JP2002036079A5 - - Google Patents

Download PDF

Info

Publication number
JP2002036079A5
JP2002036079A5 JP2000225441A JP2000225441A JP2002036079A5 JP 2002036079 A5 JP2002036079 A5 JP 2002036079A5 JP 2000225441 A JP2000225441 A JP 2000225441A JP 2000225441 A JP2000225441 A JP 2000225441A JP 2002036079 A5 JP2002036079 A5 JP 2002036079A5
Authority
JP
Japan
Prior art keywords
polishing
polished
holding member
holding
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000225441A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002036079A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000225441A priority Critical patent/JP2002036079A/ja
Priority claimed from JP2000225441A external-priority patent/JP2002036079A/ja
Priority to DE2001136281 priority patent/DE10136281B4/de
Publication of JP2002036079A publication Critical patent/JP2002036079A/ja
Publication of JP2002036079A5 publication Critical patent/JP2002036079A5/ja
Pending legal-status Critical Current

Links

JP2000225441A 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置 Pending JP2002036079A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000225441A JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置
DE2001136281 DE10136281B4 (de) 2000-07-26 2001-07-25 Vorrichtung zum Polieren abgeschrägter Umfangsteile eines Wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000225441A JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置

Publications (2)

Publication Number Publication Date
JP2002036079A JP2002036079A (ja) 2002-02-05
JP2002036079A5 true JP2002036079A5 (https=) 2005-02-03

Family

ID=18719212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000225441A Pending JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置

Country Status (2)

Country Link
JP (1) JP2002036079A (https=)
DE (1) DE10136281B4 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4826013B2 (ja) * 2000-12-21 2011-11-30 株式会社ニコン 研磨装置、半導体ウェハの研磨方法、半導体デバイスの製造方法及び製造装置
WO2002049802A1 (fr) * 2000-12-21 2002-06-27 Nikon Corporation Dispositif et procede de polissage, et procede et dispositif pour produire un dispositif a semiconducteurs
JP4655369B2 (ja) * 2000-12-25 2011-03-23 株式会社ニコン 研磨装置、研磨方法及び半導体デバイスの製造方法
JP5033066B2 (ja) * 2008-06-13 2012-09-26 株式会社Ｂｂｓ金明 ワーク外周部の研磨装置および研磨方法
CN115229602A (zh) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 一种圆片倒角磨削机构及使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
JPH07205001A (ja) * 1993-11-16 1995-08-08 Tokyo Seimitsu Co Ltd ウェーハ面取り機
DE19809697C2 (de) * 1998-03-06 1999-12-23 Thuringia Netzsch Feinkeramik Werkzeug zum Schleifen und Polieren rotationssymmetrischer Ränder hohler keramischer Gegenstände wie Tassen und dergl.

Similar Documents

Publication Publication Date Title
JP3383584B2 (ja) ウエハ状の物品用の支持装置
JPH04346429A (ja) ウエーハ外周の鏡面面取り装置
WO2002053322A3 (en) System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
JP2001345294A5 (https=)
JPH11300589A (ja) ガラス物品の加工仕上げ装置
JP2006179887A (ja) シリコン・オン・インシュレータ搬送ウエハのエッジ除去
WO2003009349A3 (en) Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials
US6146256A (en) Clamping wafer holder for chemical-mechanical planarization machines and method for using it
WO2003022523A1 (en) Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
TW330881B (en) The apparatus & method for shaping a polishing pad & polishing semiconductor wafers
JP2002036079A5 (https=)
JP2006310691A (ja) 折り畳み式フィルムシート拡張方法および折り畳み式フィルムシート用エキスパンダ
EP1050369A3 (en) Method and apparatus for polishing workpieces
AU2001286972A1 (en) Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
CN112786445A (zh) 一种芯片研磨方法
WO2002053320A3 (en) Wafer support for chemical mechanical planarization
KR101508096B1 (ko) 볼밸브의 볼 연마장치
JP2982125B2 (ja) 円板状加工片の研磨方法および当該研磨方法を実施する装置
JPH1133888A (ja) ウェーハの鏡面面取り装置
JP2000334655A (ja) Ｃｍｐ加工装置
JPH09248758A (ja) 薄板ワーク平面研削方法及びその装置
JP2006324417A (ja) ウェーハ研磨装置及びウェーハ研磨方法
JP2001198781A (ja) 基板エッジ部の研磨方法およびその装置
JP2001009710A (ja) ウエーハ研磨装置
US6340327B1 (en) Wafer polishing apparatus and process