JP2002343811A5 - - Google Patents

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Publication number
JP2002343811A5
JP2002343811A5 JP2002058532A JP2002058532A JP2002343811A5 JP 2002343811 A5 JP2002343811 A5 JP 2002343811A5 JP 2002058532 A JP2002058532 A JP 2002058532A JP 2002058532 A JP2002058532 A JP 2002058532A JP 2002343811 A5 JP2002343811 A5 JP 2002343811A5
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JP
Japan
Prior art keywords
amorphous semiconductor
semiconductor film
film
conductive film
forming
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Application number
JP2002058532A
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English (en)
Japanese (ja)
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JP4267242B2 (ja
JP2002343811A (ja
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Priority to JP2002058532A priority Critical patent/JP4267242B2/ja
Priority claimed from JP2002058532A external-priority patent/JP4267242B2/ja
Publication of JP2002343811A publication Critical patent/JP2002343811A/ja
Publication of JP2002343811A5 publication Critical patent/JP2002343811A5/ja
Application granted granted Critical
Publication of JP4267242B2 publication Critical patent/JP4267242B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002058532A 2001-03-06 2002-03-05 半導体装置及びその作製方法 Expired - Fee Related JP4267242B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002058532A JP4267242B2 (ja) 2001-03-06 2002-03-05 半導体装置及びその作製方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001-62690 2001-03-06
JP2001-62677 2001-03-06
JP2001062677 2001-03-06
JP2001062690 2001-03-06
JP2002058532A JP4267242B2 (ja) 2001-03-06 2002-03-05 半導体装置及びその作製方法

Publications (3)

Publication Number Publication Date
JP2002343811A JP2002343811A (ja) 2002-11-29
JP2002343811A5 true JP2002343811A5 (enExample) 2005-09-02
JP4267242B2 JP4267242B2 (ja) 2009-05-27

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ID=27346179

Family Applications (1)

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JP2002058532A Expired - Fee Related JP4267242B2 (ja) 2001-03-06 2002-03-05 半導体装置及びその作製方法

Country Status (1)

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JP (1) JP4267242B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101253611B (zh) 2005-09-30 2013-06-19 夏普株式会社 薄膜晶体管阵列衬底的制造方法
US7615495B2 (en) * 2005-11-17 2009-11-10 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
KR101251995B1 (ko) 2006-01-27 2013-04-08 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
JP2007212699A (ja) * 2006-02-09 2007-08-23 Idemitsu Kosan Co Ltd 反射型tft基板及び反射型tft基板の製造方法
JP5063936B2 (ja) * 2006-06-08 2012-10-31 三菱電機株式会社 Tftアレイ基板の製造方法
US7897971B2 (en) * 2007-07-26 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101452204B1 (ko) * 2007-11-05 2014-10-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터 및 상기 박막 트랜지스터를 구비하는 표시 장치
TWI491048B (zh) 2008-07-31 2015-07-01 Semiconductor Energy Lab 半導體裝置
KR101667909B1 (ko) * 2008-10-24 2016-10-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제조방법
JP5308831B2 (ja) * 2009-01-08 2013-10-09 三菱電機株式会社 積層構造体及びその製造方法
US8741677B2 (en) * 2010-11-30 2014-06-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US9059219B2 (en) * 2012-06-27 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP6326752B2 (ja) * 2013-09-12 2018-05-23 三菱電機株式会社 薄膜トランジスタおよびその製造方法
KR102211967B1 (ko) * 2013-10-28 2021-02-05 삼성디스플레이 주식회사 표시 장치, 표시 장치의 제조 방법, 및 유기 발광 표시 장치

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