JP2002254662A5 - - Google Patents

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Publication number
JP2002254662A5
JP2002254662A5 JP2002016080A JP2002016080A JP2002254662A5 JP 2002254662 A5 JP2002254662 A5 JP 2002254662A5 JP 2002016080 A JP2002016080 A JP 2002016080A JP 2002016080 A JP2002016080 A JP 2002016080A JP 2002254662 A5 JP2002254662 A5 JP 2002254662A5
Authority
JP
Japan
Prior art keywords
ink supply
substrate
supply opening
forming
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002016080A
Other languages
English (en)
Japanese (ja)
Other versions
JP3980361B2 (ja
JP2002254662A (ja
Filing date
Publication date
Priority claimed from US09/770,723 external-priority patent/US6419346B1/en
Application filed filed Critical
Publication of JP2002254662A publication Critical patent/JP2002254662A/ja
Publication of JP2002254662A5 publication Critical patent/JP2002254662A5/ja
Application granted granted Critical
Publication of JP3980361B2 publication Critical patent/JP3980361B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002016080A 2001-01-25 2002-01-24 完全に一体化されたサーマル・インクジェットプリントヘッドを形成するための２段階のトレンチエッチング Expired - Fee Related JP3980361B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/770,723 US6419346B1 (en) 2001-01-25 2001-01-25 Two-step trench etch for a fully integrated thermal inkjet printhead
US09/770723 2001-01-25

Publications (3)

Publication Number Publication Date
JP2002254662A JP2002254662A (ja) 2002-09-11
JP2002254662A5 true JP2002254662A5 (cg-RX-API-DMAC7.html) 2005-04-07
JP3980361B2 JP3980361B2 (ja) 2007-09-26

Family

ID=25089474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002016080A Expired - Fee Related JP3980361B2 (ja) 2001-01-25 2002-01-24 完全に一体化されたサーマル・インクジェットプリントヘッドを形成するための２段階のトレンチエッチング

Country Status (4)

Country Link
US (2) US6419346B1 (cg-RX-API-DMAC7.html)
EP (1) EP1226946B1 (cg-RX-API-DMAC7.html)
JP (1) JP3980361B2 (cg-RX-API-DMAC7.html)
DE (1) DE60208088T2 (cg-RX-API-DMAC7.html)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6626523B2 (en) * 2001-10-31 2003-09-30 Hewlett-Packard Development Company, Lp. Printhead having a thin film membrane with a floating section
US6908784B1 (en) * 2002-03-06 2005-06-21 Micron Technology, Inc. Method for fabricating encapsulated semiconductor components
KR100484168B1 (ko) 2002-10-11 2005-04-19 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
KR100499132B1 (ko) * 2002-10-24 2005-07-04 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
KR100459905B1 (ko) * 2002-11-21 2004-12-03 삼성전자주식회사 두 개의 잉크챔버 사이에 배치된 히터를 가진 일체형잉크젯 프린트헤드 및 그 제조방법
KR100468160B1 (ko) * 2002-12-02 2005-01-26 삼성전자주식회사 모노리식 버블 잉크젯 프린트 헤드 및 그 제조방법
KR100477707B1 (ko) * 2003-05-13 2005-03-18 삼성전자주식회사 모놀리틱 잉크젯 프린트헤드 제조방법
US7036913B2 (en) 2003-05-27 2006-05-02 Samsung Electronics Co., Ltd. Ink-jet printhead
KR100517515B1 (ko) 2004-01-20 2005-09-28 삼성전자주식회사 모놀리틱 잉크젯 프린트헤드의 제조방법
GB2410464A (en) * 2004-01-29 2005-08-03 Hewlett Packard Development Co A method of making an inkjet printhead
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
US7449280B2 (en) * 2004-05-26 2008-11-11 Microchem Corp. Photoimageable coating composition and composite article thereof
KR100765315B1 (ko) 2004-07-23 2007-10-09 삼성전자주식회사 기판과 일체로 이루어진 필터링 부재를 구비하는 잉크젯헤드 및 그 제조방법.
US8043517B2 (en) * 2005-09-19 2011-10-25 Hewlett-Packard Development Company, L.P. Method of forming openings in substrates and inkjet printheads fabricated thereby
KR20080046865A (ko) * 2006-11-23 2008-05-28 삼성전자주식회사 헤드칩 및 이를 포함하는 화상형성장치용 잉크카트리지
EP2091741B1 (en) 2006-12-07 2011-08-24 Hewlett-Packard Development Company, L.P. Method of forming openings in substrates
US8241510B2 (en) * 2007-01-22 2012-08-14 Canon Kabushiki Kaisha Inkjet recording head, method for producing same, and semiconductor device
KR20090024381A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 잉크젯 프린트 헤드
JP5854693B2 (ja) * 2010-09-01 2016-02-09 キヤノン株式会社 液体吐出ヘッドの製造方法
EP2828081B1 (en) * 2012-07-24 2019-10-09 Hewlett-Packard Company, L.P. Fluid ejection device with particle tolerant thin-film extension
JP6103879B2 (ja) * 2012-10-24 2017-03-29 キヤノン株式会社 液体吐出ヘッドの製造方法
WO2014098855A1 (en) 2012-12-20 2014-06-26 Hewlett-Packard Development Company, L.P. Fluid ejection device with particle tolerant layer extension
WO2015163888A1 (en) 2014-04-24 2015-10-29 Hewlett-Packard Development Company, L.P. Fluidic ejection device with layers having different light sensitivities
EP3429856B1 (en) * 2016-07-26 2022-01-12 Hewlett-Packard Development Company, L.P. Fluid ejection device with a portioning wall
JP7066418B2 (ja) * 2018-01-17 2022-05-13 キヤノン株式会社 液体吐出ヘッドおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0367303A1 (en) 1986-04-28 1990-05-09 Hewlett-Packard Company Thermal ink jet printhead
US4789425A (en) * 1987-08-06 1988-12-06 Xerox Corporation Thermal ink jet printhead fabricating process
US5648806A (en) 1992-04-02 1997-07-15 Hewlett-Packard Company Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
DK0841167T3 (da) 1996-11-11 2005-01-24 Canon Kk Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling.....
US6022482A (en) * 1997-08-04 2000-02-08 Xerox Corporation Monolithic ink jet printhead
JP3408130B2 (ja) * 1997-12-19 2003-05-19 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法

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