JP3980361B2 - 完全に一体化されたサーマル・インクジェットプリントヘッドを形成するための2段階のトレンチエッチング - Google Patents
完全に一体化されたサーマル・インクジェットプリントヘッドを形成するための2段階のトレンチエッチング Download PDFInfo
- Publication number
- JP3980361B2 JP3980361B2 JP2002016080A JP2002016080A JP3980361B2 JP 3980361 B2 JP3980361 B2 JP 3980361B2 JP 2002016080 A JP2002016080 A JP 2002016080A JP 2002016080 A JP2002016080 A JP 2002016080A JP 3980361 B2 JP3980361 B2 JP 3980361B2
- Authority
- JP
- Japan
- Prior art keywords
- ink supply
- layer
- substrate
- forming
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 title claims description 48
- 239000010410 layer Substances 0.000 claims description 143
- 238000000034 method Methods 0.000 claims description 68
- 239000010409 thin film Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 63
- 239000011241 protective layer Substances 0.000 claims description 58
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 24
- 230000000873 masking effect Effects 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000004020 conductor Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 229910016570 AlCu Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 1
- ONRPGGOGHKMHDT-UHFFFAOYSA-N benzene-1,2-diol;ethane-1,2-diamine Chemical compound NCCN.OC1=CC=CC=C1O ONRPGGOGHKMHDT-UHFFFAOYSA-N 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/770,723 US6419346B1 (en) | 2001-01-25 | 2001-01-25 | Two-step trench etch for a fully integrated thermal inkjet printhead |
| US09/770723 | 2001-01-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002254662A JP2002254662A (ja) | 2002-09-11 |
| JP2002254662A5 JP2002254662A5 (cg-RX-API-DMAC7.html) | 2005-04-07 |
| JP3980361B2 true JP3980361B2 (ja) | 2007-09-26 |
Family
ID=25089474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002016080A Expired - Fee Related JP3980361B2 (ja) | 2001-01-25 | 2002-01-24 | 完全に一体化されたサーマル・インクジェットプリントヘッドを形成するための2段階のトレンチエッチング |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6419346B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1226946B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP3980361B2 (cg-RX-API-DMAC7.html) |
| DE (1) | DE60208088T2 (cg-RX-API-DMAC7.html) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6481832B2 (en) | 2001-01-29 | 2002-11-19 | Hewlett-Packard Company | Fluid-jet ejection device |
| US6626523B2 (en) * | 2001-10-31 | 2003-09-30 | Hewlett-Packard Development Company, Lp. | Printhead having a thin film membrane with a floating section |
| US6908784B1 (en) * | 2002-03-06 | 2005-06-21 | Micron Technology, Inc. | Method for fabricating encapsulated semiconductor components |
| KR100484168B1 (ko) | 2002-10-11 | 2005-04-19 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| KR100499132B1 (ko) * | 2002-10-24 | 2005-07-04 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| US6648454B1 (en) | 2002-10-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Slotted substrate and method of making |
| KR100459905B1 (ko) * | 2002-11-21 | 2004-12-03 | 삼성전자주식회사 | 두 개의 잉크챔버 사이에 배치된 히터를 가진 일체형잉크젯 프린트헤드 및 그 제조방법 |
| KR100468160B1 (ko) * | 2002-12-02 | 2005-01-26 | 삼성전자주식회사 | 모노리식 버블 잉크젯 프린트 헤드 및 그 제조방법 |
| KR100477707B1 (ko) * | 2003-05-13 | 2005-03-18 | 삼성전자주식회사 | 모놀리틱 잉크젯 프린트헤드 제조방법 |
| US7036913B2 (en) | 2003-05-27 | 2006-05-02 | Samsung Electronics Co., Ltd. | Ink-jet printhead |
| KR100517515B1 (ko) | 2004-01-20 | 2005-09-28 | 삼성전자주식회사 | 모놀리틱 잉크젯 프린트헤드의 제조방법 |
| GB2410464A (en) * | 2004-01-29 | 2005-08-03 | Hewlett Packard Development Co | A method of making an inkjet printhead |
| US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
| US7449280B2 (en) * | 2004-05-26 | 2008-11-11 | Microchem Corp. | Photoimageable coating composition and composite article thereof |
| KR100765315B1 (ko) | 2004-07-23 | 2007-10-09 | 삼성전자주식회사 | 기판과 일체로 이루어진 필터링 부재를 구비하는 잉크젯헤드 및 그 제조방법. |
| US8043517B2 (en) * | 2005-09-19 | 2011-10-25 | Hewlett-Packard Development Company, L.P. | Method of forming openings in substrates and inkjet printheads fabricated thereby |
| KR20080046865A (ko) * | 2006-11-23 | 2008-05-28 | 삼성전자주식회사 | 헤드칩 및 이를 포함하는 화상형성장치용 잉크카트리지 |
| EP2091741B1 (en) | 2006-12-07 | 2011-08-24 | Hewlett-Packard Development Company, L.P. | Method of forming openings in substrates |
| US8241510B2 (en) * | 2007-01-22 | 2012-08-14 | Canon Kabushiki Kaisha | Inkjet recording head, method for producing same, and semiconductor device |
| KR20090024381A (ko) * | 2007-09-04 | 2009-03-09 | 삼성전자주식회사 | 잉크젯 프린트 헤드 |
| JP5854693B2 (ja) * | 2010-09-01 | 2016-02-09 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| EP2828081B1 (en) * | 2012-07-24 | 2019-10-09 | Hewlett-Packard Company, L.P. | Fluid ejection device with particle tolerant thin-film extension |
| JP6103879B2 (ja) * | 2012-10-24 | 2017-03-29 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| WO2014098855A1 (en) | 2012-12-20 | 2014-06-26 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with particle tolerant layer extension |
| WO2015163888A1 (en) | 2014-04-24 | 2015-10-29 | Hewlett-Packard Development Company, L.P. | Fluidic ejection device with layers having different light sensitivities |
| EP3429856B1 (en) * | 2016-07-26 | 2022-01-12 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with a portioning wall |
| JP7066418B2 (ja) * | 2018-01-17 | 2022-05-13 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0367303A1 (en) | 1986-04-28 | 1990-05-09 | Hewlett-Packard Company | Thermal ink jet printhead |
| US4789425A (en) * | 1987-08-06 | 1988-12-06 | Xerox Corporation | Thermal ink jet printhead fabricating process |
| US5648806A (en) | 1992-04-02 | 1997-07-15 | Hewlett-Packard Company | Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer |
| DK0841167T3 (da) | 1996-11-11 | 2005-01-24 | Canon Kk | Fremgangsmåde til fremstilling af gennemgående hul og anvendelse af den nævnte fremgangsmåde til fremstilling af et siliciumsubstrat, der har et gennemgående hul, og en anordning, der anvender et sådant substrat, fremgangsmåde til fremstilling..... |
| US6022482A (en) * | 1997-08-04 | 2000-02-08 | Xerox Corporation | Monolithic ink jet printhead |
| JP3408130B2 (ja) * | 1997-12-19 | 2003-05-19 | キヤノン株式会社 | インクジェット記録ヘッドおよびその製造方法 |
-
2001
- 2001-01-25 US US09/770,723 patent/US6419346B1/en not_active Expired - Lifetime
-
2002
- 2002-01-18 DE DE60208088T patent/DE60208088T2/de not_active Expired - Lifetime
- 2002-01-18 EP EP02250340A patent/EP1226946B1/en not_active Expired - Lifetime
- 2002-01-24 JP JP2002016080A patent/JP3980361B2/ja not_active Expired - Fee Related
- 2002-06-27 US US10/185,532 patent/US20020167553A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20020167553A1 (en) | 2002-11-14 |
| EP1226946B1 (en) | 2005-12-21 |
| US20020097302A1 (en) | 2002-07-25 |
| JP2002254662A (ja) | 2002-09-11 |
| DE60208088D1 (de) | 2006-01-26 |
| EP1226946A3 (en) | 2003-07-23 |
| US6419346B1 (en) | 2002-07-16 |
| EP1226946A2 (en) | 2002-07-31 |
| DE60208088T2 (de) | 2006-08-24 |
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