JP2002501177A - プローブカードのプローブ機構から堆積ハンダを取り除くための方法 - Google Patents

プローブカードのプローブ機構から堆積ハンダを取り除くための方法

Info

Publication number
JP2002501177A
JP2002501177A JP2000527836A JP2000527836A JP2002501177A JP 2002501177 A JP2002501177 A JP 2002501177A JP 2000527836 A JP2000527836 A JP 2000527836A JP 2000527836 A JP2000527836 A JP 2000527836A JP 2002501177 A JP2002501177 A JP 2002501177A
Authority
JP
Japan
Prior art keywords
probe mechanism
probe
mixture
lead
deposits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000527836A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002501177A5 (enExample
Inventor
シェル，メリッサ・ケイ
ヨシモト，リチャード・エス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JP2002501177A publication Critical patent/JP2002501177A/ja
Publication of JP2002501177A5 publication Critical patent/JP2002501177A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
JP2000527836A 1998-01-02 1998-12-21 プローブカードのプローブ機構から堆積ハンダを取り除くための方法 Pending JP2002501177A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/002,479 US6121058A (en) 1998-01-02 1998-01-02 Method for removing accumulated solder from probe card probing features
US09/002,479 1998-01-02
PCT/US1998/027393 WO1999035505A2 (en) 1998-01-02 1998-12-21 Method for removing accumulated solder from probe card probing features

Publications (2)

Publication Number Publication Date
JP2002501177A true JP2002501177A (ja) 2002-01-15
JP2002501177A5 JP2002501177A5 (enExample) 2006-02-16

Family

ID=21700971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000527836A Pending JP2002501177A (ja) 1998-01-02 1998-12-21 プローブカードのプローブ機構から堆積ハンダを取り除くための方法

Country Status (5)

Country Link
US (1) US6121058A (enExample)
JP (1) JP2002501177A (enExample)
KR (1) KR100367112B1 (enExample)
AU (1) AU2092099A (enExample)
WO (1) WO1999035505A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020165774A (ja) * 2019-03-29 2020-10-08 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19747247C5 (de) * 1997-10-25 2004-10-07 Man B & W Diesel A/S Dieselmotor
US7053646B2 (en) * 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
US20040020514A1 (en) * 2002-07-18 2004-02-05 Orsillo James E. Probe device cleaner and method
US6778280B2 (en) * 2001-07-06 2004-08-17 Zygo Corporation Interferometry system and method employing an angular difference in propagation between orthogonally polarized input beam components
EP2290070B1 (en) 2004-05-28 2015-03-25 Asuragen, Inc. Methods and compositions involving microRNA
US20060065290A1 (en) * 2004-09-28 2006-03-30 Jerry Broz Working surface cleaning system and method
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
DE102004047730B4 (de) * 2004-09-30 2017-06-22 Advanced Micro Devices, Inc. Ein Verfahren zum Dünnen von Halbleitersubstraten zur Herstellung von dünnen Halbleiterplättchen
ES2534302T3 (es) 2004-11-12 2015-04-21 Asuragen, Inc. Procedimientos y composiciones que implican miARN y moléculas inhibidoras de miARN
US7362116B1 (en) 2005-11-09 2008-04-22 Electroglas, Inc. Method for probing impact sensitive and thin layered substrate
CA2663962A1 (en) 2006-09-19 2008-03-27 Asuragen, Inc. Mir-15, mir-26, mir-31,mir-145, mir-147, mir-188, mir-215, mir-216, mir-331, mmu-mir-292-3p regulated genes and pathways as targets for therapeutic intervention
EP2115138A2 (en) 2006-09-19 2009-11-11 Asuragen, Inc. Micrornas differentially expressed in pancreatic diseases and uses thereof
US7761966B2 (en) * 2007-07-16 2010-07-27 Touchdown Technologies, Inc. Method for repairing a microelectromechanical system
WO2009011696A1 (en) * 2007-07-16 2009-01-22 Touchdown Technologies, Inc A device and method for reparing a microelectromechanical system
EP2990487A1 (en) 2008-05-08 2016-03-02 Asuragen, INC. Compositions and methods related to mirna modulation of neovascularization or angiogenesis
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
WO2011108930A1 (en) 2010-03-04 2011-09-09 Interna Technologies Bv A MiRNA MOLECULE DEFINED BY ITS SOURCE AND ITS DIAGNOSTIC AND THERAPEUTIC USES IN DISEASES OR CONDITIONS ASSOCIATED WITH EMT
EP2591106A1 (en) 2010-07-06 2013-05-15 InteRNA Technologies B.V. Mirna and its diagnostic and therapeutic uses in diseases or conditions associated with melanoma, or in diseases or conditions associated with activated braf pathway
EP2640851A2 (en) 2010-11-17 2013-09-25 Asuragen, Inc. Mirnas as biomarkers for distinguishing benign from malignant thyroid neoplasms
EP2474617A1 (en) 2011-01-11 2012-07-11 InteRNA Technologies BV Mir for treating neo-angiogenesis
WO2012158238A2 (en) 2011-02-28 2012-11-22 University Of Iowa Research Foundation Anti-müllerian hormone changes in pregnancy and prediction ofadverse pregnancy outcomes and gender
US9644241B2 (en) 2011-09-13 2017-05-09 Interpace Diagnostics, Llc Methods and compositions involving miR-135B for distinguishing pancreatic cancer from benign pancreatic disease
US20130157884A1 (en) 2011-10-26 2013-06-20 Asuragen, Inc. Methods and compositions involving mirna expression levels for distinguishing pancreatic cysts
EP2771487A1 (en) 2011-10-27 2014-09-03 Asuragen, INC. Mirnas as diagnostic biomarkers to distinguish benign from malignant thyroid tumors
US20150008950A1 (en) 2011-12-31 2015-01-08 Roy E. Swart Manufacturing advanced test probes
WO2013101238A1 (en) 2011-12-31 2013-07-04 Intel Corporation Test probes
EP2870263A1 (en) 2012-07-03 2015-05-13 InteRNA Technologies B.V. Diagnostic portfolio and its uses
WO2014055117A1 (en) 2012-10-04 2014-04-10 Asuragen, Inc. Diagnostic mirnas for differential diagnosis of incidental pancreatic cystic lesions
WO2014145612A1 (en) 2013-03-15 2014-09-18 Ajay Goel Tissue and blood-based mirna biomarkers for the diagnosis, prognosis and metastasis-predictive potential in colorectal cancer
EP3366785A3 (en) 2013-03-15 2018-09-19 Baylor Research Institute Ulcerative colitis (uc)-associated colorectal neoplasia markers
EP3404116B1 (en) 2013-03-15 2022-10-19 The University of Chicago Methods and compositions related to t-cell activity
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
CN111566212A (zh) 2017-11-03 2020-08-21 因特尔纳技术有限公司 miRNA分子，等同物，安塔够妙或其来源用于治疗和/或诊断与神经元缺陷相关的病症和/或疾病或用于神经元生成和/或再生
WO2019104155A2 (en) 2017-11-22 2019-05-31 The University Of Chicago Chemical probe-dependent evaluation of protein activity and uses thereof
US11434095B2 (en) 2018-02-23 2022-09-06 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
CN114174532A (zh) 2019-04-05 2022-03-11 德克萨斯大学系统董事会 细胞条形码编码的方法和应用
JP7566775B2 (ja) 2019-04-12 2024-10-15 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 筋肉量及び酸化的代謝を増加させるための組成物及び方法
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
WO2024028794A1 (en) 2022-08-02 2024-02-08 Temple Therapeutics BV Methods for treating endometrial and ovarian hyperproliferative disorders
WO2025248505A1 (en) 2024-05-31 2025-12-04 Wayne State University Methods for treating endometrial and ovarian hyperproliferative disorders

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244746A (ja) * 1988-08-04 1990-02-14 Hitachi Ltd ウエハプローバ
JPH03257185A (ja) * 1990-03-07 1991-11-15 Neos Co Ltd モリブデン製マスクの洗浄法
JPH07128367A (ja) * 1993-10-29 1995-05-19 Nippon Denshi Zairyo Kk プローブカード用プローブの先端の洗浄方法及び洗浄装置
JPH07234262A (ja) * 1994-02-22 1995-09-05 Sony Corp Ｉｃソケットの洗浄方法及び洗浄装置
JPH10501928A (ja) * 1995-04-19 1998-02-17 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ プローブカードのプローブチップを洗浄する方法およびこの方法を実施するための装置
JPH11230989A (ja) * 1997-12-10 1999-08-27 Mitsubishi Electric Corp プローブカード用プローブ針のクリーニング方法およびクリーニング装置とそれに用いる洗浄液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1583955A (enExample) * 1968-04-19 1969-12-12
US4314855A (en) * 1979-12-17 1982-02-09 Bell Telephone Laboratories, Incorporated Method of cleaning test probes
US5521518A (en) * 1990-09-20 1996-05-28 Higgins; H. Dan Probe card apparatus
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US5802714A (en) * 1994-07-19 1998-09-08 Hitachi, Ltd. Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
JP3188935B2 (ja) * 1995-01-19 2001-07-16 東京エレクトロン株式会社 検査装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244746A (ja) * 1988-08-04 1990-02-14 Hitachi Ltd ウエハプローバ
JPH03257185A (ja) * 1990-03-07 1991-11-15 Neos Co Ltd モリブデン製マスクの洗浄法
JPH07128367A (ja) * 1993-10-29 1995-05-19 Nippon Denshi Zairyo Kk プローブカード用プローブの先端の洗浄方法及び洗浄装置
JPH07234262A (ja) * 1994-02-22 1995-09-05 Sony Corp Ｉｃソケットの洗浄方法及び洗浄装置
JPH10501928A (ja) * 1995-04-19 1998-02-17 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ プローブカードのプローブチップを洗浄する方法およびこの方法を実施するための装置
JPH11230989A (ja) * 1997-12-10 1999-08-27 Mitsubishi Electric Corp プローブカード用プローブ針のクリーニング方法およびクリーニング装置とそれに用いる洗浄液

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020165774A (ja) * 2019-03-29 2020-10-08 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード
JP7292921B2 (ja) 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード

Also Published As

Publication number Publication date
WO1999035505A3 (en) 2000-04-06
KR20010033836A (ko) 2001-04-25
US6121058A (en) 2000-09-19
KR100367112B1 (ko) 2003-01-09
AU2092099A (en) 1999-07-26
WO1999035505A2 (en) 1999-07-15

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