DE69722296D1 - Substrat, auf dem Kontakthöcker aufgebildet sind und Herstellungsverfahren - Google Patents

Substrat, auf dem Kontakthöcker aufgebildet sind und Herstellungsverfahren

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Publication number
DE69722296D1
DE69722296D1 DE69722296T DE69722296T DE69722296D1 DE 69722296 D1 DE69722296 D1 DE 69722296D1 DE 69722296 T DE69722296 T DE 69722296T DE 69722296 T DE69722296 T DE 69722296T DE 69722296 D1 DE69722296 D1 DE 69722296D1
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Germany
Prior art keywords
bumps
substrate
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69722296T
Other languages
English (en)
Other versions
DE69722296T2 (de
Inventor
Kazufumi Yamaguchi
Tsutomi Mitani
Mitsuo Asabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69722296D1 publication Critical patent/DE69722296D1/de
Application granted granted Critical
Publication of DE69722296T2 publication Critical patent/DE69722296T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01ELECTRIC ELEMENTS
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/11Manufacturing methods
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    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE69722296T 1996-03-21 1997-03-21 Substrat, auf dem Kontakthöcker aufgebildet sind und Herstellungsverfahren Expired - Fee Related DE69722296T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6423796 1996-03-21
JP6423796 1996-03-21

Publications (2)

Publication Number Publication Date
DE69722296D1 true DE69722296D1 (de) 2003-07-03
DE69722296T2 DE69722296T2 (de) 2004-04-01

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DE69722296T Expired - Fee Related DE69722296T2 (de) 1996-03-21 1997-03-21 Substrat, auf dem Kontakthöcker aufgebildet sind und Herstellungsverfahren

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Country Link
US (2) US6042953A (de)
EP (1) EP0797247B1 (de)
KR (1) KR100251677B1 (de)
CN (1) CN1123063C (de)
DE (1) DE69722296T2 (de)

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US5914274A (en) 1999-06-22
KR100251677B1 (ko) 2000-04-15
US6042953A (en) 2000-03-28
DE69722296T2 (de) 2004-04-01
CN1123063C (zh) 2003-10-01
CN1165398A (zh) 1997-11-19
EP0797247A1 (de) 1997-09-24
EP0797247B1 (de) 2003-05-28

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