JPS6484738A - Bump formation - Google Patents

Bump formation

Info

Publication number
JPS6484738A
JPS6484738A JP24335387A JP24335387A JPS6484738A JP S6484738 A JPS6484738 A JP S6484738A JP 24335387 A JP24335387 A JP 24335387A JP 24335387 A JP24335387 A JP 24335387A JP S6484738 A JPS6484738 A JP S6484738A
Authority
JP
Japan
Prior art keywords
ultra
fine particles
bump
spraying
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24335387A
Other languages
Japanese (ja)
Inventor
Kazuhiko Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP24335387A priority Critical patent/JPS6484738A/en
Publication of JPS6484738A publication Critical patent/JPS6484738A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a semiconductor with bumps by using a simple apparatus and the minimum amount of materials at a low cost, by spraying from a nozzle ultra-fine particles having a specific particle size which are in a state of floating in a gas and forming each bump consisting of the ultra-fine particles on a pad of the semiconductor element. CONSTITUTION:A bump 5 consisting of ultra-fine particles is formed on a pad 2 of a semiconductor element 1 by spraying from a nozzle 3 the ultra-fine particles having each particle size 0.1mum or smaller which are in a state of floating in a gas. For example, when an Au bump is formed, Au atoms which are vaporized by evaporating a mass of Au in an evaporating chamber while putting inactive gases such as helium or argon and the like in its chamber collide with gaseous molecules and are rapidly cooled and are condensed by cooling to form Au ultra-fine particles consisting of each particle size 0.1mum or smaller of Au. The Au ultra-fine particles are introduced from the direction of the allow as shown in Fig. and each bump 5, 1-20mum in thickness, is formed by spraying the particulates from the nozzle 3 on each pad 2 on an LSI 1.
JP24335387A 1987-09-28 1987-09-28 Bump formation Pending JPS6484738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24335387A JPS6484738A (en) 1987-09-28 1987-09-28 Bump formation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24335387A JPS6484738A (en) 1987-09-28 1987-09-28 Bump formation

Publications (1)

Publication Number Publication Date
JPS6484738A true JPS6484738A (en) 1989-03-30

Family

ID=17102572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24335387A Pending JPS6484738A (en) 1987-09-28 1987-09-28 Bump formation

Country Status (1)

Country Link
JP (1) JPS6484738A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0797247A1 (en) * 1996-03-21 1997-09-24 Matsushita Electric Industrial Co., Ltd Substrate on which bumps are formed and method of forming the same
DE10113497A1 (en) * 2001-03-20 2002-06-06 Infineon Technologies Ag Production of an integrated circuit used in the semiconductor industry comprises preparing a circuit substrate, forming bumps on the substrate, and providing metallized strips
WO2007114314A1 (en) * 2006-03-30 2007-10-11 Kabushiki Kaisha Mikuni Kogyo Method of forming minute metal bump

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0797247A1 (en) * 1996-03-21 1997-09-24 Matsushita Electric Industrial Co., Ltd Substrate on which bumps are formed and method of forming the same
US5914274A (en) * 1996-03-21 1999-06-22 Matsushita Electric Industrial Co., Ltd. Substrate on which bumps are formed and method of forming the same
US6042953A (en) * 1996-03-21 2000-03-28 Matsushita Electric Industrial Co., Ltd. Substrate on which bumps are formed and method of forming the same
KR100251677B1 (en) * 1996-03-21 2000-04-15 모리시타 요이찌 Bump forming body and forming method of bump
DE10113497A1 (en) * 2001-03-20 2002-06-06 Infineon Technologies Ag Production of an integrated circuit used in the semiconductor industry comprises preparing a circuit substrate, forming bumps on the substrate, and providing metallized strips
WO2007114314A1 (en) * 2006-03-30 2007-10-11 Kabushiki Kaisha Mikuni Kogyo Method of forming minute metal bump
US7767574B2 (en) 2006-03-30 2010-08-03 Kabushiki Kaisha Mikuni Kogyo Method of forming micro metal bump
JP4826924B2 (en) * 2006-03-30 2011-11-30 株式会社みくに工業 Method for forming fine metal bumps

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