JP2002338833A5 - - Google Patents
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- Publication number
- JP2002338833A5 JP2002338833A5 JP2002044708A JP2002044708A JP2002338833A5 JP 2002338833 A5 JP2002338833 A5 JP 2002338833A5 JP 2002044708 A JP2002044708 A JP 2002044708A JP 2002044708 A JP2002044708 A JP 2002044708A JP 2002338833 A5 JP2002338833 A5 JP 2002338833A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- groups
- group
- sih
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 10
- 125000004429 atom Chemical group 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 150000002738 metalloids Chemical group 0.000 claims 7
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims 6
- 239000003054 catalyst Substances 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 6
- 150000002894 organic compounds Chemical class 0.000 claims 5
- 230000009257 reactivity Effects 0.000 claims 5
- 238000009833 condensation Methods 0.000 claims 4
- 230000005494 condensation Effects 0.000 claims 4
- 238000006482 condensation reaction Methods 0.000 claims 3
- 230000003301 hydrolyzing effect Effects 0.000 claims 3
- 238000006459 hydrosilylation reaction Methods 0.000 claims 3
- 150000002484 inorganic compounds Chemical class 0.000 claims 3
- 229910010272 inorganic material Inorganic materials 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 150000003377 silicon compounds Chemical class 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- NWRZGFYWENINNX-UHFFFAOYSA-N 1,1,2-tris(ethenyl)cyclohexane Chemical compound C=CC1CCCCC1(C=C)C=C NWRZGFYWENINNX-UHFFFAOYSA-N 0.000 claims 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims 1
- IYSVFZBXZVPIFA-UHFFFAOYSA-N 1-ethenyl-4-(4-ethenylphenyl)benzene Chemical group C1=CC(C=C)=CC=C1C1=CC=C(C=C)C=C1 IYSVFZBXZVPIFA-UHFFFAOYSA-N 0.000 claims 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 claims 1
- SCZZNWQQCGSWSZ-UHFFFAOYSA-N 1-prop-2-enoxy-4-[2-(4-prop-2-enoxyphenyl)propan-2-yl]benzene Chemical compound C=1C=C(OCC=C)C=CC=1C(C)(C)C1=CC=C(OCC=C)C=C1 SCZZNWQQCGSWSZ-UHFFFAOYSA-N 0.000 claims 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- 125000004423 acyloxy group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002044708A JP3910080B2 (ja) | 2001-02-23 | 2002-02-21 | 発光ダイオード |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-48549 | 2001-02-23 | ||
| JP2001048549 | 2001-02-23 | ||
| JP2002044708A JP3910080B2 (ja) | 2001-02-23 | 2002-02-21 | 発光ダイオード |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005057011A Division JP2005232461A (ja) | 2001-02-23 | 2005-03-02 | 光学材料用組成物、光学材料、その製造方法、並びにそれを用いた液晶表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002338833A JP2002338833A (ja) | 2002-11-27 |
| JP2002338833A5 true JP2002338833A5 (enExample) | 2005-09-02 |
| JP3910080B2 JP3910080B2 (ja) | 2007-04-25 |
Family
ID=26609992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002044708A Expired - Fee Related JP3910080B2 (ja) | 2001-02-23 | 2002-02-21 | 発光ダイオード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3910080B2 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4880837B2 (ja) * | 2001-09-05 | 2012-02-22 | 株式会社カネカ | 硬化性組成物および硬化物 |
| JP2003073549A (ja) * | 2001-09-05 | 2003-03-12 | Kanegafuchi Chem Ind Co Ltd | 光学材料用硬化性組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード |
| JP5676068B2 (ja) * | 2001-09-06 | 2015-02-25 | 株式会社カネカ | 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード |
| DE60318570T2 (de) | 2002-04-26 | 2009-01-08 | Kaneka Corp. | Härtbare zusammensetzung, härtendes produkt, herstellungsverfahren dafür und mit dem gehärteten produkt versiegelte lichtemittierende diode |
| MY151065A (en) | 2003-02-25 | 2014-03-31 | Kaneka Corp | Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
| TW200427111A (en) | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
| TWI373150B (en) | 2003-07-09 | 2012-09-21 | Shinetsu Chemical Co | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
| JP4586967B2 (ja) * | 2003-07-09 | 2010-11-24 | 信越化学工業株式会社 | 発光半導体被覆保護材及び発光半導体装置 |
| JP4263051B2 (ja) | 2003-07-31 | 2009-05-13 | 俊信 横尾 | 発光ダイオード |
| DE102004039111A1 (de) | 2003-08-14 | 2005-04-14 | Shin-Etsu Chemical Co., Ltd. | Härtbare Silikonharzzusammensetzung |
| JP4493013B2 (ja) * | 2003-10-08 | 2010-06-30 | 日亜化学工業株式会社 | 半導体装置 |
| TW200513483A (en) | 2003-10-10 | 2005-04-16 | Shinetsu Chemical Co | Curable composition |
| JP4803339B2 (ja) | 2003-11-20 | 2011-10-26 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
| JP4895247B2 (ja) * | 2004-04-05 | 2012-03-14 | 旭化成ワッカーシリコーン株式会社 | 接着性シリコーンゴム組成物 |
| JP4300418B2 (ja) | 2004-04-30 | 2009-07-22 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
| US7314770B2 (en) * | 2004-11-18 | 2008-01-01 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing encapsulant |
| CN101107324B (zh) | 2005-01-24 | 2012-02-01 | 迈图高新材料日本合同公司 | 发光元件封装用有机硅组合物及发光装置 |
| US8502364B2 (en) | 2006-08-22 | 2013-08-06 | Mitsubishi Chemical Corporation | Semiconductor device member, production method of semiconductor-device-member formation liquid and semiconductor device member, and semiconductor-device-member formation liquid, phosphor composition, semiconductor light-emitting device, lighting system and image display system using the same |
| EP2236543B1 (en) | 2007-12-10 | 2014-02-26 | Kaneka Corporation | Polysiloxane compound, alkali-developable curable composition, insulating thin film using the same, and thin film transistor |
| US8629222B2 (en) | 2008-03-28 | 2014-01-14 | Mitsubishi Chemical Corporation | Curable polysiloxane composition, and polysiloxane cured product, optical member, member for aerospace industry, semiconductor light-emitting device, illuminating device and image display device using the same |
| EP2343326B1 (en) | 2008-10-02 | 2018-08-15 | Kaneka Corporation | Photocurable composition and cured product |
| JP2010245477A (ja) * | 2009-04-10 | 2010-10-28 | Dow Corning Toray Co Ltd | 光デバイス及びその製造方法 |
| JP5305452B2 (ja) | 2009-06-12 | 2013-10-02 | 信越化学工業株式会社 | 光半導体素子封止用樹脂組成物 |
| JP2011009346A (ja) * | 2009-06-24 | 2011-01-13 | Shin-Etsu Chemical Co Ltd | 光半導体装置 |
| KR101749367B1 (ko) * | 2009-12-17 | 2017-06-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 디스플레이 패널 어셈블리 및 이의 제조 방법 |
| JP5489280B2 (ja) | 2010-04-07 | 2014-05-14 | 信越化学工業株式会社 | 光半導体封止用エポキシ組成物 |
| JP5640476B2 (ja) | 2010-06-08 | 2014-12-17 | 信越化学工業株式会社 | 光半導体素子封止用樹脂組成物及び発光装置 |
| JP5893874B2 (ja) | 2011-09-02 | 2016-03-23 | 信越化学工業株式会社 | 光半導体装置 |
| KR101454798B1 (ko) | 2012-05-25 | 2014-10-28 | 다미폴리켐 주식회사 | 발광 다이오드 소자의 봉지재용 실록산 가교제 |
| JP7221659B2 (ja) * | 2017-11-17 | 2023-02-14 | スタンレー電気株式会社 | 半導体発光装置 |
| WO2020203597A1 (ja) | 2019-04-01 | 2020-10-08 | 信越化学工業株式会社 | 自己接着性シリコーンゲル組成物及びその硬化物からなるシリコーンゲル |
| JP7512378B2 (ja) * | 2019-10-09 | 2024-07-08 | インテグリス・インコーポレーテッド | 湿式エッチング湿式エッチング組成物及び方法 |
-
2002
- 2002-02-21 JP JP2002044708A patent/JP3910080B2/ja not_active Expired - Fee Related
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