JP2002516238A - 自動基板処理システム - Google Patents

自動基板処理システム

Info

Publication number
JP2002516238A
JP2002516238A JP2000550138A JP2000550138A JP2002516238A JP 2002516238 A JP2002516238 A JP 2002516238A JP 2000550138 A JP2000550138 A JP 2000550138A JP 2000550138 A JP2000550138 A JP 2000550138A JP 2002516238 A JP2002516238 A JP 2002516238A
Authority
JP
Japan
Prior art keywords
substrate
image
controller
support
handling apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000550138A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002516238A5 (enExample
Inventor
エマニュエル ビア，
ジョン， エム． ホワイト，
Original Assignee
エーケーティー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エーケーティー株式会社 filed Critical エーケーティー株式会社
Publication of JP2002516238A publication Critical patent/JP2002516238A/ja
Publication of JP2002516238A5 publication Critical patent/JP2002516238A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37575—Pre-process, measure workpiece before machining
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40622—Detect orientation of workpiece during movement of end effector
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000550138A 1998-05-20 1999-05-13 自動基板処理システム Pending JP2002516238A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/082,413 US6215897B1 (en) 1998-05-20 1998-05-20 Automated substrate processing system
US09/082,413 1998-05-20
PCT/IB1999/001251 WO1999060610A1 (en) 1998-05-20 1999-05-13 An automated substrate processing system

Publications (2)

Publication Number Publication Date
JP2002516238A true JP2002516238A (ja) 2002-06-04
JP2002516238A5 JP2002516238A5 (enExample) 2008-11-27

Family

ID=22171056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000550138A Pending JP2002516238A (ja) 1998-05-20 1999-05-13 自動基板処理システム

Country Status (6)

Country Link
US (2) US6215897B1 (enExample)
EP (1) EP1078392A1 (enExample)
JP (1) JP2002516238A (enExample)
KR (1) KR100627531B1 (enExample)
TW (1) TW412826B (enExample)
WO (1) WO1999060610A1 (enExample)

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WO2010050500A1 (ja) * 2008-10-30 2010-05-06 三菱重工業株式会社 アライメント装置制御装置およびアライメント方法
WO2012124521A1 (ja) * 2011-03-11 2012-09-20 シャープ株式会社 基板検査装置および基板検査方法
KR101473831B1 (ko) 2013-03-29 2014-12-19 주식회사 에스에프에이 이송장치
JP2015037098A (ja) * 2013-08-12 2015-02-23 株式会社ダイヘン 搬送システム
JP2015170688A (ja) * 2014-03-06 2015-09-28 株式会社ダイヘン 基板損傷検出装置、その基板損傷検出装置を備えた基板搬送ロボット及び基板損傷検出方法
KR20160001649U (ko) * 2014-11-07 2016-05-17 어플라이드 머티어리얼스, 인코포레이티드 로봇 장착식 관통-빔 기판 검출기
US12046501B2 (en) 2022-10-06 2024-07-23 Kawasaki Jukogyo Kabushiki Kaisha Substrate handling apparatus and method of handling substrate

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JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
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KR101047784B1 (ko) * 2009-01-08 2011-07-07 주식회사 엘지실트론 급속 열처리 챔버의 모니터링 장치 및 방법
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JP6368453B2 (ja) * 2011-06-24 2018-08-01 株式会社日立国際電気 基板処理装置、及び基板処理装置のデータ解析方法並びにプログラム
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US6215897B1 (en) 2001-04-10
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