DE60208088T2 - Zweistufiges Ätzen eines Grabens für einen vollständig integrierten Tintenstrahldruckkopf - Google Patents
Zweistufiges Ätzen eines Grabens für einen vollständig integrierten Tintenstrahldruckkopf Download PDFInfo
- Publication number
- DE60208088T2 DE60208088T2 DE60208088T DE60208088T DE60208088T2 DE 60208088 T2 DE60208088 T2 DE 60208088T2 DE 60208088 T DE60208088 T DE 60208088T DE 60208088 T DE60208088 T DE 60208088T DE 60208088 T2 DE60208088 T2 DE 60208088T2
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- protective layer
- ink
- forming
- film layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title claims description 41
- 239000010410 layer Substances 0.000 claims description 123
- 238000000034 method Methods 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 50
- 239000010409 thin film Substances 0.000 claims description 49
- 239000011241 protective layer Substances 0.000 claims description 45
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 7
- 230000000873 masking effect Effects 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 2
- 239000002689 soil Substances 0.000 claims 1
- 239000000976 ink Substances 0.000 description 94
- 239000005360 phosphosilicate glass Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 6
- 229910016570 AlCu Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 239000003518 caustics Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/770,723 US6419346B1 (en) | 2001-01-25 | 2001-01-25 | Two-step trench etch for a fully integrated thermal inkjet printhead |
| US770723 | 2001-01-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60208088D1 DE60208088D1 (de) | 2006-01-26 |
| DE60208088T2 true DE60208088T2 (de) | 2006-08-24 |
Family
ID=25089474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60208088T Expired - Lifetime DE60208088T2 (de) | 2001-01-25 | 2002-01-18 | Zweistufiges Ätzen eines Grabens für einen vollständig integrierten Tintenstrahldruckkopf |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6419346B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1226946B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP3980361B2 (cg-RX-API-DMAC7.html) |
| DE (1) | DE60208088T2 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112012007239B4 (de) | 2012-12-20 | 2021-11-25 | Hewlett-Packard Development Co.,L.P. | Fluidausstossvorrichtung mit partikeltoleranter Schichterweiterung |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6481832B2 (en) | 2001-01-29 | 2002-11-19 | Hewlett-Packard Company | Fluid-jet ejection device |
| US6626523B2 (en) * | 2001-10-31 | 2003-09-30 | Hewlett-Packard Development Company, Lp. | Printhead having a thin film membrane with a floating section |
| US6908784B1 (en) * | 2002-03-06 | 2005-06-21 | Micron Technology, Inc. | Method for fabricating encapsulated semiconductor components |
| KR100484168B1 (ko) | 2002-10-11 | 2005-04-19 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| KR100499132B1 (ko) * | 2002-10-24 | 2005-07-04 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| US6648454B1 (en) | 2002-10-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Slotted substrate and method of making |
| KR100459905B1 (ko) * | 2002-11-21 | 2004-12-03 | 삼성전자주식회사 | 두 개의 잉크챔버 사이에 배치된 히터를 가진 일체형잉크젯 프린트헤드 및 그 제조방법 |
| KR100468160B1 (ko) * | 2002-12-02 | 2005-01-26 | 삼성전자주식회사 | 모노리식 버블 잉크젯 프린트 헤드 및 그 제조방법 |
| KR100477707B1 (ko) * | 2003-05-13 | 2005-03-18 | 삼성전자주식회사 | 모놀리틱 잉크젯 프린트헤드 제조방법 |
| US7036913B2 (en) | 2003-05-27 | 2006-05-02 | Samsung Electronics Co., Ltd. | Ink-jet printhead |
| KR100517515B1 (ko) | 2004-01-20 | 2005-09-28 | 삼성전자주식회사 | 모놀리틱 잉크젯 프린트헤드의 제조방법 |
| GB2410464A (en) * | 2004-01-29 | 2005-08-03 | Hewlett Packard Development Co | A method of making an inkjet printhead |
| US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
| US7449280B2 (en) * | 2004-05-26 | 2008-11-11 | Microchem Corp. | Photoimageable coating composition and composite article thereof |
| KR100765315B1 (ko) | 2004-07-23 | 2007-10-09 | 삼성전자주식회사 | 기판과 일체로 이루어진 필터링 부재를 구비하는 잉크젯헤드 및 그 제조방법. |
| US8043517B2 (en) * | 2005-09-19 | 2011-10-25 | Hewlett-Packard Development Company, L.P. | Method of forming openings in substrates and inkjet printheads fabricated thereby |
| KR20080046865A (ko) * | 2006-11-23 | 2008-05-28 | 삼성전자주식회사 | 헤드칩 및 이를 포함하는 화상형성장치용 잉크카트리지 |
| EP2091741B1 (en) | 2006-12-07 | 2011-08-24 | Hewlett-Packard Development Company, L.P. | Method of forming openings in substrates |
| US8241510B2 (en) * | 2007-01-22 | 2012-08-14 | Canon Kabushiki Kaisha | Inkjet recording head, method for producing same, and semiconductor device |
| KR20090024381A (ko) * | 2007-09-04 | 2009-03-09 | 삼성전자주식회사 | 잉크젯 프린트 헤드 |
| JP5854693B2 (ja) * | 2010-09-01 | 2016-02-09 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| EP2828081B1 (en) * | 2012-07-24 | 2019-10-09 | Hewlett-Packard Company, L.P. | Fluid ejection device with particle tolerant thin-film extension |
| JP6103879B2 (ja) * | 2012-10-24 | 2017-03-29 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| WO2015163888A1 (en) | 2014-04-24 | 2015-10-29 | Hewlett-Packard Development Company, L.P. | Fluidic ejection device with layers having different light sensitivities |
| EP3429856B1 (en) * | 2016-07-26 | 2022-01-12 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with a portioning wall |
| JP7066418B2 (ja) * | 2018-01-17 | 2022-05-13 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0367303A1 (en) | 1986-04-28 | 1990-05-09 | Hewlett-Packard Company | Thermal ink jet printhead |
| US4789425A (en) * | 1987-08-06 | 1988-12-06 | Xerox Corporation | Thermal ink jet printhead fabricating process |
| US5648806A (en) | 1992-04-02 | 1997-07-15 | Hewlett-Packard Company | Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer |
| DK0841167T3 (da) | 1996-11-11 | 2005-01-24 | Canon Kk | Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling..... |
| US6022482A (en) * | 1997-08-04 | 2000-02-08 | Xerox Corporation | Monolithic ink jet printhead |
| JP3408130B2 (ja) * | 1997-12-19 | 2003-05-19 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
-
2001
- 2001-01-25 US US09/770,723 patent/US6419346B1/en not_active Expired - Lifetime
-
2002
- 2002-01-18 DE DE60208088T patent/DE60208088T2/de not_active Expired - Lifetime
- 2002-01-18 EP EP02250340A patent/EP1226946B1/en not_active Expired - Lifetime
- 2002-01-24 JP JP2002016080A patent/JP3980361B2/ja not_active Expired - Fee Related
- 2002-06-27 US US10/185,532 patent/US20020167553A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112012007239B4 (de) | 2012-12-20 | 2021-11-25 | Hewlett-Packard Development Co.,L.P. | Fluidausstossvorrichtung mit partikeltoleranter Schichterweiterung |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3980361B2 (ja) | 2007-09-26 |
| US20020167553A1 (en) | 2002-11-14 |
| EP1226946B1 (en) | 2005-12-21 |
| US20020097302A1 (en) | 2002-07-25 |
| JP2002254662A (ja) | 2002-09-11 |
| DE60208088D1 (de) | 2006-01-26 |
| EP1226946A3 (en) | 2003-07-23 |
| US6419346B1 (en) | 2002-07-16 |
| EP1226946A2 (en) | 2002-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., HOUSTON |
|
| 8364 | No opposition during term of opposition |