DK0841167T3 - Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making ..... - Google Patents

Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making .....

Info

Publication number
DK0841167T3
DK0841167T3 DK97119648T DK97119648T DK0841167T3 DK 0841167 T3 DK0841167 T3 DK 0841167T3 DK 97119648 T DK97119648 T DK 97119648T DK 97119648 T DK97119648 T DK 97119648T DK 0841167 T3 DK0841167 T3 DK 0841167T3
Authority
DK
Denmark
Prior art keywords
making
hole
substrate
silicon substrate
silicon
Prior art date
Application number
DK97119648T
Other languages
Danish (da)
Inventor
Masahiro Takizawa
Takayuki Yagi
Junichi Kobayashi
Yasushi Kawasumi
Genzo Momma
Kenji Makino
Kei Fujita
Yasushi Matsuno
Yukihiro Hayakawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of DK0841167T3 publication Critical patent/DK0841167T3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit
DK97119648T 1996-11-11 1997-11-10 Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making ..... DK0841167T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29864396 1996-11-11
JP29864296 1996-11-11

Publications (1)

Publication Number Publication Date
DK0841167T3 true DK0841167T3 (en) 2005-01-24

Family

ID=26561605

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97119648T DK0841167T3 (en) 1996-11-11 1997-11-10 Process for making through-hole and using said method for making a silicon substrate having a through-hole, and a device using such a substrate, method for making .....

Country Status (3)

Country Link
EP (1) EP0841167B1 (en)
DE (1) DE69730667T2 (en)
DK (1) DK0841167T3 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6273557B1 (en) 1998-03-02 2001-08-14 Hewlett-Packard Company Micromachined ink feed channels for an inkjet printhead
US6379571B1 (en) * 1998-06-11 2002-04-30 Canon Kabushiki Kaisha Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus
JP4690556B2 (en) * 2000-07-21 2011-06-01 大日本印刷株式会社 Fine pattern forming apparatus and fine nozzle manufacturing method
IT1320599B1 (en) 2000-08-23 2003-12-10 Olivetti Lexikon Spa MONOLITHIC PRINT HEAD WITH SELF-ALIGNED GROOVING AND RELATIVE MANUFACTURING PROCESS.
US6675476B2 (en) * 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US6419346B1 (en) 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US6818138B2 (en) * 2001-06-22 2004-11-16 Hewlett-Packard Development Company, L.P. Slotted substrate and slotting process
ATE375865T1 (en) 2001-08-10 2007-11-15 Canon Kk METHOD FOR PRODUCING A LIQUID DISCHARGE HEAD, SUBSTRATE FOR A LIQUID DISCHARGE HEAD AND ASSOCIATED PRODUCTION METHOD
ITTO20011019A1 (en) 2001-10-25 2003-04-28 Olivetti I Jet PERFECT PROCEDURE FOR THE CONSTRUCTION OF A SUPPLY DUCT FOR AN INK JET PRINT HEAD.
US7105097B2 (en) 2002-01-31 2006-09-12 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6880926B2 (en) 2002-10-31 2005-04-19 Hewlett-Packard Development Company, L.P. Circulation through compound slots
CN100355573C (en) * 2002-12-27 2007-12-19 佳能株式会社 Ink-jet recording head and mfg. method, and substrate for mfg. ink-jet recording head
US6883903B2 (en) 2003-01-21 2005-04-26 Martha A. Truninger Flextensional transducer and method of forming flextensional transducer
US6821450B2 (en) 2003-01-21 2004-11-23 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
KR100480791B1 (en) * 2003-06-05 2005-04-06 삼성전자주식회사 Monolithic ink jet printhead and method of manufacturing thereof
JP2005035281A (en) * 2003-06-23 2005-02-10 Canon Inc Manufacturing method of liquid ejection head
US7429335B2 (en) 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
DE102005046156B3 (en) * 2005-09-27 2007-05-31 Siemens Ag Device with functional element and method for manufacturing the device
JP4144640B2 (en) * 2006-10-13 2008-09-03 オムロン株式会社 Method for manufacturing vibration sensor
DE102007031549B4 (en) 2007-07-06 2021-07-08 Robert Bosch Gmbh Single crystal silicon device and method of making a single crystal silicon device
EP2212115A4 (en) * 2007-11-24 2011-03-02 Hewlett Packard Development Co Inkjet-printing device printhead die having edge protection layer for heating resistor
US9136160B2 (en) 2012-06-29 2015-09-15 Institute of Microelectronics, Chinese Academy of Sciences Solid hole array and method for forming the same
CN103510088B (en) * 2012-06-29 2015-11-11 中国科学院微电子研究所 Solid-state hole array and preparation method thereof
CN103281661B (en) * 2013-05-09 2019-02-05 上海集成电路研发中心有限公司 A kind of MEMS microphone structure and its manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
US5387314A (en) * 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
JP3343875B2 (en) * 1995-06-30 2002-11-11 キヤノン株式会社 Method of manufacturing inkjet head

Also Published As

Publication number Publication date
EP0841167A3 (en) 2000-03-08
EP0841167A2 (en) 1998-05-13
EP0841167B1 (en) 2004-09-15
DE69730667D1 (en) 2004-10-21
DE69730667T2 (en) 2005-09-22

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