JP2002283580A5 - - Google Patents

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Publication number
JP2002283580A5
JP2002283580A5 JP2002071598A JP2002071598A JP2002283580A5 JP 2002283580 A5 JP2002283580 A5 JP 2002283580A5 JP 2002071598 A JP2002071598 A JP 2002071598A JP 2002071598 A JP2002071598 A JP 2002071598A JP 2002283580 A5 JP2002283580 A5 JP 2002283580A5
Authority
JP
Japan
Prior art keywords
layer
substrate
trench
thin film
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002071598A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002283580A (ja
JP4278335B2 (ja
Filing date
Publication date
Priority claimed from US09/811,052 external-priority patent/US6517735B2/en
Application filed filed Critical
Publication of JP2002283580A publication Critical patent/JP2002283580A/ja
Publication of JP2002283580A5 publication Critical patent/JP2002283580A5/ja
Application granted granted Critical
Publication of JP4278335B2 publication Critical patent/JP4278335B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002071598A 2001-03-15 2002-03-15 完全に一体化した熱インクジェットプリントヘッド用のインク供給トレンチエッチング技術 Expired - Fee Related JP4278335B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,052 US6517735B2 (en) 2001-03-15 2001-03-15 Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US09/811052 2001-03-15

Publications (3)

Publication Number Publication Date
JP2002283580A JP2002283580A (ja) 2002-10-03
JP2002283580A5 true JP2002283580A5 (cg-RX-API-DMAC7.html) 2005-04-07
JP4278335B2 JP4278335B2 (ja) 2009-06-10

Family

ID=25205411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002071598A Expired - Fee Related JP4278335B2 (ja) 2001-03-15 2002-03-15 完全に一体化した熱インクジェットプリントヘッド用のインク供給トレンチエッチング技術

Country Status (5)

Country Link
US (1) US6517735B2 (cg-RX-API-DMAC7.html)
EP (1) EP1241009B1 (cg-RX-API-DMAC7.html)
JP (1) JP4278335B2 (cg-RX-API-DMAC7.html)
DE (1) DE60204251T2 (cg-RX-API-DMAC7.html)
HK (1) HK1046388B (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6675476B2 (en) * 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US7052117B2 (en) 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
KR100499132B1 (ko) * 2002-10-24 2005-07-04 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
CN100355573C (zh) * 2002-12-27 2007-12-19 佳能株式会社 用于制造喷墨记录头的基础件
US7036913B2 (en) * 2003-05-27 2006-05-02 Samsung Electronics Co., Ltd. Ink-jet printhead
US7281778B2 (en) 2004-03-15 2007-10-16 Fujifilm Dimatix, Inc. High frequency droplet ejection device and method
US8491076B2 (en) 2004-03-15 2013-07-23 Fujifilm Dimatix, Inc. Fluid droplet ejection devices and methods
WO2006074016A2 (en) 2004-12-30 2006-07-13 Fujifilm Dimatix, Inc. Ink jet printing
JP4854328B2 (ja) * 2005-04-13 2012-01-18 キヤノン株式会社 液体吐出記録ヘッド
US7390745B2 (en) * 2005-09-23 2008-06-24 International Business Machines Corporation Pattern enhancement by crystallographic etching
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer
US9016837B2 (en) 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead device with compressive stressed dielectric layer
US9016836B2 (en) 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead with polarity-changing driver for thermal resistors
US11746005B2 (en) 2021-03-04 2023-09-05 Funai Electric Co. Ltd Deep reactive ion etching process for fluid ejection heads
CN113584456A (zh) * 2021-07-21 2021-11-02 深圳清华大学研究院 超滑骨架及其加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0367303A1 (en) 1986-04-28 1990-05-09 Hewlett-Packard Company Thermal ink jet printhead
US4789425A (en) 1987-08-06 1988-12-06 Xerox Corporation Thermal ink jet printhead fabricating process
US4864329A (en) 1988-09-22 1989-09-05 Xerox Corporation Fluid handling device with filter and fabrication process therefor
US5001085A (en) * 1990-07-17 1991-03-19 Micron Technology, Inc. Process for creating a metal etch mask which may be utilized for halogen-plasma excavation of deep trenches
US5648806A (en) 1992-04-02 1997-07-15 Hewlett-Packard Company Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
US5852459A (en) 1994-10-31 1998-12-22 Hewlett-Packard Company Printer using print cartridge with internal pressure regulator
US6305790B1 (en) * 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
DK0841167T3 (da) 1996-11-11 2005-01-24 Canon Kk Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling.....
US6019907A (en) * 1997-08-08 2000-02-01 Hewlett-Packard Company Forming refill for monolithic inkjet printhead
US6154234A (en) * 1998-01-09 2000-11-28 Hewlett-Packard Company Monolithic ink jet nozzle formed from an oxide and nitride composition
US6391527B2 (en) * 1998-04-16 2002-05-21 Canon Kabushiki Kaisha Method of producing micro structure, method of production liquid discharge head

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