KR100367112B1 - 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법 - Google Patents

프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법 Download PDF

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Publication number
KR100367112B1
KR100367112B1 KR10-2000-7007395A KR20007007395A KR100367112B1 KR 100367112 B1 KR100367112 B1 KR 100367112B1 KR 20007007395 A KR20007007395 A KR 20007007395A KR 100367112 B1 KR100367112 B1 KR 100367112B1
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KR
South Korea
Prior art keywords
probing
composition
feature
lead
probing feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR10-2000-7007395A
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English (en)
Korean (ko)
Other versions
KR20010033836A (ko
Inventor
쉘멜리사케이
요시모토리차드에스
Original Assignee
인텔 코오퍼레이션
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Application filed by 인텔 코오퍼레이션 filed Critical 인텔 코오퍼레이션
Publication of KR20010033836A publication Critical patent/KR20010033836A/ko
Application granted granted Critical
Publication of KR100367112B1 publication Critical patent/KR100367112B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
KR10-2000-7007395A 1998-01-02 1998-12-21 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법 Expired - Fee Related KR100367112B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/002,479 1998-01-02
US09/002,479 US6121058A (en) 1998-01-02 1998-01-02 Method for removing accumulated solder from probe card probing features

Publications (2)

Publication Number Publication Date
KR20010033836A KR20010033836A (ko) 2001-04-25
KR100367112B1 true KR100367112B1 (ko) 2003-01-09

Family

ID=21700971

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7007395A Expired - Fee Related KR100367112B1 (ko) 1998-01-02 1998-12-21 프로브 카드의 프로빙 피처에 축적된 땜납 제거 방법

Country Status (5)

Country Link
US (1) US6121058A (enExample)
JP (1) JP2002501177A (enExample)
KR (1) KR100367112B1 (enExample)
AU (1) AU2092099A (enExample)
WO (1) WO1999035505A2 (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19747247C5 (de) * 1997-10-25 2004-10-07 Man B & W Diesel A/S Dieselmotor
US20040020514A1 (en) * 2002-07-18 2004-02-05 Orsillo James E. Probe device cleaner and method
US7053646B2 (en) * 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
US6778280B2 (en) * 2001-07-06 2004-08-17 Zygo Corporation Interferometry system and method employing an angular difference in propagation between orthogonally polarized input beam components
AU2005250432B2 (en) 2004-05-28 2011-09-15 Asuragen, Inc. Methods and compositions involving microRNA
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
US20060065290A1 (en) * 2004-09-28 2006-03-30 Jerry Broz Working surface cleaning system and method
DE102004047730B4 (de) * 2004-09-30 2017-06-22 Advanced Micro Devices, Inc. Ein Verfahren zum Dünnen von Halbleitersubstraten zur Herstellung von dünnen Halbleiterplättchen
CA2857881A1 (en) 2004-11-12 2006-12-28 Asuragen, Inc. Methods and compositions involving mirna and mirna inhibitor molecules
US7362116B1 (en) 2005-11-09 2008-04-22 Electroglas, Inc. Method for probing impact sensitive and thin layered substrate
WO2008036776A2 (en) 2006-09-19 2008-03-27 Asuragen, Inc. Mir-15, mir-26, mir -31,mir -145, mir-147, mir-188, mir-215, mir-216 mir-331, mmu-mir-292-3p regulated genes and pathways as targets for therapeutic intervention
WO2008036765A2 (en) 2006-09-19 2008-03-27 Asuragen, Inc. Micrornas differentially expressed in pancreatic diseases and uses thereof
US7761966B2 (en) * 2007-07-16 2010-07-27 Touchdown Technologies, Inc. Method for repairing a microelectromechanical system
WO2009011696A1 (en) * 2007-07-16 2009-01-22 Touchdown Technologies, Inc A device and method for reparing a microelectromechanical system
EP2990487A1 (en) 2008-05-08 2016-03-02 Asuragen, INC. Compositions and methods related to mirna modulation of neovascularization or angiogenesis
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
EP2542678B1 (en) 2010-03-04 2017-04-12 InteRNA Technologies B.V. A MiRNA MOLECULE DEFINED BY ITS SOURCE AND ITS THERAPEUTIC USES IN CANCER ASSOCIATED WITH EMT
WO2012005572A1 (en) 2010-07-06 2012-01-12 Interna Technologies Bv Mirna and its diagnostic and therapeutic uses in diseases or conditions associated with melanoma, or in diseases or conditions associated with activated braf pathway
ES2629890T3 (es) 2010-11-17 2017-08-16 Interpace Diagnostics, Llc miARN como biomarcadores para distinguir entre neoplasias de tiroides benignas y malignas
EP2474617A1 (en) 2011-01-11 2012-07-11 InteRNA Technologies BV Mir for treating neo-angiogenesis
EP2681566A2 (en) 2011-02-28 2014-01-08 University of Iowa Research Foundation Anti-müllerian hormone changes in pregnancy and prediction ofadverse pregnancy outcomes and gender
WO2013040251A2 (en) 2011-09-13 2013-03-21 Asurgen, Inc. Methods and compositions involving mir-135b for distinguishing pancreatic cancer from benign pancreatic disease
US20130157884A1 (en) 2011-10-26 2013-06-20 Asuragen, Inc. Methods and compositions involving mirna expression levels for distinguishing pancreatic cysts
EP2771487A1 (en) 2011-10-27 2014-09-03 Asuragen, INC. Mirnas as diagnostic biomarkers to distinguish benign from malignant thyroid tumors
US20150008950A1 (en) 2011-12-31 2015-01-08 Roy E. Swart Manufacturing advanced test probes
US9279830B2 (en) 2011-12-31 2016-03-08 Intel Corporation Test probe structures and methods including positioning test probe structures in a test head
US20150152499A1 (en) 2012-07-03 2015-06-04 Interna Technologies B.V. Diagnostic portfolio and its uses
US20140100124A1 (en) 2012-10-04 2014-04-10 Asuragen, Inc. Diagnostic mirnas for differential diagnosis of incidental pancreatic cystic lesions
EP3404116B1 (en) 2013-03-15 2022-10-19 The University of Chicago Methods and compositions related to t-cell activity
US9868992B2 (en) 2013-03-15 2018-01-16 Baylor Research Institute Tissue and blood-based miRNA biomarkers for the diagnosis, prognosis and metastasis-predictive potential in colorectal cancer
WO2014151551A1 (en) 2013-03-15 2014-09-25 Baylor Research Institute Ulcerative colitis (uc)-associated colorectal neoplasia markers
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
EP3704250A1 (en) 2017-11-03 2020-09-09 InteRNA Technologies B.V. Mirna molecule, equivalent, antagomir, or source thereof for treating and/or diagnosing a condition and/or a disease associated with neuronal deficiency or for neuronal (re)generation
US12276654B2 (en) 2017-11-22 2025-04-15 The University Of Chicago Chemical probe-dependent evaluation of protein activity and uses thereof
US10843885B2 (en) 2018-02-23 2020-11-24 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード
WO2020206285A1 (en) 2019-04-05 2020-10-08 Board Of Regents, The University Of Texas System Methods and applications for cell barcoding
JP7566775B2 (ja) 2019-04-12 2024-10-15 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 筋肉量及び酸化的代謝を増加させるための組成物及び方法
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
WO2024028794A1 (en) 2022-08-02 2024-02-08 Temple Therapeutics BV Methods for treating endometrial and ovarian hyperproliferative disorders
WO2025248505A1 (en) 2024-05-31 2025-12-04 Wayne State University Methods for treating endometrial and ovarian hyperproliferative disorders

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1583955A (enExample) * 1968-04-19 1969-12-12
US4314855A (en) * 1979-12-17 1982-02-09 Bell Telephone Laboratories, Incorporated Method of cleaning test probes
JPH0244746A (ja) * 1988-08-04 1990-02-14 Hitachi Ltd ウエハプローバ
JPH03257185A (ja) * 1990-03-07 1991-11-15 Neos Co Ltd モリブデン製マスクの洗浄法
US5521518A (en) * 1990-09-20 1996-05-28 Higgins; H. Dan Probe card apparatus
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
JPH0827297B2 (ja) * 1993-10-29 1996-03-21 日本電子材料株式会社 プローブカード用プローブの洗浄液及びそれを用いた洗浄装置
JPH07234262A (ja) * 1994-02-22 1995-09-05 Sony Corp Ｉｃソケットの洗浄方法及び洗浄装置
US5802714A (en) * 1994-07-19 1998-09-08 Hitachi, Ltd. Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
JP3188935B2 (ja) * 1995-01-19 2001-07-16 東京エレクトロン株式会社 検査装置
JPH10501928A (ja) * 1995-04-19 1998-02-17 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ プローブカードのプローブチップを洗浄する方法およびこの方法を実施するための装置
JPH11230989A (ja) * 1997-12-10 1999-08-27 Mitsubishi Electric Corp プローブカード用プローブ針のクリーニング方法およびクリーニング装置とそれに用いる洗浄液

Also Published As

Publication number Publication date
JP2002501177A (ja) 2002-01-15
US6121058A (en) 2000-09-19
KR20010033836A (ko) 2001-04-25
WO1999035505A3 (en) 2000-04-06
AU2092099A (en) 1999-07-26
WO1999035505A2 (en) 1999-07-15

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