DK0841167T3 - Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling..... - Google Patents
Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling.....Info
- Publication number
- DK0841167T3 DK0841167T3 DK97119648T DK97119648T DK0841167T3 DK 0841167 T3 DK0841167 T3 DK 0841167T3 DK 97119648 T DK97119648 T DK 97119648T DK 97119648 T DK97119648 T DK 97119648T DK 0841167 T3 DK0841167 T3 DK 0841167T3
- Authority
- DK
- Denmark
- Prior art keywords
- making
- hole
- substrate
- silicon substrate
- silicon
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Weting (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29864296 | 1996-11-11 | ||
JP29864396 | 1996-11-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0841167T3 true DK0841167T3 (da) | 2005-01-24 |
Family
ID=26561605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK97119648T DK0841167T3 (da) | 1996-11-11 | 1997-11-10 | Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling..... |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0841167B1 (da) |
DE (1) | DE69730667T2 (da) |
DK (1) | DK0841167T3 (da) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6336714B1 (en) | 1996-02-07 | 2002-01-08 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having thin film layer shelf |
US6273557B1 (en) | 1998-03-02 | 2001-08-14 | Hewlett-Packard Company | Micromachined ink feed channels for an inkjet printhead |
US6379571B1 (en) * | 1998-06-11 | 2002-04-30 | Canon Kabushiki Kaisha | Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus |
JP4690556B2 (ja) * | 2000-07-21 | 2011-06-01 | 大日本印刷株式会社 | 微細パターン形成装置と微細ノズルの製造方法 |
IT1320599B1 (it) | 2000-08-23 | 2003-12-10 | Olivetti Lexikon Spa | Testina di stampa monolitica con scanalatura autoallineata e relativoprocesso di fabbricazione. |
US6675476B2 (en) * | 2000-12-05 | 2004-01-13 | Hewlett-Packard Development Company, L.P. | Slotted substrates and techniques for forming same |
US6419346B1 (en) * | 2001-01-25 | 2002-07-16 | Hewlett-Packard Company | Two-step trench etch for a fully integrated thermal inkjet printhead |
US6481832B2 (en) | 2001-01-29 | 2002-11-19 | Hewlett-Packard Company | Fluid-jet ejection device |
US6517735B2 (en) | 2001-03-15 | 2003-02-11 | Hewlett-Packard Company | Ink feed trench etch technique for a fully integrated thermal inkjet printhead |
US6818138B2 (en) | 2001-06-22 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Slotted substrate and slotting process |
DE60222969T2 (de) | 2001-08-10 | 2008-07-24 | Canon K.K. | Verfahren zur Herstellung eines Flüssigkeitsausstosskopfes, Substrat für einen Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren |
ITTO20011019A1 (it) | 2001-10-25 | 2003-04-28 | Olivetti I Jet | Procedimento perfezionato per la costruzione di un condotto di alimentazione per una testina di stampa a getto di inchiostro. |
US7105097B2 (en) | 2002-01-31 | 2006-09-12 | Hewlett-Packard Development Company, L.P. | Substrate and method of forming substrate for fluid ejection device |
US6648454B1 (en) | 2002-10-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Slotted substrate and method of making |
US6880926B2 (en) | 2002-10-31 | 2005-04-19 | Hewlett-Packard Development Company, L.P. | Circulation through compound slots |
CN100355573C (zh) | 2002-12-27 | 2007-12-19 | 佳能株式会社 | 用于制造喷墨记录头的基础件 |
US6821450B2 (en) | 2003-01-21 | 2004-11-23 | Hewlett-Packard Development Company, L.P. | Substrate and method of forming substrate for fluid ejection device |
US6883903B2 (en) | 2003-01-21 | 2005-04-26 | Martha A. Truninger | Flextensional transducer and method of forming flextensional transducer |
KR100480791B1 (ko) | 2003-06-05 | 2005-04-06 | 삼성전자주식회사 | 일체형 잉크젯 프린트헤드 및 그 제조방법 |
JP2005035281A (ja) * | 2003-06-23 | 2005-02-10 | Canon Inc | 液体吐出ヘッドの製造方法 |
US7429335B2 (en) | 2004-04-29 | 2008-09-30 | Shen Buswell | Substrate passage formation |
DE102005046156B3 (de) * | 2005-09-27 | 2007-05-31 | Siemens Ag | Vorrichtung mit Funktionselement und Verfahren zum Herstellen der Vorrichtung |
JP4144640B2 (ja) * | 2006-10-13 | 2008-09-03 | オムロン株式会社 | 振動センサの製造方法 |
DE102007031549B4 (de) | 2007-07-06 | 2021-07-08 | Robert Bosch Gmbh | Vorrichtung aus einkristallinem Silizium und Verfahren zur Herstellung einer Vorrichtung aus einkristallinem Silizium |
CN101873935A (zh) * | 2007-11-24 | 2010-10-27 | 惠普开发有限公司 | 具有加热电阻边缘保护层的喷墨打印装置打印头芯片 |
CN103510088B (zh) * | 2012-06-29 | 2015-11-11 | 中国科学院微电子研究所 | 固态孔阵及其制作方法 |
US9136160B2 (en) | 2012-06-29 | 2015-09-15 | Institute of Microelectronics, Chinese Academy of Sciences | Solid hole array and method for forming the same |
CN103281661B (zh) * | 2013-05-09 | 2019-02-05 | 上海集成电路研发中心有限公司 | 一种mems麦克风结构及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784721A (en) * | 1988-02-22 | 1988-11-15 | Honeywell Inc. | Integrated thin-film diaphragm; backside etch |
US5387314A (en) * | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5308442A (en) * | 1993-01-25 | 1994-05-03 | Hewlett-Packard Company | Anisotropically etched ink fill slots in silicon |
JP3343875B2 (ja) * | 1995-06-30 | 2002-11-11 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
-
1997
- 1997-11-10 DK DK97119648T patent/DK0841167T3/da active
- 1997-11-10 EP EP19970119648 patent/EP0841167B1/en not_active Expired - Lifetime
- 1997-11-10 DE DE69730667T patent/DE69730667T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69730667T2 (de) | 2005-09-22 |
DE69730667D1 (de) | 2004-10-21 |
EP0841167A3 (en) | 2000-03-08 |
EP0841167B1 (en) | 2004-09-15 |
EP0841167A2 (en) | 1998-05-13 |
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