JP2002236611A - 半導体装置と情報処理システム - Google Patents

半導体装置と情報処理システム

Info

Publication number
JP2002236611A
JP2002236611A JP2001287198A JP2001287198A JP2002236611A JP 2002236611 A JP2002236611 A JP 2002236611A JP 2001287198 A JP2001287198 A JP 2001287198A JP 2001287198 A JP2001287198 A JP 2001287198A JP 2002236611 A JP2002236611 A JP 2002236611A
Authority
JP
Japan
Prior art keywords
circuit
identification information
input
internal
serial bus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001287198A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002236611A5 (enExample
Inventor
Masato Momii
政人 籾井
Shinji Kobayashi
信治 小林
Naoki Fujita
直喜 藤田
Masanobu Kawamura
正信 川村
Toru Ishida
徹 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP2001287198A priority Critical patent/JP2002236611A/ja
Publication of JP2002236611A publication Critical patent/JP2002236611A/ja
Publication of JP2002236611A5 publication Critical patent/JP2002236611A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Memory System (AREA)
  • Read Only Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2001287198A 2000-12-04 2001-09-20 半導体装置と情報処理システム Pending JP2002236611A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001287198A JP2002236611A (ja) 2000-12-04 2001-09-20 半導体装置と情報処理システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000367874 2000-12-04
JP2000-367874 2000-12-04
JP2001287198A JP2002236611A (ja) 2000-12-04 2001-09-20 半導体装置と情報処理システム

Publications (2)

Publication Number Publication Date
JP2002236611A true JP2002236611A (ja) 2002-08-23
JP2002236611A5 JP2002236611A5 (enExample) 2008-11-06

Family

ID=26605132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001287198A Pending JP2002236611A (ja) 2000-12-04 2001-09-20 半導体装置と情報処理システム

Country Status (1)

Country Link
JP (1) JP2002236611A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100357904C (zh) * 2005-08-31 2007-12-26 上海海尔集成电路有限公司 一种微控制器配置接口操作方法
JP2009164653A (ja) * 2009-04-27 2009-07-23 Renesas Technology Corp マルチチップモジュール
JP2012181916A (ja) * 2005-09-30 2012-09-20 Mosaid Technologies Inc 複数の独立したシリアルリンクメモリ
JP2013146063A (ja) * 2012-01-13 2013-07-25 Altera Corp フレキシブル電子インターフェースのための装置および関連方法
JP2014013252A (ja) * 2013-09-12 2014-01-23 Dainippon Printing Co Ltd 回路板の検査方法、回路板の検査装置
US8654601B2 (en) 2005-09-30 2014-02-18 Mosaid Technologies Incorporated Memory with output control
JP2014063523A (ja) * 2006-12-06 2014-04-10 Conversant Intellectual Property Management Inc 混合されたタイプのメモリデバイスを動作させるシステムおよび方法
US8738879B2 (en) 2005-09-30 2014-05-27 Conversant Intellectual Property Managament Inc. Independent link and bank selection
JP2014518427A (ja) * 2011-07-01 2014-07-28 インテル・コーポレーション メモリのボリュームの識別子を決定する方法、装置およびシステム
KR101550940B1 (ko) 2010-09-30 2015-09-07 현대자동차주식회사 차량용 엔진룸 박스의 와이어 보호장치
US9240227B2 (en) 2005-09-30 2016-01-19 Conversant Intellectual Property Management Inc. Daisy chain cascading devices
JP2016118979A (ja) * 2014-12-22 2016-06-30 富士通フロンテック株式会社 媒体取扱装置
US11609875B2 (en) 2020-03-27 2023-03-21 Murata Manufacturing Co., Ltd. Data communication device and data communication module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143368A (ja) * 1984-08-06 1986-03-01 Sharp Corp 集積回路
JPH0496840A (ja) * 1990-08-14 1992-03-30 Hitachi Maxell Ltd 半導体ファイルメモリ装置
JPH0695974A (ja) * 1992-09-10 1994-04-08 Fujitsu Ltd メモリ保護方式
JPH07200458A (ja) * 1993-12-17 1995-08-04 Internatl Business Mach Corp <Ibm> メモリ・アクセス装置及びその方法
JPH10161929A (ja) * 1996-11-27 1998-06-19 Hitachi Ltd 電子装置
JPH11120075A (ja) * 1997-10-20 1999-04-30 Toshiba Corp 半導体記憶装置及び半導体記憶システム
JP2000181802A (ja) * 1998-12-11 2000-06-30 Matsushita Electric Ind Co Ltd 半導体記憶装置
JP2000315185A (ja) * 1999-04-30 2000-11-14 Hitachi Ltd 半導体メモリファイルシステム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143368A (ja) * 1984-08-06 1986-03-01 Sharp Corp 集積回路
JPH0496840A (ja) * 1990-08-14 1992-03-30 Hitachi Maxell Ltd 半導体ファイルメモリ装置
JPH0695974A (ja) * 1992-09-10 1994-04-08 Fujitsu Ltd メモリ保護方式
JPH07200458A (ja) * 1993-12-17 1995-08-04 Internatl Business Mach Corp <Ibm> メモリ・アクセス装置及びその方法
JPH10161929A (ja) * 1996-11-27 1998-06-19 Hitachi Ltd 電子装置
JPH11120075A (ja) * 1997-10-20 1999-04-30 Toshiba Corp 半導体記憶装置及び半導体記憶システム
JP2000181802A (ja) * 1998-12-11 2000-06-30 Matsushita Electric Ind Co Ltd 半導体記憶装置
JP2000315185A (ja) * 1999-04-30 2000-11-14 Hitachi Ltd 半導体メモリファイルシステム

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100357904C (zh) * 2005-08-31 2007-12-26 上海海尔集成电路有限公司 一种微控制器配置接口操作方法
US9240227B2 (en) 2005-09-30 2016-01-19 Conversant Intellectual Property Management Inc. Daisy chain cascading devices
JP2012181916A (ja) * 2005-09-30 2012-09-20 Mosaid Technologies Inc 複数の独立したシリアルリンクメモリ
US9230654B2 (en) 2005-09-30 2016-01-05 Conversant Intellectual Property Management Inc. Method and system for accessing a flash memory device
US8654601B2 (en) 2005-09-30 2014-02-18 Mosaid Technologies Incorporated Memory with output control
US8738879B2 (en) 2005-09-30 2014-05-27 Conversant Intellectual Property Managament Inc. Independent link and bank selection
US8743610B2 (en) 2005-09-30 2014-06-03 Conversant Intellectual Property Management Inc. Method and system for accessing a flash memory device
JP2014063523A (ja) * 2006-12-06 2014-04-10 Conversant Intellectual Property Management Inc 混合されたタイプのメモリデバイスを動作させるシステムおよび方法
JP2009164653A (ja) * 2009-04-27 2009-07-23 Renesas Technology Corp マルチチップモジュール
KR101550940B1 (ko) 2010-09-30 2015-09-07 현대자동차주식회사 차량용 엔진룸 박스의 와이어 보호장치
JP2014518427A (ja) * 2011-07-01 2014-07-28 インテル・コーポレーション メモリのボリュームの識別子を決定する方法、装置およびシステム
JP2013146063A (ja) * 2012-01-13 2013-07-25 Altera Corp フレキシブル電子インターフェースのための装置および関連方法
US9647668B2 (en) 2012-01-13 2017-05-09 Altera Corporation Apparatus for flexible electronic interfaces and associated methods
US10063235B2 (en) 2012-01-13 2018-08-28 Altera Corporation Apparatus for flexible electronic interfaces and associated methods
US10797702B2 (en) 2012-01-13 2020-10-06 Altera Corporation Apparatus for flexible electronic interfaces and associated methods
JP2014013252A (ja) * 2013-09-12 2014-01-23 Dainippon Printing Co Ltd 回路板の検査方法、回路板の検査装置
JP2016118979A (ja) * 2014-12-22 2016-06-30 富士通フロンテック株式会社 媒体取扱装置
US11609875B2 (en) 2020-03-27 2023-03-21 Murata Manufacturing Co., Ltd. Data communication device and data communication module

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