JP2002516238A5 - - Google Patents

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Publication number
JP2002516238A5
JP2002516238A5 JP2000550138A JP2000550138A JP2002516238A5 JP 2002516238 A5 JP2002516238 A5 JP 2002516238A5 JP 2000550138 A JP2000550138 A JP 2000550138A JP 2000550138 A JP2000550138 A JP 2000550138A JP 2002516238 A5 JP2002516238 A5 JP 2002516238A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2000550138A
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Japanese (ja)
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JP2002516238A (ja
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Priority claimed from US09/082,413 external-priority patent/US6215897B1/en
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Publication of JP2002516238A publication Critical patent/JP2002516238A/ja
Publication of JP2002516238A5 publication Critical patent/JP2002516238A5/ja
Pending legal-status Critical Current

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JP2000550138A 1998-05-20 1999-05-13 自動基板処理システム Pending JP2002516238A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/082,413 US6215897B1 (en) 1998-05-20 1998-05-20 Automated substrate processing system
US09/082,413 1998-05-20
PCT/IB1999/001251 WO1999060610A1 (en) 1998-05-20 1999-05-13 An automated substrate processing system

Publications (2)

Publication Number Publication Date
JP2002516238A JP2002516238A (ja) 2002-06-04
JP2002516238A5 true JP2002516238A5 (enExample) 2008-11-27

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ID=22171056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000550138A Pending JP2002516238A (ja) 1998-05-20 1999-05-13 自動基板処理システム

Country Status (6)

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US (2) US6215897B1 (enExample)
EP (1) EP1078392A1 (enExample)
JP (1) JP2002516238A (enExample)
KR (1) KR100627531B1 (enExample)
TW (1) TW412826B (enExample)
WO (1) WO1999060610A1 (enExample)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6079693A (en) 1998-05-20 2000-06-27 Applied Komatsu Technology, Inc. Isolation valves
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6215897B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
WO2002023597A2 (en) * 2000-09-15 2002-03-21 Applied Materials, Inc. Double dual slot load lock for process equipment
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
US20040223053A1 (en) * 2003-05-07 2004-11-11 Mitutoyo Corporation Machine vision inspection system and method having improved operations for increased precision inspection throughput
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
US7813638B2 (en) * 2004-06-07 2010-10-12 Rudolph Technologies, Inc. System for generating camera triggers
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
DE102004029552A1 (de) * 2004-06-18 2006-01-05 Peter Mäckel Verfahren zur Sichtbarmachung und Messung von Verformungen von schwingenden Objekten mittels einer Kombination einer synchronisierten, stroboskopischen Bildaufzeichnung mit Bildkorrelationsverfahren
US7499584B2 (en) * 2004-10-21 2009-03-03 Mitutoyo Corporation Smear-limit based system and method for controlling vision systems for consistently accurate and high-speed inspection
US7440091B2 (en) * 2004-10-26 2008-10-21 Applied Materials, Inc. Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
US20060273815A1 (en) * 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US20070046940A1 (en) * 2005-08-22 2007-03-01 Jun Gao Positioning system and method using displacements
US20070071324A1 (en) * 2005-09-27 2007-03-29 Lexmark International, Inc. Method for determining corners of an object represented by image data
CN100394576C (zh) * 2005-12-09 2008-06-11 北京圆合电子技术有限责任公司 具有视觉传感器的硅片传输系统及传输方法
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7828504B2 (en) * 2006-05-12 2010-11-09 Axcellis Technologies, Inc. Combination load lock for handling workpieces
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
JP4098338B2 (ja) 2006-07-20 2008-06-11 川崎重工業株式会社 ウェハ移載装置および基板移載装置
US8104951B2 (en) * 2006-07-31 2012-01-31 Applied Materials, Inc. Temperature uniformity measurements during rapid thermal processing
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US7496423B2 (en) * 2007-05-11 2009-02-24 Applied Materials, Inc. Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots
US20090027522A1 (en) * 2007-07-26 2009-01-29 Honeywell International Inc. Systems and methods for enhancing edge detection
US20090153913A1 (en) * 2007-12-18 2009-06-18 Butler Jr William Joseph Method For Providing Enhancement With An Imaging Apparatus
US8276959B2 (en) 2008-08-08 2012-10-02 Applied Materials, Inc. Magnetic pad for end-effectors
TWI512865B (zh) 2008-09-08 2015-12-11 Rudolph Technologies Inc 晶圓邊緣檢查技術
JP5342210B2 (ja) * 2008-10-30 2013-11-13 三菱重工業株式会社 アライメント装置制御装置およびアライメント方法
DE102009016288B4 (de) * 2009-01-02 2013-11-21 Singulus Technologies Ag Verfahren und Vorrichtung für die Ausrichtung von Substraten
KR101047784B1 (ko) * 2009-01-08 2011-07-07 주식회사 엘지실트론 급속 열처리 챔버의 모니터링 장치 및 방법
EP2415021B1 (de) * 2009-04-03 2016-07-27 Singulus Technologies AG Verfahren und vorrichtung für die ausrichtung von substraten
CN101648382A (zh) * 2009-06-26 2010-02-17 东莞宏威数码机械有限公司 集束传输设备
WO2012124521A1 (ja) * 2011-03-11 2012-09-20 シャープ株式会社 基板検査装置および基板検査方法
JP6368453B2 (ja) * 2011-06-24 2018-08-01 株式会社日立国際電気 基板処理装置、及び基板処理装置のデータ解析方法並びにプログラム
WO2013086432A2 (en) 2011-12-07 2013-06-13 Intevac, Inc. High throughput load lock for solar wafers
US9262840B2 (en) 2012-06-08 2016-02-16 Correlated Solutions, Inc. Optical non-contacting apparatus for shape and deformation measurement of vibrating objects using image analysis methodology
US9658169B2 (en) 2013-03-15 2017-05-23 Rudolph Technologies, Inc. System and method of characterizing micro-fabrication processes
KR101473831B1 (ko) 2013-03-29 2014-12-19 주식회사 에스에프에이 이송장치
US9111979B2 (en) * 2013-05-16 2015-08-18 Kevin P Fairbairn System and method for real time positioning of a substrate in a vacuum processing system
JP6309220B2 (ja) * 2013-08-12 2018-04-11 株式会社ダイヘン 搬送システム
WO2015095799A1 (en) * 2013-12-22 2015-06-25 Applied Materials, Inc. Monitoring system for deposition and method of operation thereof
JP6377918B2 (ja) * 2014-03-06 2018-08-22 株式会社ダイヘン 基板損傷検出装置、その基板損傷検出装置を備えた基板搬送ロボット及び基板損傷検出方法
TWM531888U (zh) * 2014-11-07 2016-11-11 應用材料股份有限公司 機器人及具有其之處理系統
US9638335B2 (en) 2015-01-08 2017-05-02 King Lai Hygienic Materials Co., Ltd. Double sealing valve
CN104959320A (zh) * 2015-06-18 2015-10-07 浙江大学台州研究院 一种产品全自动目检机的校准方法
US9966290B2 (en) 2015-07-30 2018-05-08 Lam Research Corporation System and method for wafer alignment and centering with CCD camera and robot
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
CN111788825B (zh) * 2018-02-27 2023-03-28 佳能株式会社 半导体装置、图像捕获装置、图像捕获系统和移动物体
JP7184003B2 (ja) * 2019-09-17 2022-12-06 株式会社ダイフク 物品搬送設備
US11987884B2 (en) * 2021-04-15 2024-05-21 Jnk Tech Glass and wafer inspection system and a method of use thereof
US11508590B2 (en) * 2021-04-15 2022-11-22 Jnk Tech Substrate inspection system and method of use thereof
US20230416906A1 (en) * 2022-06-28 2023-12-28 Applied Materials, Inc. Methods and apparatus for processing a substrate
US12046501B2 (en) 2022-10-06 2024-07-23 Kawasaki Jukogyo Kabushiki Kaisha Substrate handling apparatus and method of handling substrate

Family Cites Families (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB851444A (en) 1956-06-05 1960-10-19 Commissariat Energie Atomique Improvements in or relating to vacuum control valves
US3040773A (en) 1959-09-04 1962-06-26 Crane Co Combined valve actuating and indicator mechanism
US3524467A (en) 1967-10-13 1970-08-18 Exxon Research Engineering Co Fluid expanded disk valve
US3717322A (en) 1970-10-27 1973-02-20 Verreries Appliquees Shutter valves for high-vacuum applications
DE2114470B2 (de) 1971-03-25 1975-02-13 Flachglas Ag Delog-Detag, 4650 Gelsenkirchen Vorrichtung zum kontinuierlichen, einseitigen Beschichten von Platten, wie Glasscheiben, Keramik- oder Kunststoffplatten u. dgl. mittels Kathodenzerstäubung
CH546912A (de) 1971-10-25 1974-03-15 Vat Ag Schnellschlussventil.
US3850105A (en) 1972-12-29 1974-11-26 Ibm Apparatus for transferring articles through various processing sectors of a manufacturing system
CH582842A5 (enExample) 1974-07-15 1976-12-15 Vat Ag
US3973665A (en) 1975-03-07 1976-08-10 Gca Corporation Article delivery and transport apparatus for evacuated processing equipment
US4075787A (en) 1975-07-07 1978-02-28 American Sterilizer Company Inflatable pouch to seal
US3976330A (en) 1975-10-01 1976-08-24 International Business Machines Corporation Transport system for semiconductor wafer multiprocessing station system
US4047624A (en) 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
DE2639198C3 (de) 1976-08-31 1981-11-26 Messerschmitt-Bölkow-Blohm GmbH, 8000 München Absperrschieber
US4166563A (en) 1977-09-27 1979-09-04 Societe Suisse Pour L'industrie Horlogere Management Services, S.A. Transfer machine for sealing electronic or like components under vacuum
US4157169A (en) 1977-10-12 1979-06-05 Torr Vacuum Products Fluid operated gate valve for use with vacuum equipment
US5187115A (en) 1977-12-05 1993-02-16 Plasma Physics Corp. Method of forming semiconducting materials and barriers using a dual enclosure apparatus
JPS5953320B2 (ja) 1978-04-22 1984-12-24 キッコーマン株式会社 固形状油性物質の製造法
CH636422A5 (de) 1979-02-26 1983-05-31 Balzers Hochvakuum Hochvakuumventil.
US4381100A (en) 1981-01-02 1983-04-26 Fairchild Industries, Inc. Valve and valving apparatus
JPS584336A (ja) 1981-06-30 1983-01-11 Fanuc Ltd ワ−ク供給装置
US4449885A (en) 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4682927A (en) 1982-09-17 1987-07-28 Nacom Industries, Incorporated Conveyor system
JPS60136671A (ja) 1983-12-26 1985-07-20 Fuji Seikou Kk ゲ−トバルブのシ−ル構造
US4618938A (en) * 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection
US5259881A (en) 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4558984A (en) 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
JPS6162739A (ja) 1984-09-03 1986-03-31 Sanki Eng Co Ltd クリ−ントンネル
JPS61117278U (enExample) 1985-01-08 1986-07-24
AU572375B2 (en) 1985-01-31 1988-05-05 Boc Group, Inc., The Transporting of workpiece to and from vacuum coating apparatus
US4749465A (en) 1985-05-09 1988-06-07 Seagate Technology In-line disk sputtering system
US4709655A (en) 1985-12-03 1987-12-01 Varian Associates, Inc. Chemical vapor deposition apparatus
US5110249A (en) 1986-10-23 1992-05-05 Innotec Group, Inc. Transport system for inline vacuum processing
JPS63133545A (ja) 1986-11-25 1988-06-06 Dainippon Screen Mfg Co Ltd 熱処理装置の基板移載搬送装置
US4775281A (en) 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
JPS63141342A (ja) 1986-12-04 1988-06-13 Ushio Inc 半導体ウエハ処理方法及びその装置
US4721282A (en) 1986-12-16 1988-01-26 Lam Research Corporation Vacuum chamber gate valve
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5292393A (en) 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
JPS63141342U (enExample) 1987-03-06 1988-09-19
US4829445A (en) 1987-03-11 1989-05-09 National Semiconductor Corporation Distributed routing unit for fully-automated flexible manufacturing system
US4913929A (en) 1987-04-21 1990-04-03 The Board Of Trustees Of The Leland Stanford Junior University Thermal/microwave remote plasma multiprocessing reactor and method of use
US4846102A (en) 1987-06-24 1989-07-11 Epsilon Technology, Inc. Reaction chambers for CVD systems
JPH0333058Y2 (enExample) 1987-06-26 1991-07-12
JPS6411320A (en) 1987-07-06 1989-01-13 Toshiba Corp Photo-cvd device
EP0306967B1 (en) 1987-09-11 1997-04-16 Hitachi, Ltd. Apparatus for performing heat treatment on semiconductor wafers
EP0312046B1 (en) 1987-10-14 1994-07-27 Hitachi, Ltd. Apparatus and method for inspecting defect of mounted component with slit light
FR2621930B1 (fr) 1987-10-15 1990-02-02 Solems Sa Procede et appareil pour la production par plasma de couches minces a usage electronique et/ou optoelectronique
KR970003907B1 (ko) 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US5259883A (en) 1988-02-16 1993-11-09 Kabushiki Kaisha Toshiba Method of thermally processing semiconductor wafers and an apparatus therefor
US4857689A (en) 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
US5170714A (en) 1988-06-13 1992-12-15 Asahi Glass Company, Ltd. Vacuum processing apparatus and transportation system thereof
EP0346815A3 (en) 1988-06-13 1990-12-19 Asahi Glass Company Ltd. Vacuum processing apparatus and transportation system thereof
US5064337A (en) 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers
US5024570A (en) 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
DE3941110A1 (de) 1988-12-19 1990-06-28 Rif O Z Mikroelektroniki Vakuumeinrichtung zum aufdampfen von schichten
JPH02186172A (ja) 1989-01-10 1990-07-20 Irie Koken Kk 無しゅう動ゲートバルブ用弁体
JPH0793348B2 (ja) 1989-05-19 1995-10-09 アプライド マテリアルズ インコーポレーテッド 多重チャンバ真空式処理装置及び多重チャンバ真空式半導体ウェーハ処理装置
EP0405301B1 (en) 1989-06-29 1995-08-30 Applied Materials, Inc. Apparatus for handling semiconductor wafers
US5120019A (en) 1989-08-03 1992-06-09 Brooks Automation, Inc. Valve
US5227708A (en) 1989-10-20 1993-07-13 Applied Materials, Inc. Two-axis magnetically coupled robot
ES2130295T3 (es) 1989-10-20 1999-07-01 Applied Materials Inc Aparato de tipo robot.
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
JP2600399B2 (ja) 1989-10-23 1997-04-16 富士電機株式会社 半導体ウエーハ処理装置
US5203443A (en) 1989-11-13 1993-04-20 Kabushiki Kaisha Shinkawa Conveying apparatus used in assembling semicondutors
GB2240157A (en) 1990-01-12 1991-07-24 Colin Badham Flow control valve for fluid materials
JPH03234979A (ja) 1990-02-09 1991-10-18 Canon Inc 仕切り弁
GB9006471D0 (en) 1990-03-22 1990-05-23 Surface Tech Sys Ltd Loading mechanisms
US5274434A (en) 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
US5060354A (en) 1990-07-02 1991-10-29 George Chizinsky Heated plate rapid thermal processor
US5252807A (en) 1990-07-02 1993-10-12 George Chizinsky Heated plate rapid thermal processor
JP2938160B2 (ja) 1990-07-20 1999-08-23 東京エレクトロン株式会社 真空処理装置
JP2893926B2 (ja) 1990-10-25 1999-05-24 神鋼電機株式会社 推力発生装置
US5668056A (en) 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
WO1992017621A1 (en) 1991-04-04 1992-10-15 Conner Peripherals, Inc. Apparatus and method for high throughput sputtering
US5195234A (en) 1991-08-19 1993-03-23 Motorola, Inc. Method and apparatus for visual alignment of parts
US5215420A (en) 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
US5275709A (en) 1991-11-07 1994-01-04 Leybold Aktiengesellschaft Apparatus for coating substrates, preferably flat, more or less plate-like substrates
JP2598353B2 (ja) 1991-12-04 1997-04-09 アネルバ株式会社 基板処理装置、基板搬送装置及び基板交換方法
US5382126A (en) 1992-03-30 1995-01-17 Leybold Ag Multichamber coating apparatus
SG47541A1 (en) 1992-06-26 1998-04-17 Materials Research Corp Transport system for wafer processing line
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
KR970011065B1 (ko) 1992-12-21 1997-07-05 다이닛뽕 스크린 세이조오 가부시키가이샤 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법
US5535306A (en) 1993-01-28 1996-07-09 Applied Materials Inc. Self-calibration system for robot mechanisms
EP0608633B1 (en) 1993-01-28 1999-03-03 Applied Materials, Inc. Method for multilayer CVD processing in a single chamber
JP2683208B2 (ja) 1993-01-28 1997-11-26 アプライド マテリアルズ インコーポレイテッド ロボット機構を用いた搬入および搬出のためのワークピース位置合わせ方法および装置
EP0608620B1 (en) 1993-01-28 1996-08-14 Applied Materials, Inc. Vacuum Processing apparatus having improved throughput
US5607009A (en) 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
US5352294A (en) 1993-01-28 1994-10-04 White John M Alignment of a shadow frame and large flat substrates on a support
US5474410A (en) 1993-03-14 1995-12-12 Tel-Varian Limited Multi-chamber system provided with carrier units
US5417537A (en) 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
US5377816A (en) 1993-07-15 1995-01-03 Materials Research Corp. Spiral magnetic linear translating mechanism
JP2683317B2 (ja) 1993-11-19 1997-11-26 マルヤス機械株式会社 コンベア
US5588827A (en) 1993-12-17 1996-12-31 Brooks Automation Inc. Passive gas substrate thermal conditioning apparatus and method
US5379983A (en) 1993-12-21 1995-01-10 Vat Holding Ag Shut-off valves for pipelines
US5696835A (en) 1994-01-21 1997-12-09 Texas Instruments Incorporated Apparatus and method for aligning and measuring misregistration
JPH07245285A (ja) 1994-03-03 1995-09-19 Dainippon Screen Mfg Co Ltd 基板処理装置
DE4414176A1 (de) 1994-04-22 1995-10-26 Zimmermann & Jansen Gmbh Plattenschieber
DE9407482U1 (de) 1994-05-05 1994-10-06 Balzers und Leybold Deutschland Holding AG, 63450 Hanau Funktionseinrichtung für eine Vakuumanlage für die Behandlung von scheibenförmigen Werkstücken
DE4418019A1 (de) 1994-05-24 1995-11-30 Vse Vakuumtechn Gmbh Ventilmechanik für ein Vakuumventil
JP2766190B2 (ja) 1994-07-28 1998-06-18 入江工研株式会社 無しゅう動真空ゲートバルブ
TW295677B (enExample) 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
US5730801A (en) 1994-08-23 1998-03-24 Applied Materials, Inc. Compartnetalized substrate processing chamber
JP3136345B2 (ja) 1994-08-25 2001-02-19 富士電子工業株式会社 高周波加熱装置
JP3350278B2 (ja) 1995-03-06 2002-11-25 大日本スクリーン製造株式会社 基板処理装置
JP3732250B2 (ja) 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
JP3973112B2 (ja) 1995-06-07 2007-09-12 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド ウェーハの向き整合システム
JP3288200B2 (ja) 1995-06-09 2002-06-04 東京エレクトロン株式会社 真空処理装置
TW309503B (enExample) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH0936198A (ja) 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
KR100238998B1 (ko) 1995-07-26 2000-01-15 우치가사키 기이치로 가열로
JP3650495B2 (ja) 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
US5577707A (en) 1995-12-18 1996-11-26 Vat Holding Ag Slide valve
US5789890A (en) 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6203582B1 (en) 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US5879128A (en) 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US5891251A (en) 1996-08-07 1999-04-06 Macleish; Joseph H. CVD reactor having heated process chamber within isolation chamber
US5881649A (en) 1996-08-13 1999-03-16 Anelva Corporation Magnetic transfer system, power transmission mechanism of the magnetic transfer system, and rotational driving member used for the system
TW350115B (en) * 1996-12-02 1999-01-11 Toyota Automatic Loom Co Ltd Misregistration detection device and method thereof
US5933521A (en) * 1997-06-23 1999-08-03 Pasic Engineering, Inc. Wafer reader including a mirror assembly for reading wafer scribes without displacing wafers
US6013134A (en) 1998-02-18 2000-01-11 International Business Machines Corporation Advance integrated chemical vapor deposition (AICVD) for semiconductor devices
US6215897B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system

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