JP2002036079A - 被研磨物の研磨方法及び研磨装置 - Google Patents

被研磨物の研磨方法及び研磨装置

Info

Publication number
JP2002036079A
JP2002036079A JP2000225441A JP2000225441A JP2002036079A JP 2002036079 A JP2002036079 A JP 2002036079A JP 2000225441 A JP2000225441 A JP 2000225441A JP 2000225441 A JP2000225441 A JP 2000225441A JP 2002036079 A JP2002036079 A JP 2002036079A
Authority
JP
Japan
Prior art keywords
polishing
polished
holding
workpiece
surface side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000225441A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002036079A5 (https=
Inventor
Shunji Hakomori
駿二 箱守
Seiichi Maeda
誠一 前田
Noriaki Mizuno
憲明 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP2000225441A priority Critical patent/JP2002036079A/ja
Priority to DE2001136281 priority patent/DE10136281B4/de
Publication of JP2002036079A publication Critical patent/JP2002036079A/ja
Publication of JP2002036079A5 publication Critical patent/JP2002036079A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2000225441A 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置 Pending JP2002036079A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000225441A JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置
DE2001136281 DE10136281B4 (de) 2000-07-26 2001-07-25 Vorrichtung zum Polieren abgeschrägter Umfangsteile eines Wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000225441A JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置

Publications (2)

Publication Number Publication Date
JP2002036079A true JP2002036079A (ja) 2002-02-05
JP2002036079A5 JP2002036079A5 (https=) 2005-02-03

Family

ID=18719212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000225441A Pending JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置

Country Status (2)

Country Link
JP (1) JP2002036079A (https=)
DE (1) DE10136281B4 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049802A1 (fr) * 2000-12-21 2002-06-27 Nikon Corporation Dispositif et procede de polissage, et procede et dispositif pour produire un dispositif a semiconducteurs
JP2002187050A (ja) * 2000-12-21 2002-07-02 Nikon Corp 研磨装置、半導体ウェハの研磨方法、半導体デバイスの製造方法及び製造装置
JP2002192446A (ja) * 2000-12-25 2002-07-10 Nikon Corp 研磨装置、研磨方法及び半導体デバイスの製造方法
JP2009297842A (ja) * 2008-06-13 2009-12-24 Bbs Kinmei:Kk ワーク外周部の研磨装置および研磨方法
CN115229602A (zh) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 一种圆片倒角磨削机构及使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
JPH07205001A (ja) * 1993-11-16 1995-08-08 Tokyo Seimitsu Co Ltd ウェーハ面取り機
DE19809697C2 (de) * 1998-03-06 1999-12-23 Thuringia Netzsch Feinkeramik Werkzeug zum Schleifen und Polieren rotationssymmetrischer Ränder hohler keramischer Gegenstände wie Tassen und dergl.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049802A1 (fr) * 2000-12-21 2002-06-27 Nikon Corporation Dispositif et procede de polissage, et procede et dispositif pour produire un dispositif a semiconducteurs
JP2002187050A (ja) * 2000-12-21 2002-07-02 Nikon Corp 研磨装置、半導体ウェハの研磨方法、半導体デバイスの製造方法及び製造装置
JP2002192446A (ja) * 2000-12-25 2002-07-10 Nikon Corp 研磨装置、研磨方法及び半導体デバイスの製造方法
JP2009297842A (ja) * 2008-06-13 2009-12-24 Bbs Kinmei:Kk ワーク外周部の研磨装置および研磨方法
CN115229602A (zh) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 一种圆片倒角磨削机构及使用方法

Also Published As

Publication number Publication date
DE10136281A1 (de) 2002-04-25
DE10136281B4 (de) 2007-06-28

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