system having a configuration which allows the computer to avoid from an influence of the outer air environment.
  • a cooling system for transferring heat from a device or element within a computer to the surrounding of the computer, the computer having a heat exchange surface exposed to the surrounding of the computer, the cooling system comprising: a first heat exchange container coupled to the device or element so as to be capable of transferring the heat from the device or element to the first heat exchange container; a second heat exchange container coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface and disposed at a position higher than the first heat exchange container; a first tube and a second tube connecting between the first heat exchange container and the second heat exchange container; the first heat exchange container, second heat exchange container and tubes defining an inner closed space in which a refrigeration medium is contained; and whereby the cooling of the device or element is accomplished by way of phase change and flow of the refrigeration medium.
  • a computer having a heat exchange surface exposed to the surrounding, a device or element generating heat, and a cooling system for transferring the heat of the device or element via the heat exchange surface to the surrounding of the computer, wherein: said cooling system including: a first heat exchange container coupled to the device or element so as to be capable of transferring the heat from the device or element to the first heat exchange container; a second heat exchange container coupled to the heat exchange surface so as to be capable of transferring the heat from the second heat exchange container to the heat exchange surface and disposed at a position higher than the first heat exchange container; a first tube and a second tube connecting between the first heat exchange container and the second heat exchange container; the first heat exchange container, second heat exchange container and tubes defining an inner closed space in which a refrigeration medium is contained; and whereby the cooling of the device or element is conducted by way of phase change and flow of the refrigeration medium.
  • said cooling system including: a first heat exchange container coupled to the device or element so as to be capable of transferring the heat from the device or element to the first heat exchange container
  • the computer includes a power supply and a heat exchange surface.
  • the power supply comprises an element generating heat, a heat conduct plate to which the heat generating element is attached, and the heat conduct plate being connected to the heat exchange surface.
  • the computer includes a hard disk drive.
  • the drive comprises a mechanism part, a circuitry disposed under the mechanism, and a heat conduct plate covering at least a portion of the circuitry
  • FIG. 1 is an elevation sectional view of a computer structure having a cooling system in accordance with the present invention
  • Fig. 2 is a perspective view of a cooling system in accordance with an embodiment of the present invention.
  • Fig. 3 is an enlarged sectional view taken along a line of A-A of Fig. 2;
  • Fig. 4 is a sectional view taken along a line of B-B of Fig. 2;
  • Fig. 5 is a sectional view taken along a line of E-E of Fig. 4;
  • Fig. 6 is a perspective view taken along a direction of an arrow C of Fig. 2;
  • Fig. 7 is an enlarged sectional view of a first heat exchange container in accordance with another embodiment of the present invention;
  • Fig. 8 is a perspective view a second heat exchange container and a heat conduct plate in accordance with a further embodiment of the present invention;
  • Fig. 9 is an enlarged sectional view taken along a line of F-F of Fig. 8;
  • Fig. 10 is a perspective view a first heat exchange container in accordance with a further another embodiment of the present invention
  • Fig. 11 is a sectional view taken along a line of G-G of Fig. 10;
  • Fig. 12 is a perspective view of a heat conduct plate incorporated in a power supply of a computer.
  • a cooling system for a device of CPU of a personal computer will be described. It should be understood, however, that a cooling system of the present invention can be applied for cooling other device such as a graphic board, ICs, disk drives, control cards, and other electronic elements.
  • a computer has a CPU mounted on a main circuit board.
  • a first heat exchange container is attached to a top surface of the CPU 3. It is preferable that the first heat exchange container 4 has a wall with a shape corresponding to the top surface of the CPU 3.
  • a second heat exchange container 6 is secured to and within a housing 1 of the PC.
  • the second heat exchange container 6 is installed at a position higher than that of the first heat exchange container 4. Although it is depicted in Fig. 1 that the second heat exchange container 6 is attached to the rear portion of the computer, the present invention is not limited to this configuration.
  • the container 6 may be secured to any other position where the heat is radiated effectively to the outside of the computer.
  • the container 6 is coupled to a heat exchange surface for radiating the heat to the outside or surrounding of the computer.
  • a heat radiation fin structure 61 is attached to an outer surface of the second heat exchange container 6 so as to enlarge the surface area for heat exchange.
  • the fin structure 61 has a plurality of fins.
  • the fin structure may additionally have a heat conduction plate (not shown).
  • the heat conduction plate is attached to the container 6.
  • the heat conduction plate and fins can be manufactured integrally.
  • Fig. 1 shows that the housing has a hole and that a surface of the second heat exchange container 6 is exposed to the outside of the computer.
  • a second heat exchange container is secured to the inner surface of the housing not to be exposed to the outside of the computer.
  • the fin structure is mounted on the outer surface of the housing adjacent to the second heat exchange container. That is, the housing wall is interposed between the second heat exchange container and the fin structure.
  • the housing is preferably constructed of a metal with a high heat conductivity.
  • the fin structure may have an attachment area to the housing larger than that of the second heat exchange container, similarly to an embodiment depicted in Fig. 7.
  • the configuration of the housing without the fin structure may be used.
  • the outer surface of the housing functions as a heat exchange surface for radiating the heat to the surrounding.
  • the first and second heat exchange containers 4 and 6 are connected and communicate each other with a first tube 7 and a second tube 8.
  • the first tube 7 and second tube 8 are connected to a side wall of the first heat exchange container 4.
  • the first tube 7 and second tube 8 are connected to a bottom wall of the second heat exchange container 6.
  • the heat is transferred from the CPU 3 to the first heat exchange container 4.
  • the heat is then transferred to the outside of the housing 1 of the computer via the second heat exchange container 6.
  • the tubes 7 and 8 can be constructed of metal, such as aluminum, copper and the like. It is found that the good cooling performance is achieved by using such the metal tube, when refrigerant of HCFC-123 is used.
  • the metal tube may cause an electrical problem, for example short.
  • the tubes 7 and 8 may be constructed of high-density plastic resin. It is preferable that the material of the plastic resin tube is not soluble with the refrigerant and does not allow the refrigerant to permeate.
  • a plastic resin tube which is generally used in an air-conditioner or refrigerator, can be used.
  • a power supply 5 is secured at a rear portion of the housing 1.
  • the power supply 5 has heat generating devices, such as a transformer PI, constant voltage IC P2 and the like. These heat generating devices PI and P2 are attached to a heat conduct plate 52 and finally connected to a heat radiating fin structure having a surface which is exposed to the outside of the computer. Due to the above configuration, it not necessary for the power supply 5 to have any conventional fan for cooling itself. In a modified embodiment, the power supply may be installed at a relatively low position.
  • the heat generating elements are attached to a heat conduct plate.
  • a first heat exchange container is secured to the plate.
  • the device may be directly attached to the first heat exchange container.
  • the first heat exchange container 4 has an outer wall 401 and an inner wall 41.
  • the inner wall 41 has capillary construction. This capillary construction enlarges the surface area for heat transfer to provide a good heat exchange performance.
  • the inner wall 41 with the capillary structure is manufactured by way of the sintering or powder metallurgy of copper powder.
  • the size of the first heat exchange container 4 may be limited by the size and location of the CPU or other adjacent parts, it is preferable that the surface area contacting to the refrigerant is enlarged. It is also preferable that the inner wall 41 covers the entire inner surface of the outer wall of the first heat exchange container 4 including a bottom wall contacting with the CPU 3. The refrigerant of liquid phase sink into the capillaries of the inner wall 41. This provides a good heat exchange.
  • the inner wall 41 is constructed of metal mesh or fabric.
  • the first heat exchange container 4 has an inlet formed on the container 4.
  • the inlet 44 is connected to the first tube 7.
  • the first heat exchange container 4 has an outlet 45 formed at a position higher than that of the inlet 44.
  • the outlet 45 is connected to the second tube 8.
  • the outer wall 401 of the first heat exchange container 4 is preferably constructed of metal having a high heat conductivity, such as copper, aluminum and the like.
  • the container may be configured so as to have a wall which is constructed of metal and a cover which is constructed of plastic resin such as nylon 6/6. In this case, the metal wall is contacted with the CPU.
  • the second heat exchange container 6 has a heat conduct plate 601 and a cover 602.
  • a plurality of fins 62 is mounted on the plate 601 in parallel to each other. The fins extend within the second heat exchange container 6. This configuration provides the enlarged area of the heat exchange surface to provide the good heat transfer.
  • the fin structure 61 is attached to an outer surface of the heat conduct plate 601 to provide the enlarged area of the heat transfer to the surrounding of the computer.
  • the fin structure 61 has a plurality of fins arranged in parallel each other.
  • the heat conduct plate 601 of the second heat exchange container 6 and the fin structure 61 is preferably constructed of metal with the high heat conductivity.
  • the cover 602 may be constructed of metal or plastic material such as nylon.
  • the second heat exchange container 6 has an outlet 63 formed on a bottom wall.
  • the outlet 63 is connected to the first tube 7 so that the refrigerant of liquid phase flows out.
  • the second heat exchange container 6 has an inlet 64 formed on the bottom wall.
  • the second tube 8 extends through the inlet 64 to a position higher than the outlet 63. It is preferable that the end of the second tube 8 is higher than the level L of the refrigerant of liquid phase contained within the container 6. (See Fig. 5.)
  • the first heat exchange container 4 and second heat exchange container 6 are sealed to prevent leakage of the refrigerant or introduction of the air.
  • the wall and the cover of the containers 4 and 6 may be impregnated with plastic resin material, when required.
  • the plastic material is preferably a kind of high-density plastic resin through which the refrigerant cannot permeate.
  • the plastic material without chemical reaction with the refrigerant is preferably selected.
  • the connecting portions of the tubes 7 and 8 to the containers 4 and 6 are sealed so that the refrigerant cannot leak and the air cannot be introduced. In Figs. 2 to 5, it is shown that the tubes 7 and 8 are directly coupled with the walls of the containers 4 and 6.
  • conventional tube fittings can be used for coupling the tubes 7 and 8 with the walls of the containers 4 and 6 under the condition that the fittings provide good sealing.
  • the refrigerant used in the present invention is not harmful for human body or dangerous.
  • the refrigerant is hard to react chemically with the parts of the cooling system.
  • a refrigerant of HCFC-123 is preferably used as the refrigerant of the present invention.
  • HCFC-123 is available from Dupont in U.S. as the name of Suva 123.
  • the container 4 or 6 has a valve for putting the refrigerant into the cooling system.
  • a fan 9 may be provided under the fin structure 61.
  • the fan 9 has a switch 91, such as bimetal switch.
  • the switch 91 drives the fan by turning on or off in pursuant to the temperature.
  • the fan 9 can be small in comparison with a fan used in conventional cooling system of the computer.
  • Fig. 6 is useful under the environment where the floating matters, such as dusts, are plentiful. Considering that the floating matters cannot be introduced within the computer, this configuration is also advantageous in comparison with the conventional cooling system.
  • Figs. 1 and Fig. 5 the operation of the cooling system in accordance with the embodiment of the present invention will be discussed.
  • the phase of the refrigerant is changed from liquid to gas or from gas to liquid by way of heat exchange accomplished within the containers of the cooling system according to the present invention. Due to density difference of the phases of the refrigerant and potential difference of the first heat exchange container 4 and second heat exchange container 6, the refrigerant is circulated as discussed in detail.
  • the heat is generated from the CPU 3.
  • the heat is transferred to first heat exchange container 4 and then to the refrigerant in the capillary of the container 4.
  • the phase of the refrigerant is changed from liquid to gas.
  • the evaporated refrigerant gas flows through the second tube 8 to the second heat exchange container 6.
  • the heat contained in the gaseous refrigerant within the second heat exchange container 6 is transferred to the outside of the computer via the heat conduct plate 601 and the fin structure 61. During this process, the phase of the refrigerant is changed from gas to liquid.
  • the liquefied refrigerant is collected to a bottom portion of the second heat exchange container 6.
  • volume of the refrigerant is controlled so that the level L of the refrigerant should not be higher than the intermediate of the second heat exchange container 6. If not, the heat exchange surface area may be insufficient.
  • the liquefied refrigerant flows from the second heat exchange container 6 through the first tube 7 to the first heat exchange container 4 by way of gravity of the liquefied refrigerant.
  • the heat generated from the CPU 3 can be transferred to the outside of the computer.
  • the temperature of the CPU 3 is maintained so that the CPU 3 operates properly.
  • the temperature to be maintained can be controlled by varying the surface area of the fin structure.
  • the surface area of the fin structure 61 may be decided through consideration of the temperature of the surrounding of the computer.
  • a first heat exchange container 4a in accordance with another embodiment has a plurality of heat exchange fins 42.
  • the fins 42 are installed at a wall contacting to the CPU 3 to be arranged in parallel.
  • the heat exchange fins 42 have holes. The distal ends of the fins 42 are spaced from the opposing wall 49 of the container 4a. This configuration allows the refrigerant to flow well.
  • the first heat exchange container 4a has an inlet 44a connected with the first tube 7.
  • the inlet 44a is formed on a side wall. The liquid refrigerant flows into the container 4a through the inlet
  • the first heat exchange container 4a has an outlet 45a connected with the second tube 8.
  • the outlet 45a is formed on a top wall 49 opposing to the bottom wall contacting to the CPU.
  • the gaseous refrigerant flows out through the outlet 45a.
  • a second heat exchange container 6a in accordance with a further embodiment has a plurality of fins 62a.
  • the fins 62a installed within the container 6a to be arranged in parallel each other.
  • the fins 62a provide the enlarged surface of heat exchange.
  • the container 6a has a heat conduct plate 66a.
  • the heat conduct plate 66a expands beyond a cover of the container 6a.
  • a fin structure 61a having a plurality of fins is mounted on the heat conduct plate 66a.
  • the second heat exchange container 6a has an inlet 64a and an outlet 63a.
  • the configuration of the inlet 64a, outlet 63a and the connecting structure of the tubes 7 and 8 are similar to the embodiment described above with reference to Fig. 6.
  • Figs. 10 and 11 depict a first heat exchange container 4b in accordance with a further another embodiment of the present invention.
  • the first heat exchange container 4b can be attached to a CPU 3b installed on a main board arranged vertically.
  • the first heat exchange container 4b can be also attached to a CPU installed on a main board arranged horizontally. That is, the first heat exchange container 4b depicted in Figs. 10 and 11 can be attached to the CPU having any orientation of the installation.
  • the first tube 7 and the second tube 8 is connected to the top wall the first heat exchange container 4b.
  • the first heat exchange container 4b has a valve 46 for putting into the refrigerant. As described above, it is preferable that the air is removed from the inner space of the cooling system before the refrigerant is introduced through the valve 46.
  • the first heat exchange container 4b has an oudet 44b connected to the second tube 8.
  • This outlet 44b may have a slit shape.
  • the first tube 7 extends beyond the top wall of the first heat exchange container 4b to the inside of the first heat exchange container 4b.
  • a distal end 7b of the first tube 7 is lower than the outlet 44b, when the first heat exchange container 4b is mounted vertically as shown in Figs. 10 and 11.
  • the outlet 44b is offset from the first tube 7.
  • the outlet 44b locates at a higher position than the end 71 of the first tube 7.
  • the heat generated from CPU 3 is transferred to the refrigerant in the first heat exchange container 4, 4a and 4b.
  • the refrigerant is evaporated and flows toward the second heat exchange container 6 and 6a.
  • the heat is transferred to the outside by way of heat transfer or radiation via the second heat exchange container 6 and 6a.
  • the gaseous refrigerant is liquefied and flows downwardly toward the heat exchange container 4, 4a and 4b.
  • the cooling system in accordance with the present invention avoids the introduction of humidity and floating matters, which may cause fatal influence to the devices such as electric elements, circuitry, disk drives or the like. Further, since mechanically operated devices or apparatus are unnecessary in the cooling system in accordance with the present invention, deterioration or disorder due to long time operation can be avoided.
  • the cooling system in accordance with the present invention can be operated without the electrical power or energy supplied from the outside, the power consumption of the computer can be reduced. In the above embodiments, the cooling system is described to cool the CPU.
  • the cooling system can cool any other devices.
  • the cooling system in accordance with the present invention may be used for cooling a hard disk drive mounted within the computer.
  • the hard disk typically has a plurality of disks, mechanically operated parts, such as a disk drive motor, head mechanism or the like, and a circuit board.
  • the circuit board has elements generating heat and typically disposed at the bottom portion of the hard disk drive.
  • the hard disk drive has a heat conduct plate positioned under the circuit board.
  • the heat conduct plate is constructed of metal with high heat conductivity such as aluminum or copper.
  • the heat conduct plate covers entirely the bottom of the hard disk drive.
  • the heat conduct plate may cover partially the bottom of the hard disk drive.
  • the heat conduct plate may extends horizontally beyond a cover of the hard disk drive.
  • a first heat exchange container is attached to the heat conduct plate.
  • the cooling system in accordance with the present invention may be used also for cooling devices within the power supply, as described above.
  • the cooling system having a single first heat exchange container and a single second heat exchange container which are connected each other.
  • the cooling system may includes a single second heat exchange container and a plurality of the first heat exchange containers attached to the devices, such as a CPU, graphic board, elements in a power supply, a hard disk drive and the like.
  • the cooling system has a plurality of the second heat exchange containers.
  • a single or a plurality of the first heat exchange containers can be connected to each second heat exchange containers.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ordinateur doté d'une surface d'échange de chaleur (3) exposée à l'environnement, un dispositif ou un élément générant de la chaleur et un système de refroidissement permettant d'évacuer la chaleur du dispositif ou de l'élément par la surface d'échange de chaleur. Le système de refroidissement comprend un premier (4) récipient d'échange de chaleur et un deuxième (6) récipient d'échange de chaleur. Le premier récipient d'échange de chaleur est couplé au dispositif ou à l'élément de manière à être capable de transférer la chaleur du dispositif ou de l'élément dans le premier récipient d'échange de chaleur. Le deuxième récipient d'échange de chaleur est couplé à la surface d'échange de chaleur de manière à être capable de transférer la chaleur provenant du deuxième récipient d'échange de chaleur dans la surface d'échange de chaleur, le deuxième récipient d'échange de chaleur étant disposé à une position supérieure à celle du premier récipient d'échange de chaleur. Un premier tube (7) et un deuxième tube (8) relient le premier récipient d'échange de chaleur au deuxième récipient d'échange de chaleur. Les premier récipient d'échange de chaleur, deuxième récipient d'échange de chaleur et tubes définissent un espace fermé intérieur contenant un agent de réfrigération. Le refroidissement du dispositif ou de l'élément s'effectue par changement de phase et écoulement de l'agent de réfrigération.
PCT/KR1999/000118 1998-03-16 1999-03-15 Systeme de refroidissement de dispositifs a l'interieur d'un ordinateur WO1999047994A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP99909361A EP1062563A1 (fr) 1998-03-16 1999-03-15 Systeme de refroidissement de dispositifs a l'interieur d'un ordinateur
JP2000537128A JP2002517894A (ja) 1998-03-16 1999-03-15 コンピュータの冷却システム
AU28577/99A AU2857799A (en) 1998-03-16 1999-03-15 System for cooling device in computer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1998/8723 1998-03-16
KR1019980008723A KR19980019402A (ko) 1998-03-16 1998-03-16 피.씨의 씨.피.유 냉각장치(cpu cooling device of pc)

Publications (1)

Publication Number Publication Date
WO1999047994A1 true WO1999047994A1 (fr) 1999-09-23

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Application Number Title Priority Date Filing Date
PCT/KR1999/000118 WO1999047994A1 (fr) 1998-03-16 1999-03-15 Systeme de refroidissement de dispositifs a l'interieur d'un ordinateur

Country Status (6)

Country Link
EP (1) EP1062563A1 (fr)
JP (1) JP2002517894A (fr)
KR (2) KR19980019402A (fr)
CN (1) CN1293774A (fr)
AU (1) AU2857799A (fr)
WO (1) WO1999047994A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002017698A2 (fr) * 2000-08-22 2002-02-28 Hb Innovation Ltd. Systeme de gestion thermique distribue pour composants electroniques
DE10053258A1 (de) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Enthitzungseinrichtung für elektronische Geräte
DE10360236A1 (de) * 2003-12-20 2005-07-28 Gerd Lukoschus Fremdenergiefreie Kühlung für elektronische Bauteile
DE102004020642A1 (de) * 2004-04-22 2005-11-10 Höhne, Sven, Dipl.-Ing (FH) Schwerkraftkühlung für elektronische Bauteile
EP1491987A3 (fr) * 2003-06-27 2006-06-21 Fujitsu Siemens Computers GmbH Refroidissement d'un composant d'ordinateur
DE102005019437A1 (de) * 2005-01-25 2006-08-03 Axel Benner Computer
DE102004031251B4 (de) * 2004-06-29 2007-03-22 Sebastian Jaksch Vorrichtung zur Flüssigkeitskühlung von Mikroprozessoren in Computersystemen
DE102006011331A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere von elektronischen Bauelementen, Gaskühler und Verdampfer
US8199503B2 (en) 2009-09-30 2012-06-12 Kabushiki Kaisha Toshiba Electronic device

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000061442A (ko) * 1999-03-26 2000-10-16 최은광 수냉 공냉 혼합형 컴퓨터 냉각 시스템
KR100468278B1 (ko) * 1999-09-16 2005-01-27 현대중공업 주식회사 전도체 일체형 히트파이프 냉각기
EP1158389A3 (fr) * 2000-05-25 2002-11-13 Kioan Cheon Ordinateur possédant un dispositif de refroidissement et échangeur de chaleur de ce dispositif de refroidissement
KR100440733B1 (ko) * 2001-03-02 2004-07-19 주식회사 영동 컴퓨터의 중앙처리장치용 방열장치
KR20010069631A (ko) * 2001-04-24 2001-07-25 김태국 무방향 평판형 히트펌프 장치
KR100438830B1 (ko) * 2001-11-10 2004-07-05 삼성전자주식회사 컴퓨터 냉각 장치
KR20030039206A (ko) * 2001-11-12 2003-05-17 주식회사 다온테크 라디에이터형 냉각 기기의 냉각기능 향상 장치
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KR20010041932A (ko) 2001-05-25
CN1293774A (zh) 2001-05-02
JP2002517894A (ja) 2002-06-18
AU2857799A (en) 1999-10-11
KR19980019402A (ko) 1998-06-05

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