JP2002343754A5 - - Google Patents

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JP2002343754A5
JP2002343754A5 JP2001144286A JP2001144286A JP2002343754A5 JP 2002343754 A5 JP2002343754 A5 JP 2002343754A5 JP 2001144286 A JP2001144286 A JP 2001144286A JP 2001144286 A JP2001144286 A JP 2001144286A JP 2002343754 A5 JP2002343754 A5 JP 2002343754A5
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Japan
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polished
polishing
unit
light
specific
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JP2001144286A
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JP2002343754A (ja
JP4858798B2 (ja
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JP2001144286A 2001-05-15 2001-05-15 研磨装置、研磨方法およびこの研磨装置を用いた半導体デバイス製造方法 Expired - Lifetime JP4858798B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001144286A JP4858798B2 (ja) 2001-05-15 2001-05-15 研磨装置、研磨方法およびこの研磨装置を用いた半導体デバイス製造方法

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Application Number Priority Date Filing Date Title
JP2001144286A JP4858798B2 (ja) 2001-05-15 2001-05-15 研磨装置、研磨方法およびこの研磨装置を用いた半導体デバイス製造方法

Publications (3)

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JP2002343754A JP2002343754A (ja) 2002-11-29
JP2002343754A5 true JP2002343754A5 (https=) 2008-06-19
JP4858798B2 JP4858798B2 (ja) 2012-01-18

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JP2001144286A Expired - Lifetime JP4858798B2 (ja) 2001-05-15 2001-05-15 研磨装置、研磨方法およびこの研磨装置を用いた半導体デバイス製造方法

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JP (1) JP4858798B2 (https=)

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US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US20060079007A1 (en) 2004-10-08 2006-04-13 Applied Materials, Inc. System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss
JP2008062353A (ja) * 2006-09-08 2008-03-21 Disco Abrasive Syst Ltd 研削加工方法および研削加工装置
JP5340795B2 (ja) * 2009-04-27 2013-11-13 株式会社荏原製作所 研磨方法及び研磨装置
JP2011235388A (ja) * 2010-05-10 2011-11-24 Disco Corp 研削された被加工物の厚み計測方法および研削装置
CN102554757A (zh) * 2010-12-30 2012-07-11 中芯国际集成电路制造(上海)有限公司 化学机械研磨装置
JP5705093B2 (ja) * 2011-11-21 2015-04-22 株式会社荏原製作所 研磨終点検出方法および研磨装置
CN104380439B (zh) * 2012-06-25 2016-09-07 胜高股份有限公司 工件研磨方法及工件研磨装置
JP6181622B2 (ja) * 2014-09-17 2017-08-16 株式会社荏原製作所 研磨装置および研磨方法
KR101679131B1 (ko) 2014-12-29 2016-11-23 주식회사 엘지실트론 웨이퍼 연마장치 및 그 연마방법
JP6882017B2 (ja) 2017-03-06 2021-06-02 株式会社荏原製作所 研磨方法、研磨装置、および基板処理システム
JP6947135B2 (ja) * 2018-04-25 2021-10-13 信越半導体株式会社 研磨装置、ウェーハの研磨方法、及び、ウェーハの製造方法
JP7181028B2 (ja) * 2018-09-03 2022-11-30 株式会社ディスコ 加工装置のメンテナンス方法および加工装置
JP2020136348A (ja) * 2019-02-14 2020-08-31 株式会社ディスコ ウエーハの加工方法およびウエーハの加工装置
JP7265885B2 (ja) * 2019-02-27 2023-04-27 株式会社荏原製作所 研磨装置、研磨方法、プログラムを格納した記憶媒体
JP7488116B2 (ja) * 2020-06-03 2024-05-21 株式会社ディスコ 電極形成方法

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JP3382011B2 (ja) * 1993-04-06 2003-03-04 株式会社東芝 膜厚測定装置、ポリシング装置および半導体製造装置
JP3326443B2 (ja) * 1993-08-10 2002-09-24 株式会社ニコン ウエハ研磨方法及びその装置
JP3601910B2 (ja) * 1995-07-20 2004-12-15 株式会社荏原製作所 ポリッシング装置及び方法
JPH09298176A (ja) * 1996-05-09 1997-11-18 Canon Inc 研磨方法及びそれを用いた研磨装置
JPH09298174A (ja) * 1996-05-09 1997-11-18 Canon Inc 研磨方法及びそれを用いた研磨装置
JP3863624B2 (ja) * 1997-03-24 2006-12-27 不二越機械工業株式会社 ウェーハの研磨装置及びウェーハの研磨方法
JPH10294297A (ja) * 1997-04-18 1998-11-04 Nikon Corp 研磨装置
JP3450651B2 (ja) * 1997-06-10 2003-09-29 キヤノン株式会社 研磨方法及びそれを用いた研磨装置
JP4147675B2 (ja) * 1998-10-12 2008-09-10 株式会社ニコン 検知方法、検知装置、及び研磨装置
JP2001300847A (ja) * 2000-04-24 2001-10-30 Nikon Corp 研磨装置及び半導体デバイス製造方法

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