JP2002217377A5 - - Google Patents

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Publication number
JP2002217377A5
JP2002217377A5 JP2001010821A JP2001010821A JP2002217377A5 JP 2002217377 A5 JP2002217377 A5 JP 2002217377A5 JP 2001010821 A JP2001010821 A JP 2001010821A JP 2001010821 A JP2001010821 A JP 2001010821A JP 2002217377 A5 JP2002217377 A5 JP 2002217377A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001010821A
Other versions
JP2002217377A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001010821A priority Critical patent/JP2002217377A/ja
Priority claimed from JP2001010821A external-priority patent/JP2002217377A/ja
Priority to US10/046,446 priority patent/US6861742B2/en
Priority to KR1020020002722A priority patent/KR20020062197A/ko
Publication of JP2002217377A publication Critical patent/JP2002217377A/ja
Priority to US10/771,471 priority patent/US6946327B2/en
Publication of JP2002217377A5 publication Critical patent/JP2002217377A5/ja
Pending legal-status Critical Current

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JP2001010821A 2001-01-18 2001-01-18 半導体集積回路装置およびその製造方法 Pending JP2002217377A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001010821A JP2002217377A (ja) 2001-01-18 2001-01-18 半導体集積回路装置およびその製造方法
US10/046,446 US6861742B2 (en) 2001-01-18 2002-01-16 Wafer level chip size package having rerouting layers
KR1020020002722A KR20020062197A (ko) 2001-01-18 2002-01-17 반도체직접회로장치 및 그 제조방법
US10/771,471 US6946327B2 (en) 2001-01-18 2004-02-05 Semiconductor device and manufacturing method of that

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001010821A JP2002217377A (ja) 2001-01-18 2001-01-18 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2002217377A JP2002217377A (ja) 2002-08-02
JP2002217377A5 true JP2002217377A5 (ja) 2006-03-09

Family

ID=18878068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001010821A Pending JP2002217377A (ja) 2001-01-18 2001-01-18 半導体集積回路装置およびその製造方法

Country Status (3)

Country Link
US (2) US6861742B2 (ja)
JP (1) JP2002217377A (ja)
KR (1) KR20020062197A (ja)

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US8476735B2 (en) * 2007-05-29 2013-07-02 Taiwan Semiconductor Manufacturing Company, Ltd. Programmable semiconductor interposer for electronic package and method of forming
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JP5078725B2 (ja) * 2008-04-22 2012-11-21 ラピスセミコンダクタ株式会社 半導体装置
US11131431B2 (en) 2014-09-28 2021-09-28 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
CN102484101A (zh) 2009-08-13 2012-05-30 SKLink株式会社 电路基板及其制造方法
JP5671890B2 (ja) * 2010-08-31 2015-02-18 株式会社ニコン 撮像装置
TWI464857B (zh) * 2011-05-20 2014-12-11 Xintec Inc 晶片封裝體、其形成方法、及封裝晶圓
KR20130054769A (ko) * 2011-11-17 2013-05-27 삼성전기주식회사 반도체 패키지 및 이를 포함하는 반도체 패키지 모듈
JP2013168491A (ja) * 2012-02-15 2013-08-29 Semiconductor Components Industries Llc 半導体装置の製造方法
JP5412552B2 (ja) * 2012-05-28 2014-02-12 ルネサスエレクトロニクス株式会社 半導体装置
TWI506570B (zh) * 2013-08-16 2015-11-01 Nat Univ Tsing Hua 分級產品資源規劃系統及其方法
CN106796892B (zh) * 2014-08-26 2020-06-30 德卡技术股份有限公司 用于包括唯一标识符的封装体的正面封装级别序列化
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US11480305B2 (en) 2014-09-25 2022-10-25 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
US10560989B2 (en) 2014-09-28 2020-02-11 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
CN205979248U (zh) 2014-09-28 2017-02-22 嘉兴山蒲照明电器有限公司 Led直管灯
JP6011595B2 (ja) * 2014-10-27 2016-10-19 株式会社ニコン 撮像素子、及び撮像装置
US10514134B2 (en) 2014-12-05 2019-12-24 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US11519565B2 (en) 2015-03-10 2022-12-06 Jiaxing Super Lighting Electric Appliance Co., Ltd LED lamp and its power source module
US9897265B2 (en) 2015-03-10 2018-02-20 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp having LED light strip
US11028973B2 (en) 2015-03-10 2021-06-08 Jiaxing Super Lighting Electric Appliance Co., Ltd. Led tube lamp
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