JP2002270616A - 薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法 - Google Patents

薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法

Info

Publication number
JP2002270616A
JP2002270616A JP2002050005A JP2002050005A JP2002270616A JP 2002270616 A JP2002270616 A JP 2002270616A JP 2002050005 A JP2002050005 A JP 2002050005A JP 2002050005 A JP2002050005 A JP 2002050005A JP 2002270616 A JP2002270616 A JP 2002270616A
Authority
JP
Japan
Prior art keywords
base
layer
emitter
gaassb
bipolar transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002050005A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002270616A5 (enExample
Inventor
Nicolas J Moll
ニコラス・ジェイ・モール
Colombo R Bolognesi
コロンボ・アール・ボログネシ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2002270616A publication Critical patent/JP2002270616A/ja
Publication of JP2002270616A5 publication Critical patent/JP2002270616A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • H10D62/136Emitter regions of BJTs of heterojunction BJTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/80Heterojunction BJTs
    • H10D10/821Vertical heterojunction BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/177Base regions of bipolar transistors, e.g. BJTs or IGBTs

Landscapes

  • Bipolar Transistors (AREA)
JP2002050005A 2001-02-27 2002-02-26 薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法 Pending JP2002270616A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US796299 1997-02-07
US09/796,299 US6762480B2 (en) 2001-02-27 2001-02-27 Thin gallium-arsenide-antimonide base heterojunction bipolar transistor (HBT) having improved gain

Publications (2)

Publication Number Publication Date
JP2002270616A true JP2002270616A (ja) 2002-09-20
JP2002270616A5 JP2002270616A5 (enExample) 2005-08-25

Family

ID=25167855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002050005A Pending JP2002270616A (ja) 2001-02-27 2002-02-26 薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法

Country Status (3)

Country Link
US (2) US6762480B2 (enExample)
EP (1) EP1237199A3 (enExample)
JP (1) JP2002270616A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903387B2 (en) 2002-12-26 2005-06-07 Sony Corporation Semiconductor device
US7242038B2 (en) 2004-07-01 2007-07-10 Nippon Telegraph And Telephone Corporation Heterojunction bipolar transistor
JP2016122734A (ja) * 2014-12-25 2016-07-07 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタおよびその製造方法
WO2022130560A1 (ja) * 2020-12-17 2022-06-23 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタ

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784450B2 (en) * 2001-07-20 2004-08-31 Microlink Devices, Inc. Graded base GaAsSb for high speed GaAs HBT
US7295586B2 (en) * 2002-02-21 2007-11-13 Finisar Corporation Carbon doped GaAsSb suitable for use in tunnel junctions of long-wavelength VCSELs
FR2878078B1 (fr) * 2004-11-18 2007-01-19 Cit Alcatel Transistor bipolaire et procede de fabrication de ce transistor
US7038256B1 (en) * 2004-12-03 2006-05-02 Northrop Grumman Corp. Low turn-on voltage, non-electron blocking double HBT structure
US8575659B1 (en) * 2011-08-13 2013-11-05 Hrl Laboratories, Llc Carbon-beryllium combinationally doped semiconductor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01136368A (ja) * 1987-10-30 1989-05-29 Internatl Business Mach Corp <Ibm> ヘテロ接合バイポーラ・トランジスタ
JPH03108725A (ja) * 1989-09-22 1991-05-08 Nec Corp 半導体結晶
JPH0637104A (ja) * 1992-05-28 1994-02-10 Hughes Aircraft Co 半絶縁性燐化インジュウム基体上に形成されたアンチモン化合物ベースを含むnpn型ヘテロ接合バイポーラトランジスタ
JPH08335588A (ja) * 1994-11-30 1996-12-17 Rockwell Internatl Corp InPベースの半導体
JPH11354451A (ja) * 1998-06-05 1999-12-24 Hitachi Ltd 半導体装置
JP2000306920A (ja) * 1999-04-20 2000-11-02 Furukawa Electric Co Ltd:The ヘテロ接合バイポーラトランジスタ及びその作製方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US27232A (en) * 1860-02-21 Spring-skate
JP3210383B2 (ja) * 1992-01-22 2001-09-17 株式会社東芝 ヘテロ接合バイポーラトランジスタ
JPH0783032B2 (ja) * 1993-01-28 1995-09-06 日本電気株式会社 2−6族化合物半導体p形電極構造
US5770868A (en) * 1995-11-08 1998-06-23 Martin Marietta Corporation GaAs substrate with compositionally graded AlGaAsSb buffer for fabrication of high-indium fets
DE19640003B4 (de) * 1996-09-27 2005-07-07 Siemens Ag Halbleitervorrichtung und Verfahren zu dessen Herstellung
JP3628873B2 (ja) * 1998-04-28 2005-03-16 富士通株式会社 半導体装置及びその製造方法
JP3658745B2 (ja) * 1998-08-19 2005-06-08 株式会社ルネサステクノロジ バイポーラトランジスタ
US6670653B1 (en) 1999-07-30 2003-12-30 Hrl Laboratories, Llc InP collector InGaAsSb base DHBT device and method of forming same
US6251738B1 (en) * 2000-01-10 2001-06-26 International Business Machines Corporation Process for forming a silicon-germanium base of heterojunction bipolar transistor
US6316795B1 (en) * 2000-04-03 2001-11-13 Hrl Laboratories, Llc Silicon-carbon emitter for silicon-germanium heterojunction bipolar transistors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01136368A (ja) * 1987-10-30 1989-05-29 Internatl Business Mach Corp <Ibm> ヘテロ接合バイポーラ・トランジスタ
JPH03108725A (ja) * 1989-09-22 1991-05-08 Nec Corp 半導体結晶
JPH0637104A (ja) * 1992-05-28 1994-02-10 Hughes Aircraft Co 半絶縁性燐化インジュウム基体上に形成されたアンチモン化合物ベースを含むnpn型ヘテロ接合バイポーラトランジスタ
JPH08335588A (ja) * 1994-11-30 1996-12-17 Rockwell Internatl Corp InPベースの半導体
JPH11354451A (ja) * 1998-06-05 1999-12-24 Hitachi Ltd 半導体装置
JP2000306920A (ja) * 1999-04-20 2000-11-02 Furukawa Electric Co Ltd:The ヘテロ接合バイポーラトランジスタ及びその作製方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903387B2 (en) 2002-12-26 2005-06-07 Sony Corporation Semiconductor device
US7242038B2 (en) 2004-07-01 2007-07-10 Nippon Telegraph And Telephone Corporation Heterojunction bipolar transistor
JP2016122734A (ja) * 2014-12-25 2016-07-07 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタおよびその製造方法
WO2022130560A1 (ja) * 2020-12-17 2022-06-23 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタ

Also Published As

Publication number Publication date
US20020145137A1 (en) 2002-10-10
US20040104403A1 (en) 2004-06-03
US6762480B2 (en) 2004-07-13
EP1237199A3 (en) 2003-01-15
EP1237199A2 (en) 2002-09-04

Similar Documents

Publication Publication Date Title
US5907159A (en) Hot electron device and a resonant tunneling hot electron device
TWI246196B (en) Semiconductor device
US6806512B2 (en) InPSb/InAs BJT device and method of making
JP2528253B2 (ja) Npn型ヘテロ接合バイポ―ラトランジスタ
JPH0669222A (ja) ヘテロ接合バイポーラトランジスタ及びその製造方法
WO1998050961A1 (en) Heterojunction bipolar transistor having heterostructure ballasting emitter
JP3935372B2 (ja) 改良型エミッタ−ベース接合を持つヘテロ接合バイポーラトランジスタ及びその製造方法
JP2002270616A (ja) 薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法
JP7403201B2 (ja) 化合物半導体ヘテロ接合バイポーラトランジスタ
JP4799938B2 (ja) ヘテロ接合バイポーラトランジスタ
JP3282115B2 (ja) ヘテロ接合トランジスタ
JP3629247B2 (ja) ダブルヘテロ接合バイポーラ・トランジスタ
KURISHIMA et al. Growth, design and performance of InP-based heterostructure bipolar transistors
JPH01171269A (ja) 半導体装置
JPH0297026A (ja) ヘテロバイポーラトランジスタ
JP2003086602A (ja) ヘテロ接合バイポーラトランジスタ
Cheng et al. Influence of the-doping sheet and setback layer on the performance of an InGaP/GaAs heterojunction bipolar transistor
JP2522358B2 (ja) ゲルマニウムを用いたヘテロ構造バイポ―ラ・トランジスタ
Lew et al. GaAsNSb-base GaAs heterojunction bipolar transistor with a low turn-on voltage
Beresford et al. Narrow-gap InAs for heterostructure tunnelling
TW200414535A (en) Semiconductor material with bipolar transistor and the semiconductor device using the same
Zeng et al. Effects of arsenic mole fraction x on the gain characteristics of type-II InP/GaAsxSb1− x DHBTs
JPH01149465A (ja) ヘテロ接合バイポーラトランジスタ
JP2002246612A (ja) 共鳴トンネルダイオード
JP2001176881A (ja) ヘテロ接合バイポーラトランジスタ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050222

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060412

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060420

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20060718

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20060718

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20060720

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20060725

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061003

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20070502

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20070509

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070718

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080312

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080407

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20080502